Patents by Inventor Keisuke Nishio
Keisuke Nishio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240127635Abstract: A vehicle system includes: an in-vehicle device configured to communicate with a cloud server configured to manage vehicle data; and an expansion unit that is detachably attached to the in-vehicle device. The expansion unit includes: an input line for each communication protocol of input data; an output line for each communication protocol of output data; a connector for connecting the output line to the in-vehicle device; and a processing unit configured to perform processing on input data and cause the output line to output the output data. The in-vehicle device includes: a controller configured to generate the vehicle data based on the received output data; and a communication unit configured to transmit the vehicle data.Type: ApplicationFiled: December 27, 2023Publication date: April 18, 2024Inventors: Masatoshi KOMIYAMA, Keisuke NISHIO, Shigeru KAJIOKA, Makiko TAUCHI
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Publication number: 20240127637Abstract: By a data processing method or a communication system, input data is acquired, first processing that is processing of reducing a data amount of the input data is performed, second processing of converting data obtained by the first processing into data having a preset format configured to be handled by an in-vehicle device unit is performed, third processing of converting data obtained by the second processing into normalization data configured to be handled by a cloud server is performed, and vehicle data is provided to the cloud server.Type: ApplicationFiled: December 27, 2023Publication date: April 18, 2024Inventors: Masatoshi Komiyama, Keisuke Nishio, Shigeru Kajioka, Makiko Tauchi
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Publication number: 20230402996Abstract: To suppress degradation of characteristics, a high frequency module includes a mounting substrate, a first signal terminal, a second signal terminal, and ground terminals, and a hybrid filter. The hybrid filter is coupled between the first signal terminal and the second signal terminal. The hybrid filter includes an acoustic wave filter having at least one acoustic wave resonator, a first inductor, and a capacitor. The pass band width of the hybrid filter is larger than that of the acoustic wave resonator. A resin layer is disposed on a first principal surface of the mounting substrate. The resin layer covers at least part of the acoustic wave filter. A metal electrode layer covers at least part of the resin layer, and is coupled to the ground terminals. The second inductor is coupled between the hybrid filter and the second signal terminal.Type: ApplicationFiled: August 29, 2023Publication date: December 14, 2023Inventors: Keisuke NISHIO, Masanori KATO, Syunsuke KIDO
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Publication number: 20230281760Abstract: In an image noise reduction process using a CNN, noise can be reduced effectively irrespective of signal levels and noise levels of the image. Noise information and signal level information are calculated from an image inputted in the CNN. Using the calculated information, a normalization factor suitable for the CNN is determined, and normalization of the input image is performed. The noise information is estimated from magnitude of background noise of the input image in the case where the input image is an MRI image. The signal information can be calculated, for example, as a mean value of pixel values of a subject region with respect to an image obtained by dividing the input image by the magnitude of the background noise.Type: ApplicationFiled: February 21, 2023Publication date: September 7, 2023Inventors: Atsuro Suzuki, Tomoki Amemiya, Yukio Kaneko, Toru Shirai, Keisuke Nishio
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Publication number: 20230142011Abstract: Provided is a method for performing reconstruction and noise removal with high accuracy on various undersampling patterns including equidistant undersampling. An image processing unit that processes measurement data acquired by an MRI apparatus performs image reconstruction by using measurement data on respective channels measured in a predetermined undersampling pattern and sensitivity distributions of respective reception coils. At this time, denoising of a reconstructed image and a calculation for maintaining consistency between original measurement data and the measurement data on the respective channels created from denoised images are sequentially processed. Accordingly, image restoration and denoising with high accuracy are possible without depending on the undersampling pattern.Type: ApplicationFiled: October 20, 2022Publication date: May 11, 2023Inventors: Tomoki Amemiya, Toru Shirai, Atsuro Suzuki, Yukio Kaneko, Hiroki Shoji, Keisuke Nishio
