Abstract: There is provided a resin-molded board that enables soldering of electronic components to the metal frame of the resin-molded board to be carried out well, with no increase in production cost. A metal frame is comprised of a plurality of frame parts that form an electric circuit pattern, and a resin layer is molded onto the metal frame. The resin layer has provided in a surface thereof first openings for soldering electronic components onto the metal frame, each of the first openings having exposed therein a corresponding one of the frame parts, and second openings associated with the first openings, respectively, for maintaining a temperature at the first openings at not less than a predetermined temperature when soldering the electronic components onto the metal frame in the first openings using a flow soldering method.

Abstract: An electronic circuit board comprising a flow soldering surface and a plurality of lands is disclosed. The flow soldering surface has an upstream side, a downstream side, and a warp defining a warp direction. The plurality of lands are disposed on (i) the upstream side of the flow soldering surface and (ii) the downstream side of the flow soldering surface, and only said plurality of lands on the downstream side having extended portions extending along the warp direction.