Abstract: A high frequency filter A1 has frequency characteristics such that the amount of attenuation for an input electrical signal is smaller in a first frequency band f1 than in a second frequency band f2. The high frequency filter A1 is provided with a dielectric elastomer transducer 1 that includes a dielectric elastomer layer 13 and a pair of electrode layers 14 sandwiching the dielectric elastomer layer 13. The frequency characteristics are variable by the dielectric elastomer transducer 1. This configuration provides a high frequency filter having frequency characteristics that are variable and suitable for a lightweight and compact configuration.

Abstract: A non-thermoplastic polyimide film contains non-thermoplastic polyimide. The non-thermoplastic polyimide has a 3,3?,4,4?-biphenyltetracarboxylic dianhydride residue, a 4,4?-oxydiphthalic anhydride residue, a p-phenylenediamine residue and a 1,3-bis(4-aminophenoxy)benzene residue. Where the content ratio of the 3,3?,4,4?-biphenyltetracarboxylic dianhydride residue is A1 mol %, the content ratio of the 4,4?-oxydiphthalic anhydride residue is A2 mol %, the content ratio of the p-phenylenediamine residue is B1 mol %, and the content ratio of the 1,3-bis(4-aminophenoxy)benzene residue is B2 mol %, the relationships of A1+A2?80, B1+B2?80 and (A1+B1)/(A2+B2)?3.50 are satisfied.

Abstract: A high frequency filter A1 has frequency characteristics such that the amount of attenuation for an input electrical signal is smaller in a first frequency band f1 than in a second frequency band f2. The high frequency filter A1 is provided with a dielectric elastomer transducer 1 that includes a dielectric elastomer layer 13 and a pair of electrode layers 14 sandwiching the dielectric elastomer layer 13. The frequency characteristics are variable by the dielectric elastomer transducer 1. This configuration provides a high frequency filter having frequency characteristics that are variable and suitable for a lightweight and compact configuration.

Abstract: The antenna device A1 includes an antenna 1 configured to transmit and/or receive radio waves, and a dielectric elastomer drive element 2 including a dielectric elastomer layer 21 and a pair of electrode layers 22 sandwiching the dielectric elastomer layer 21. The dielectric elastomer drive element is capable of changing an antenna characteristic of the antenna 1. With such a configuration, the antenna device can be made smaller and lighter while improving its antenna characteristics.

Abstract: The present disclosure provides a low dielectric resin composition having good melt processability and excellent low dielectric characteristics in a high frequency band as compared to low dielectric materials such as liquid crystal polymers. A molded article and a film, each of which is formed from the low dielectric resin composition, a multilayer film obtained by superposing a metal foil on at least one main surface of the film, and a flexible printed wiring board which includes the film are also provided. The present disclosure includes, as a low dielectric resin composition, a resin composition which contains (A) a liquid crystal polymer and (B) a graft-modified polyolefin having a polar group. The low dielectric resin composition has a dielectric constant of 2.80 or less at a frequency of 10 GHz and a dielectric loss tangent of 0.0025 or less at a frequency of 10 GHz.

Abstract: The present invention provides a heat dissipation structure that does not cause problems such as contact failures in electronic components and that is applicable to electronic components with high heat densities. The present invention also provides a method for easily repairing an electronic device. The heat dissipation structure is obtained by filling and curing a thermally conductive curable resin composition in an electromagnetic shielding case on a substrate on which an electronic component with a heat density of 0.2 W/cm2 to 500 W/cm2 is mounted, the thermally conductive curable resin composition containing a curable liquid resin (I) and a thermally conductive filler (II), having a viscosity at 23° C. of 30 Pa·s to 3000 Pa·s and a thermal conductivity of 0.5 W/(m·K) or more, and being curable by moisture or heat.

Abstract: A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.

Abstract: A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.

Abstract: A heat dissipation structure including: (A) a printed circuit board; (B) a heat-generating element; (C) an electromagnetic shielding case; (D) a rubbery, thermally conductive resin layer with a tensile elastic modulus of 50 MPa or lower and a thermal conductivity of 0.5 W/mK or higher; and (E) a thermally non-conductive layer with a thermal conductivity of lower than 0.5 W/mK, the heat-generating element (B) being placed on the printed circuit board (A), the heat-generating element (B) and the thermally conductive resin layer (D) being in contact with each other, the thermally non-conductive layer (E) being provided between the heat-generating element (B) and the electromagnetic shielding case (C).

Abstract: The present invention provides a heat dissipation structure that does not cause problems such as contact failures in electronic components and that is applicable to electronic components with high heat densities. The present invention also provides a method for easily repairing an electronic device. The heat dissipation structure is obtained by filling and curing a thermally conductive curable resin composition in an electromagnetic shielding case on a substrate on which an electronic component with a heat density of 0.2 W/cm2 to 500 W/cm2 is mounted, the thermally conductive curable resin composition containing a curable liquid resin (I) and a thermally conductive filler (II), having a viscosity at 23° C. of 30 Pa·s to 3000 Pa·s and a thermal conductivity of 0.5 W/(m·K) or more, and being curable by moisture or heat.