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Publication number: 20230112175Abstract: In a radio-frequency module, a hybrid filter includes an acoustic wave filter including at least one acoustic wave resonator, an inductor having a winding portion, and a capacitor. A plurality of outer electrodes of the acoustic wave filter includes a first input and output electrode connected to a first signal terminal, a second input and output electrode connected to a second signal terminal, and a ground electrode connected to a ground terminal. The inductor is disposed on a first major surface of a mounting substrate and is adjacent to the acoustic wave filter in plan view in a thickness direction of the mounting substrate. When viewed in a direction of a winding axis of the winding portion of the inductor, an inner part of the winding portion in the inductor does not overlap any of the first input and output electrode, the second input and output electrode, and ground electrode.Type: ApplicationFiled: August 11, 2022Publication date: April 13, 2023Inventors: Keisuke NISHIO, Yukiteru SUGAYA, Masaki TADA, Masanori KATO, Syunsuke KIDO, Hiroshi MATSUBARA
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Patent number: 11579231Abstract: To provide a technique in which, in imaging using an EPI method, an occurrence of an artifact when phase correction is performed for each channel is avoided and the phase correction is accurately performed. A common phase correction value to be applied to data of all channels is calculated using pre-scan data of each channel. The common phase correction value is obtained by combining a difference phase obtained for each of the channels. The difference phase is obtained by complex integration, while an absolute value of each channel is maintained as it is. The combination is performed by complex average, and averaging processing according to a weight of the absolute value is performed. The occurrence of an artifact can be prevented by using the common phase correction value, and robust phase correction can be performed by including the weight of the absolute value.Type: GrantFiled: December 20, 2021Date of Patent: February 14, 2023Assignee: FUJIFILM Healthcare CorporationInventors: Ryota Satoh, Keisuke Nishio, Yasuhiro Kamada, Yoshitaka Sato, Masahiro Takizawa, Toru Shirai
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Publication number: 20220221543Abstract: To provide a technique in which, in imaging using an EPI method, an occurrence of an artifact when phase correction is performed for each channel is avoided and the phase correction is accurately performed. A common phase correction value to be applied to data of all channels is calculated using pre-scan data of each channel. The common phase correction value is obtained by combining a difference phase obtained for each of the channels. The difference phase is obtained by complex integration, while an absolute value of each channel is maintained as it is. The combination is performed by complex average, and averaging processing according to a weight of the absolute value is performed. The occurrence of an artifact can be prevented by using the common phase correction value, and robust phase correction can be performed by including the weight of the absolute value.Type: ApplicationFiled: December 20, 2021Publication date: July 14, 2022Inventors: Ryota SATOH, Keisuke NISHIO, Yasuhiro KAMADA, Yoshitaka SATO, Masahiro TAKIZAWA, Toru SHIRAI
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Publication number: 20220052666Abstract: A filter device having a pass band and a stop band on a lower frequency side than the pass band includes a filter having a pass band including the pass band, a series arm resonator connected in series to the filter, a first inductor directly connected in series to the series arm resonator, and a parallel arm resonator connected between a node on a path connecting the filter and the series arm resonator and the ground. The parallel arm resonator constitutes a resonance circuit having a resonant frequency at which an attenuation pole corresponding to a high frequency end of the first stop band, and the series arm resonator and the inductor constitute a resonance circuit having an anti-resonant frequency on a lower frequency side than the pass band and having a sub-resonant frequency higher than a resonant frequency of the resonance circuit.Type: ApplicationFiled: October 27, 2021Publication date: February 17, 2022Inventors: Keisuke NISHIO, Syunsuke KIDO, Masanori KATO, Hiroshi MATSUBARA
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Publication number: 20220006443Abstract: A filter includes first and second input/output terminals; an LC parallel resonance circuit that includes an inductor L1 and a capacitor C1 connected to each other in parallel; and an acoustic wave series resonance circuit that includes series arm resonators s1 and s2 connected to each other in series. The LC parallel resonance circuit and the acoustic wave series resonance circuit are connected to each other in series between the first input/output terminal and the second input/output terminal.Type: ApplicationFiled: June 25, 2021Publication date: January 6, 2022Inventor: Keisuke NISHIO
