Patents by Inventor Keisuke Wakita

Keisuke Wakita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230311456
    Abstract: The present disclosure provides a member for a display device comprising: a glass substrate with a thickness of 100 ?m or less; and a resin layer placed on one surface side of the glass substrate, a composite elastic modulus of the resin layer is 5.7 GPa or more, and a thickness of the resin layer is 5 ?m or more and 60 ?m or less.
    Type: Application
    Filed: March 2, 2021
    Publication date: October 5, 2023
    Inventors: Takashi AMIE, Takanori MAEDA, Makoto NANAUMI, Kazuyoshi SATAKE, Yoshiyuki ONO, Yosuke WADA, Keisuke WAKITA
  • Patent number: 11566108
    Abstract: A polyimide film includes a polyimide in which a specific amount of molecular framework containing one or two silicon atoms in its main chain, wherein a total light transmittance measured in accordance with JIS K7361-1 is 85% or more; wherein a yellowness index calculated in accordance with JIS K7373-2006 is 30 or less; wherein a glass transition temperature is in a temperature range of from 150° C. to 400° C.; and wherein a tensile elastic modulus at 25° C. obtained by measuring a 15 mm×40 mm test piece at a tensile rate of 10 mm/min and a chuck distance of 20 mm in accordance with JIS K7127, is 1.8 GPa or more.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: January 31, 2023
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Katsuya Sakayori, Koudai Okada, Ayako Furuse, Keisuke Wakita, Yoshihiro Kobayashi, Aya Takao, Takanori Maeda, Nahomi Kanazawa, Takayuki Ota
  • Publication number: 20190375894
    Abstract: A polyimide film includes a polyimide in which a specific amount of molecular framework containing one or two silicon atoms in its main chain, wherein a total light transmittance measured in accordance with JIS K7361-1 is 85% or more; wherein a yellowness index calculated in accordance with JIS K7373-2006 is 30 or less; wherein a glass transition temperature is in a temperature range of from 150° C. to 400° C.; and wherein a tensile elastic modulus at 25° C. obtained by measuring a 15 mm×40 mm test piece at a tensile rate of 10 mm/min and a chuck distance of 20 mm in accordance with JIS K7127, is 1.8 GPa or more.
    Type: Application
    Filed: August 8, 2017
    Publication date: December 12, 2019
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Katsuya SAKAYORI, Koudai OKADA, Ayako FURUSE, Keisuke WAKITA, Yoshihiro KOBAYASHI, Aya TAKAO, Takanori MAEDA, Nahomi KANAZAWA, Takayuki OTA
  • Publication number: 20190092913
    Abstract: A resin film has improved rigidity and flex resistance, and reduced optical distortion. A polyimide film has a polyimide containing an aromatic ring, and inorganic particles having a smaller refractive index in a major axis direction than an average refractive index in a direction perpendicular to the major axis direction, wherein, when the polyimide film is monotonically heated from 25° C. at 10° C./min, a size shrinkage ratio represented by the following formula in at least one direction is 0.1% or more at at least one temperature in a range of from 250° C. to 400° C.: size shrinkage ratio (%)=[{(size at 25° C.)?(size after heating)}/(size at 25° C.)]×100; wherein a birefringence index in a thickness direction is 0.020 or less at a wavelength of 590 nm; and wherein a total light transmittance measured in accordance with JIS K7361-1 is 80% or more at a thickness of 10 ?m.
    Type: Application
    Filed: February 24, 2017
    Publication date: March 28, 2019
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Katsuya SAKAYORI, Yoshihiro KOBAYASHI, Keisuke WAKITA, Ayako FURUSE, Koudai OKADA
  • Patent number: 7761267
    Abstract: A multi-variable model analysis system comprises a model creation unit for creating a plurality of models individually having a plurality of variables, a characteristic value calculation unit for calculating the characteristic values of the models on the basis of the variables of the models given and for writing the variables and characteristic values of the models, a clustering unit for classifying the plural models having the characteristic values of a high similarity, into an identical cluster; a correlation coefficient calculation unit for calculating the correlation coefficients of the variables of the models in individual clusters and for writing the correlation coefficients in a memory map; and an extraction unit for extracting the variable having a correlation coefficient exceeding a predetermined value in the individual clusters, from the memory map.
    Type: Grant
    Filed: October 25, 2005
    Date of Patent: July 20, 2010
    Assignee: National University Corporation, Yokohama National University
    Inventors: Tsuyoshi Ukyo, Yuusuke Kageyama, Keisuke Wakita
  • Publication number: 20090132208
    Abstract: A multi-variable model analysis system comprises a model creation unit for creating a plurality of models individually having a plurality of variables, a characteristic value calculation unit for calculating the characteristic values of the models on the basis of the variables of the models given and for writing the variables and characteristic values of the models, a clustering unit for classifying the plural models having the characteristic values of a high similarity, into an identical cluster; a correlation coefficient calculation unit for calculating the correlation coefficients of the variables of the models in individual clusters and for writing the correlation coefficients in a memory map; and an extraction unit for extracting the variable having a correlation coefficient exceeding a predetermined value in the individual clusters, from the memory map.
    Type: Application
    Filed: October 25, 2005
    Publication date: May 21, 2009
    Inventors: Tsuyoshi Ukyo, Yuusuke Kageyama, Keisuke Wakita