Patents by Inventor Keisuke Kamiki
Keisuke Kamiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11958161Abstract: The present invention relates to a polishing apparatus having a surface-property measuring device for measuring surface properties of a polishing pad which is used to polish a substrate, such as semiconductor wafer, and a polishing system including such a polishing apparatus. The polishing apparatus includes a surface-property measuring device (30) for measuring surface properties of a polishing pad (2), a support arm (50) for supporting the surface-property measuring device (30), and a moving unit (53) coupled to the support arm (50) and configured to move the surface-property measuring device (30) from a retreat position to a measure position.Type: GrantFiled: April 25, 2019Date of Patent: April 16, 2024Assignee: EBARA CORPORATIONInventors: Keisuke Kamiki, Toru Maruyama, Yasuyuki Motoshima
-
Patent number: 11897080Abstract: There is disclosed a polishing apparatus which can regulate a surface temperature of the polishing pad without causing a defect such as a scratch on a substrate such as a wafer. The polishing apparatus includes: a non-contact type pad-temperature regulating device; a pad-temperature measuring device. The pad-temperature measuring device is arranged adjacent to the pad-temperature regulating device and on a downstream side of the pad-temperature regulating device in a rotation direction of a polishing table.Type: GrantFiled: October 8, 2020Date of Patent: February 13, 2024Assignee: EBARA CORPORATIONInventors: Masashi Kabasawa, Yasuyuki Motoshima, Hisanori Matsuo, Keisuke Kamiki
-
Patent number: 11898940Abstract: A method of inspecting a leak detection system in a short time is disclosed. The leak detection system includes a leak detection line, an on-off valve, a flow mater, an operation controller configured to detect a fluid leak from a fluid line based on a first flow rate measured by the flow mater, a drain line, and a drain valve attached to the drain line. The inspection method includes: opening the on-off valve and the drain valve, with a supply valve and a return valve closed; measuring a second flow rate of fluid in the leak detection line by the flow mater; and determining that the leak detection system has a defect when the second flow rate is lower than a predetermined reference value.Type: GrantFiled: July 23, 2021Date of Patent: February 13, 2024Assignee: EBARA CORPORATIONInventors: Toru Maruyama, Mitsunori Komatsu, Keisuke Kamiki
-
Patent number: 11839947Abstract: A pad-temperature regulating apparatus is disclosed, which includes a heat exchanger capable of being cleaned in a limited space. A pad-temperature regulating apparatus includes a heat exchanger configured to contact a polishing pad to exchange heat with the polishing pad, a moving mechanism configured to move the heat exchanger between a temperature regulating position where the heat exchanger can exchange heat with the polishing pad, and a retreat position located on a side of the polishing pad, and a cleaning mechanism configured to clean the heat exchanger moved to the retreat position. The heat exchanger has an approximate triangular shape in a horizontal cross-section, and a longest side of the heat exchanger faces the polishing pad when the heat exchanger is moved to the retreat position.Type: GrantFiled: March 10, 2022Date of Patent: December 12, 2023Assignee: EBARA CORPORATIONInventors: Keisuke Kamiki, Toru Maruyama, Yasuyuki Motoshima
-
Publication number: 20220305617Abstract: A pad-temperature regulating apparatus is disclosed, which includes a heat exchanger capable of being cleaned in a limited space. A pad-temperature regulating apparatus includes a heat exchanger configured to contact a polishing pad to exchange heat with the polishing pad, a moving mechanism configured to move the heat exchanger between a temperature regulating position where the heat exchanger can exchange heat with the polishing pad, and a retreat position located on a side of the polishing pad, and a cleaning mechanism configured to clean the heat exchanger moved to the retreat position. The heat exchanger has an approximate triangular shape in a horizontal cross-section, and a longest side of the heat exchanger faces the polishing pad when the heat exchanger is moved to the retreat position.Type: ApplicationFiled: March 10, 2022Publication date: September 29, 2022Inventors: Keisuke KAMIKI, Toru MARUYAMA, Yasuyuki MOTOSHIMA
-
Patent number: 11383345Abstract: A cleaning apparatus capable of effectively removing dirt attached to a bottom surface of a heat exchanger, is disclosed. The cleaning apparatus cleans the heat exchanger for regulating a surface temperature of a polishing pad. This cleaning apparatus includes: a moving mechanism configured to move the heat exchanger between a temperature-regulating position in which the heat exchanger can exchange heat with the polishing pad, and a retreat position in which the heat exchanger is separated from a surface of the polishing pad; and a cleaning mechanism configured to clean a bottom surface of the heat exchanger moved to the retreat position The retreat position is located on a side of the polishing pad. The cleaning mechanism includes at least one cleaning nozzle for ejecting a cleaning liquid to the bottom surface of the heat exchanger, or a cleaning tank in which the bottom surface of the heat exchanger can be immersed.Type: GrantFiled: March 19, 2020Date of Patent: July 12, 2022Assignee: EBARA CORPORATIONInventors: Yasuyuki Motoshima, Toru Maruyama, Keisuke Kamiki, Shuji Uozumi
-
Publication number: 20220212312Abstract: The present invention relates to a temperature regulating apparatus for regulating a temperature of a polishing surface of a polishing pad used for polishing a substrate, such as a wafer. The present invention further relates to a polishing apparatus including such a temperature regulating apparatus. The temperature regulating apparatus (5) includes: a heat exchanger (11) having a heating flow passage (61) and a cooling flow passage (62) formed therein; a holder (90) arranged over the heat exchanger (11); a coupling mechanism (80) configured to detachably fix the heat exchanger (11) to the holder (90), the coupling mechanism (80) including: a first hook (73) fixed to an upper surface of the heat exchanger (11); and a second hook (83) held by the holder (90). The second hook (83) is configured to be able to be engaged with and disengaged from the first hook (73).Type: ApplicationFiled: May 20, 2020Publication date: July 7, 2022Inventors: Keisuke Kamiki, Toru Maruyama, Yasuyuki Motoshima