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Patent number: 11190163Abstract: A filter device having a pass band and a stop band on a lower frequency side than the pass band includes a filter having a pass band including the pass band, a series arm resonator connected in series to the filter, a first inductor directly connected in series to the series arm resonator, and a parallel arm resonator connected between a node on a path connecting the filter and the series arm resonator and the ground. The parallel arm resonator constitutes a resonance circuit having a resonant frequency at which an attenuation pole corresponding to a high frequency end of the first stop band, and the series arm resonator and the inductor constitute a resonance circuit having an anti-resonant frequency on a lower frequency side than the pass band and having a sub-resonant frequency higher than a resonant frequency of the resonance circuit.Type: GrantFiled: November 25, 2019Date of Patent: November 30, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Keisuke Nishio, Syunsuke Kido, Masanori Kato, Hiroshi Matsubara
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Publication number: 20200177154Abstract: A filter device having a pass band and a stop band on a lower frequency side than the pass band includes a filter having a pass band including the pass band, a series arm resonator connected in series to the filter, a first inductor directly connected in series to the series arm resonator, and a parallel arm resonator connected between a node on a path connecting the filter and the series arm resonator and the ground. The parallel arm resonator constitutes a resonance circuit having a resonant frequency at which an attenuation pole corresponding to a high frequency end of the first stop band, and the series arm resonator and the inductor constitute a resonance circuit having an anti-resonant frequency on a lower frequency side than the pass band and having a sub-resonant frequency higher than a resonant frequency of the resonance circuit.Type: ApplicationFiled: November 25, 2019Publication date: June 4, 2020Inventors: Keisuke NISHIO, Syunsuke KIDO, Masanori KATO, Hiroshi MATSUBARA
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Patent number: 9723731Abstract: A vehicular electronic device has a semiconductor package and a multilayer wiring board. An electrode pad of the multilayer wiring board, to which a signal terminal of the semiconductor package is soldered, has a wiring pattern in an inner layer of the multilayer wiring board. A solder resist is applied and spaced from a periphery of the electrode pad to the exterior. The signal terminal is soldered to the electrode pad to cover an upper surface and an upper end of a side surface of the electrode pad. As a result, a crack is less likely to occur in solder connected to the signal terminal. Therefore, the signal terminal can be electrically connected with high reliability even when the signal terminal is provided in the semiconductor package with a small number.Type: GrantFiled: April 3, 2014Date of Patent: August 1, 2017Assignee: DENSO CORPORATIONInventors: Hiroaki Ando, Kiminobu Inayoshi, Tetsuichi Takeuchi, Naoto Makino, Tetsuya Sueyoshi, Kenichi Katoh, Keisuke Nishio
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Publication number: 20160356619Abstract: A vehicle navigation apparatus comprises: a recording medium reproduction portion that reproduces a recording medium to which image data and audio data are recorded; a CPU that performs a navigation function, processes the image data, and allows a display portion to display the image data; a sampling rate conversion IC that converts a sampling rate of the audio data; an encryption IC that encrypts the audio data; and an audio output portion that outputs the audio data outside the vehicle navigation apparatus. The recording medium reproduction portion outputs the audio data in two types of signal forms. The CPU performs a conversion process on the audio data having a lower data throughput, and outputs processed data to the encryption IC. The sampling rate conversion IC performs a sampling rate conversion process on the audio data having a higher data throughput, and outputs processed data to the encryption IC.Type: ApplicationFiled: January 29, 2015Publication date: December 8, 2016Inventor: Keisuke NISHIO
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Publication number: 20160066439Abstract: A vehicular electronic device has a semiconductor package and a multilayer wiring board. An electrode pad of the multilayer wiring board, to which a signal terminal of the semiconductor package is soldered, has a wiring pattern in an inner layer of the multilayer wiring board. A solder resist is applied and spaced from a periphery of the electrode pad to the exterior. The signal terminal is soldered to the electrode pad to cover an upper surface and an upper end of a side surface of the electrode pad. As a result, a crack is less likely to occur in solder connected to the signal terminal. Therefore, the signal terminal can be electrically connected with high reliability even when the signal terminal is provided in the semiconductor package with a small number.Type: ApplicationFiled: April 3, 2014Publication date: March 3, 2016Inventors: Hiroaki ANDO, Kiminobu INAYOSHI, Tetsuichi TAKEUCHI, Naoto MAKINO, Tetsuya SUEYOSHI, Kenichi KATOH, Keisuke NISHIO
