Patents by Inventor Keisuke Suzui

Keisuke Suzui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor sensor having heater on insulation film and manufacturing method of the same
    Patent number: 8006553
    Abstract: A sensor includes: a silicon substrate having a hollow portion, which is arranged on a backside of the substrate; an insulation film disposed on a front side of the substrate and covering the hollow portion; a heater disposed on the insulation film, made of a semiconductor layer, and configured to generate heat; and an anti-stripping film for protecting the insulation film from being removed from the silicon substrate. The silicon substrate, the insulation film and the semiconductor layer provide a SOI substrate. The hollow portion has a sidewall and a bottom. The anti-stripping film covers at least a boundary between the sidewall and the bottom of the hollow portion.
    Type: Grant
    Filed: July 7, 2009
    Date of Patent: August 30, 2011
    Assignee: DENSO CORPORATION
    Inventors: Ryuichirou Abe, Tsuyoshi Fukada, Keisuke Suzui
  • Semiconductor sensor having heater on insulation film and manufacturing method of the same
    Publication number: 20100005877
    Abstract: A sensor includes: a silicon substrate having a hollow portion, which is arranged on a backside of the substrate; an insulation film disposed on a front side of the substrate and covering the hollow portion; a heater disposed on the insulation film, made of a semiconductor layer, and configured to generate heat; and an anti-stripping film for protecting the insulation film from being removed from the silicon substrate. The silicon substrate, the insulation film and the. semiconductor layer provide a SOI substrate. The hollow portion has a sidewall and a bottom. The anti-stripping film covers at least a boundary between the sidewall and the bottom of the hollow portion.
    Type: Application
    Filed: July 7, 2009
    Publication date: January 14, 2010
    Applicant: DENSO CORPORATION
    Inventors: Ryuichirou Abe, Tsuyoshi Fukada, Keisuke Suzui