Abstract: Provided is a silicone rubber molded body (1) including a conductive ink coating layer (3) that is disposed on a portion of the surface of the silicone rubber molded body (1). The conductive ink coating layer (3) contains a hydrolyzable organosilicon compound. Using the silicone rubber molded body with a saturated water absorption of 0.10 to 1.50% by mass and/or using a conductive ink containing water improves the affinity between the surface of the silicone rubber molded body (1) and the conductive ink coating layer (3). A residual ink area is an average of 20% or more and 100% or less after the conductive ink coating layer (3) is subjected to an abrasion test. With this configuration, the silicone rubber molded body has a high affinity between the silicone rubber and the conductive ink, good durability under continuous stress, and stability in long-term use. Further provided is a method for producing the silicone rubber molded body.

Abstract: Provided is a silicone rubber molded body (1) including a conductive ink coating layer (3) that is disposed on a portion of the surface of the silicone rubber molded body (1). The conductive ink coating layer (3) contains a hydrolyzable organosilicon compound. Using the silicone rubber molded body with a saturated water absorption of 0.10 to 1.50% by mass and/or using a conductive ink containing water improves the affinity between the surface of the silicone rubber molded body (1) and the conductive ink coating layer (3). A residual ink area is an average of 20% or more and 100% or less after the conductive ink coating layer (3) is subjected to an abrasion test. With this configuration, the silicone rubber molded body has a high affinity between the silicone rubber and the conductive ink, good durability under continuous stress, and stability in long-term use. Further provided is a method for producing the silicone rubber molded body.

Abstract: A composition of the present invention contains the following components A to C: A. a linear terminal-reactive polydimethylsiloxane; B. a thermally conductive filler including the following B1, B2, and B3 in an amount of 800 to 2500 parts by mass with respect to 100 parts by mass of the component A; and C. a curing catalyst in a catalytic amount. The component B includes the following: B1. a thermally conductive filler that has an average particle size of 0.1 to 1.0 ?m and is surface treated with a surface treatment agent containing a reactive group having no unsaturated bond; B2. a thermally conductive filler that has an average particle size of 1.0 to 10 ?m and is surface treated with a surface treatment agent containing a reactive group having an unsaturated bond; and B3.