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Patent number: 9220079Abstract: A signal analysis device includes a synchronization data generation unit, a synchronization correction value calculation unit, and a correction unit. The synchronization unit outputs an A/D-converted correction signal as first synchronization data. The first synchronization data is associated with time based on the timing of a trigger signal input from the outside. The synchronization correction value calculation unit calculates, as a first synchronization correction value, an amplitude ratio, a phase difference, and a time difference between the first synchronization data and second synchronization data input from the outside on the basis of the first synchronization data and the second synchronization data. The correction unit corrects the amplitude, phase, and timing of the RF signal output from the object to be measured, on the basis of the first synchronization correction value or a second synchronization correction value input from the outside.Type: GrantFiled: July 3, 2014Date of Patent: December 22, 2015Assignee: ANRITSU CORPORATIONInventors: Shinichi Ito, Go Inoue, Jun Ono, Keisuke Nishio, Yuki Kondo
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Publication number: 20150092826Abstract: The signal analysis device includes a synchronization data generation unit 19a that outputs an A/D-converted correction signal as first synchronization data which is associated with time based on the timing of a trigger signal input from the outside, a synchronization correction value calculation unit 19c that calculates, as a first synchronization correction value, an amplitude ratio, a phase difference, and a time difference between the first synchronization data and second synchronization data input from the outside on the basis of the first synchronization data and the second synchronization data, and a correction unit 19d that corrects the amplitude, phase, and timing of the RF signal output from the object to be measured, on the basis of the first synchronization correction value or a second synchronization correction value input from the outside.Type: ApplicationFiled: July 3, 2014Publication date: April 2, 2015Inventors: Shinichi ITO, Go INOUE, Jun ONO, Keisuke NISHIO, Yuki KONDO
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Patent number: 8262488Abstract: A silicone boot for a constant velocity universal joint includes a larger diameter portion attached to an outer joint member of a constant velocity universal joint, a smaller diameter portion attached to a shaft coupled with an inner joint member of the constant velocity universal joint, and a bellows portion, which is arranged between the larger diameter portion and the smaller diameter portion, and has peak portions and valley portions formed alternately with each other. The smaller diameter portion includes a shaft attachment portion having a radially outer surface in which a fitting groove for attachment of a boot band is formed, and a thin portion extending from the shaft attachment portion so as to be coupled with the bellows portion through intermediation of a thick portion and allowing buckling deformation with respect to the shaft attachment portion and the bellows portion.Type: GrantFiled: August 7, 2008Date of Patent: September 11, 2012Assignee: NTN CorporationInventors: Atsuto Takemura, Yukihiro Watanabe, Mikio Tomiyama, Shintaro Harada, Keisuke Nishio
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Patent number: 8187110Abstract: A boot-mounting structure for a constant velocity universal joint has a configuration which can prevent a crack caused by interference with a boot band while maintaining a stable sealing property. The boot band (69) is fitted into a fitting groove of a silicone boot (65), and is decreased in diameter while being attached into the fitting groove, to thereby fix the silicone boot (65). The boot band (69) is formed into an annular body not provided with a folded-back portion. There is provided a no-interference structure means (S) for preventing interference caused, when the boot band is decreased in diameter, between an axial outer-peripheral-edge portion (69a or 69b) of the band (69) and a bottom end portion (82a or 82b) of the fitting groove (75) corresponding thereto.Type: GrantFiled: October 15, 2008Date of Patent: May 29, 2012Assignee: NTN CorporationInventors: Yukihiro Watanabe, Keisuke Nishio
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Patent number: 7909702Abstract: A shaft mounting structure of a constant velocity joint is capable of ensuring sufficient strength of a fitting portion between an inner ring and a shaft. In the shaft mounting structure, a groove is formed on the shaft middle side compared to the position of a male spline of a shaft and the outside diameter of a bottom portion of the groove is set at a value larger than the root diameter of the male spline.Type: GrantFiled: December 5, 2007Date of Patent: March 22, 2011Assignee: NTN CorporationInventor: Keisuke Nishio