-
Publication number: 20220034745Abstract: A method of inspecting a leak detection system in a short time is disclosed. The leak detection system includes a leak detection line, an on-off valve, a flow mater, an operation controller configured to detect a fluid leak from a fluid line based on a first flow rate measured by the flow mater, a drain line, and a drain valve attached to the drain line. The inspection method includes: opening the on-off valve and the drain valve, with a supply valve and a return valve closed; measuring a second flow rate of fluid in the leak detection line by the flow mater; and determining that the leak detection system has a defect when the second flow rate is lower than a predetermined reference value.Type: ApplicationFiled: July 23, 2021Publication date: February 3, 2022Inventors: Toru Maruyama, Mitsunori Komatsu, Keisuke Kamiki
-
Publication number: 20210370461Abstract: The present invention relates to a polishing apparatus having a surface-property measuring device for measuring surface properties of a polishing pad which is used to polish a substrate, such as semiconductor wafer, and a polishing system including such a polishing apparatus. The polishing apparatus includes a surface-property measuring device (30) for measuring surface properties of a polishing pad (2), a support arm (50) for supporting the surface-property measuring device (30), and a moving unit (53) coupled to the support arm (50) and configured to move the surface-property measuring device (30) from a retreat position to a measure position.Type: ApplicationFiled: April 25, 2019Publication date: December 2, 2021Inventors: Keisuke KAMIKI, Toru MARUYAMA, Yasuyuki MOTOSHIMA
-
Publication number: 20210114164Abstract: There is disclosed a polishing apparatus which can regulate a surface temperature of the polishing pad without causing a defect such as a scratch on a substrate such as a wafer. The polishing apparatus includes: a non-contact type pad-temperature regulating device; a pad-temperature measuring device. The pad-temperature measuring device is arranged adjacent to the pad-temperature regulating device and on a downstream side of the pad-temperature regulating device in a rotation direction of a polishing table.Type: ApplicationFiled: October 8, 2020Publication date: April 22, 2021Inventors: Masashi KABASAWA, Yasuyuki MOTOSHIMA, Hisanori MATSUO, Keisuke KAMIKI
-
Publication number: 20200306920Abstract: A cleaning apparatus capable of effectively removing dirt attached to a bottom surface of a heat exchanger, is disclosed. The cleaning apparatus cleans the heat exchanger for regulating a surface temperature of a polishing pad. This cleaning apparatus includes: a moving mechanism configured to move the heat exchanger between a temperature-regulating position in which the heat exchanger can exchange heat with the polishing pad, and a retreat position in which the heat exchanger is separated from a surface of the polishing pad; and a cleaning mechanism configured to clean a bottom surface of the heat exchanger moved to the retreat position The retreat position is located on a side of the polishing pad. The cleaning mechanism includes at least one cleaning nozzle for ejecting a cleaning liquid to the bottom surface of the heat exchanger, or a cleaning tank in which the bottom surface of the heat exchanger can be immersed.Type: ApplicationFiled: March 19, 2020Publication date: October 1, 2020Inventors: Yasuyuki Motoshima, Toru Maruyama, Keisuke Kamiki, Shuji Uozumi
-
Publication number: 20190389030Abstract: A method of checking a leakage of fluid from a fluid line includes connecting a leakage checking line to the fluid line between a supply valve and a return valve, regulating a pressure regulator disposed in the leakage checking line such that a pressure of fluid of the leakage checking line becomes the same as a pressure of fluid of the fluid line; closing the supply valve and the return valve and opening an opening/closing valve disposed in the leakage checking line; acquiring a flow rate of the fluid that flows in the leakage checking line by a flowmeter disposed in the leakage checking line; comparing the flow rate of the fluid acquired at the acquiring with a predetermined threshold; and determining that the fluid of the fluid line is leaked, when the flow rate of the fluid acquired at the acquiring is larger than the predetermined threshold.Type: ApplicationFiled: June 24, 2019Publication date: December 26, 2019Inventors: Toru Maruyama, Yasuyuki Motoshima, Shuji Uozumi, Keisuke Kamiki, Misunori Komatsu
-
Publication number: 20190308293Abstract: A method capable of precisely regulating a surface temperature of a polishing pad is disclosed. The method includes: determining a heating-side manipulation range by removing a dead band of a first flow-rate control valve from a range of manipulated variable for the first flow-rate control valve; setting a first manipulated variable, selected from the heating-side manipulation range, to the first flow-rate control valve; determines a cooling-side manipulation range by removing a dead band of a second flow-rate control valve from a range of manipulated variable for the second flow-rate control valve; setting a second manipulated variable, selected from the cooling-side manipulation range, to the second flow-rate control valve; and supplying a heating fluid and a cooling fluid that have passed through the flow-rate control valves to a heat exchanger to regulate a surface temperature of a polishing pad.Type: ApplicationFiled: April 3, 2019Publication date: October 10, 2019Inventors: Keisuke Kamiki, Mitsunori Komatsu, Masashi Kabasawa