Patents by Inventor Keisuke Shiozaki

Keisuke Shiozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11951728
    Abstract: A fiber-reinforced plastic molded body includes: a laminated body having a configuration of laminating a sandwich structure member obtained by laminating one layer or two or more layers of a unidirectional fiber-reinforced resin constituted from a unidirectional continuous fiber and a matrix resin on both surfaces of a core layer and one layer or two or more layers of a woven fiber-reinforced resin constituted from a woven fiber and a matrix resin such that the one layer or two or more layers of a woven fiber-reinforced resin are disposed on the design surface side of the unidirectional fiber-reinforced resin; and the resin member is not substantially exposed in a projection plane from the woven fiber-reinforced resin side.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: April 9, 2024
    Assignee: Toray Industries, Inc.
    Inventors: Keisuke Shiozaki, Kenya Okada, Yuji Fukunishi
  • Patent number: 11833803
    Abstract: A fiber reinforced plastic molded body includes a layered body, a resin member, unidirectional fiber reinforced resins each constituted from a unidirectional continuous fiber, a matrix resin, and a woven fabric fiber reinforced resin of one or two or more layers, wherein when the layered body is divided into equal halves in its thickness direction, an amount of the resin member present in a region (R1) which is a side from a dividing center line whereon the woven fabric fiber reinforced resin is layered is referred to as Am1, and an amount of the resin member present in a region (R2) which is a side whereon the woven fabric fiber reinforced resin is not layered is referred to as Am2, Am2/Am1 is 2 to 25.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: December 5, 2023
    Assignee: Toray Industries, Inc.
    Inventors: Keisuke Shiozaki, Hiroyuki Nakayama, Kosuke Shiho
  • Publication number: 20230339206
    Abstract: A fiber-reinforced plastic molded body includes: a laminated body having a configuration of laminating a sandwich structure member obtained by laminating one layer or two or more layers of a unidirectional fiber-reinforced resin constituted from a unidirectional continuous fiber and a matrix resin on both surfaces of a core layer and one layer or two or more layers of a woven fiber-reinforced resin constituted from a woven fiber and a matrix resin such that the one layer or two or more layers of a woven fiber-reinforced resin are disposed on the design surface side of the unidirectional fiber-reinforced resin; and the resin member is not substantially exposed in a projection plane from the woven fiber-reinforced resin side.
    Type: Application
    Filed: March 11, 2021
    Publication date: October 26, 2023
    Inventors: Keisuke Shiozaki, Kenya Okada, Yuji Fukunishi
  • Publication number: 20220168993
    Abstract: A fiber reinforced plastic molded body includes a layered body, a resin member, unidirectional fiber reinforced resins each constituted from a unidirectional continuous fiber, a matrix resin, and a woven fabric fiber reinforced resin of one or two or more layers, wherein when the layered body is divided into equal halves in its thickness direction, an amount of the resin member present in a region (R1) which is a side from a dividing center line whereon the woven fabric fiber reinforced resin is layered is referred to as Am1, and an amount of the resin member present in a region (R2) which is a side whereon the woven fabric fiber reinforced resin is not layered is referred to as Am2, Am2/Am1 is 2 to 25.
    Type: Application
    Filed: February 25, 2020
    Publication date: June 2, 2022
    Inventors: Keisuke Shiozaki, Hiroyuki Nakayama, Kosuke Shiho
  • Patent number: 11110685
    Abstract: An integrally molded body has a bonding resin (C) interposed between a board (A) and a member (B), one surface of the board being a design surface, wherein: inside the member (B), a first bonding section disposed to space apart the board (A) and the member (B) and by which at least a partial region of an outer peripheral edge section of the board (A) bonds to the bonding resin (C), is provided; and at least at a part of the design surface-side surface of the integrally molded body, a region where the board (A), the member (B), and the bonding resin (C) are exposed is provided. A plurality of structures can be bonded with high bonding strength and allows for the bonding boundary thereof to have favorable smoothness, thereby making it possible to mitigate warping and reduce weight and thickness even when the molded body has a board constituent member.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: September 7, 2021
    Assignee: Toray Industries, Inc.
    Inventors: Hideaki Sasaki, Yuki Takahashi, Keisuke Shiozaki
  • Publication number: 20190389174
    Abstract: An integrally molded body has a bonding resin (C) interposed between a board (A) and a member (B), one surface of the board being a design surface, wherein: inside the member (B), a first bonding section disposed to space apart the board (A) and the member (B) and by which at least a partial region of an outer peripheral edge section of the board (A) bonds to the bonding resin (C), is provided; and at least at a part of the design surface-side surface of the integrally molded body, a region where the board (A), the member (B), and the bonding resin (C) are exposed is provided. A plurality of structures can be bonded with high bonding strength and allows for the bonding boundary thereof to have favorable smoothness, thereby making it possible to mitigate warping and reduce weight and thickness even when the molded body has a board constituent member.
    Type: Application
    Filed: November 30, 2017
    Publication date: December 26, 2019
    Inventors: Hideaki Sasaki, Yuki Takahashi, Keisuke Shiozaki