Abstract: Disclosed is a thermal flow sensor including a base member and a cover. The base member includes a heater. The cover is formed by an SOI substrate including a silicon substrate, a silicon dioxide film, and a silicon film. The silicon film has a recessed portion defined therein. A main flow passage portion is defined by an exposed surface of the silicon dioxide film which is exposed from the silicon film and which defines a bottom surface of the recessed portion, the silicon film defining a side surface of the recessed portion, and a first principal surface of the cover.

Abstract: The semiconductor apparatus includes: a thermal source TS including a semiconductor device generating heat in an operating state; a thermal diffusion unit thermally connected to the thermal source TS, the thermal diffusion unit including space in a direction opposite to the thermal source; a plurality of air-cooling fin units disposed in the space of the thermal diffusion unit, one end of the plurality of fin unit is connected to the thermal diffusion unit; and a base unit connected to the thermal diffusion unit, wherein the plurality of air-cooling fin units is connected to the base unit through a plurality of thermal contact units CP1, CP2, CP3, . . . , CPn. Provide is an air-cooling type semiconductor apparatus, power module, and power supply, each having high heat dissipation performance and realizing light weight.

Abstract: Disclosed is a thermal flow sensor including a base member and a cover. The base member includes a heater. The cover is formed by an SOI substrate including a silicon substrate, a silicon dioxide film, and a silicon film. The silicon film has a recessed portion defined therein. A main flow passage portion is defined by an exposed surface of the silicon dioxide film which is exposed from the silicon film and which defines a bottom surface of the recessed portion, the silicon film defining a side surface of the recessed portion, and a first principal surface of the cover.

Abstract: The semiconductor apparatus includes: a thermal source TS including a semiconductor device generating heat in an operating state; a thermal diffusion unit thermally connected to the thermal source TS, the thermal diffusion unit including space in a direction opposite to the thermal source; a plurality of air-cooling fin units disposed in the space of the thermal diffusion unit, one end of the plurality of fin unit is connected to the thermal diffusion unit; and a base unit connected to the thermal diffusion unit, wherein the plurality of air-cooling fin units is connected to the base unit through a plurality of thermal contact units CP1, CP2, CP3, . . . , CPn. Provide is an air-cooling type semiconductor apparatus, power module, and power supply, each having high heat dissipation performance and realizing light weight.