Abstract: A method for evaluating pickup property of a dicing/die-bonding integrated film including a base layer, an adhesive, and a bonding adhesive layer in order, the method including preparing a laminate including the dicing/die-bonding integrated film and a wafer having a thickness of 10 to 100 ?m laminated on the bonding adhesive layer, singulating the wafer into a plurality of chips having an area of 9 mm2 or less, pushing a center portion of the chip from a side of the base layer, and measuring a peeling strength when an edge of the chip is peeled off from the adhesive layer.

Abstract: A method for producing a fused silica envelope for use in a discharge lamp in which the inner surface of a fused silica tube is coated with a formulation containing titanium alcoholate and the coating treated by the steps including baking at a temperature of at least 1720.degree. C. to cause TiO.sub.2 to diffuse into the tube. The method results in a Ti concentration in a range of 1 .mu.m-10 .mu.m from the inner surface of the wall of the envelope is 0.5%-7% in terms of TiO.sub.2 and the product of the overall average Ti concentration and the thickness of the wall of the envelope ranges from 3.7% .mu.m to 42% .mu.m. During the baking step, the tube is shaped to include a bulb-like portion by inflating the silica tube.