Patents by Inventor Keisuke Yamanishi
Keisuke Yamanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240067814Abstract: A resin composition comprises a polyether ether ketone, an aromatic polysulfone, a polyetherimide, and a fibrous filler.Type: ApplicationFiled: March 16, 2022Publication date: February 29, 2024Inventor: Keisuke YAMANISHI
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Patent number: 11738921Abstract: This banding band has a belt-like portion having a plurality of teeth on at least one surface thereof, and a securing portion positioned at one end of the belt-like portion, wherein the securing portion has a through-hole into which the other end of the belt-like portion can be inserted, and at least the belt-like portion comprises an amorphous resin having a glass transition temperature of 180° C. or higher.Type: GrantFiled: March 19, 2019Date of Patent: August 29, 2023Assignee: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Keisuke Yamanishi, Taiga Sakai
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Patent number: 11447628Abstract: A liquid-crystalline resin composition is provided, containing: a liquid-crystalline resin; and a fibrous filler formed of crystalline polysaccharides, in which a 5% weight loss temperature of the fibrous filler is 280° C. or higher.Type: GrantFiled: September 22, 2017Date of Patent: September 20, 2022Assignee: SUMITOMO CHEMICAL COMPANY, LIMITEDInventor: Keisuke Yamanishi
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Publication number: 20210009325Abstract: This banding band has a belt-like portion having a plurality of teeth on at least one surface thereof, and a securing portion positioned at one end of the belt-like portion, wherein the securing portion has a through-hole into which the other end of the belt-like portion can be inserted, and at least the belt-like portion comprises an amorphous resin having a glass transition temperature of 180° C. or higher.Type: ApplicationFiled: March 19, 2019Publication date: January 14, 2021Inventors: Keisuke YAMANISHI, Taiga SAKAI
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Publication number: 20200216642Abstract: A liquid crystalline resin composition contains a liquid crystalline resin, a filler, and carbon black. A content of the filler is 5 parts by mass or more and 100 parts by mass or less with respect to 100 parts by mass of the liquid crystalline resin, a content of the carbon black is 0.1 part by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the liquid crystalline resin, and a total content of eight substances selected from benzo(a)anthracene, benzo(a)pyrene, benzo(b)fluoranthene, benzo(k)fluoranthene, chrysene, dibenzo(a,h)anthracene, benzo(e)pyrene, and benzo(j)fluoranthene contained in the carbon black is less than 2.5 ppm.Type: ApplicationFiled: September 12, 2017Publication date: July 9, 2020Applicant: Sumitomo Chemical Company, LimitedInventors: Takayuki SUGIYAMA, Keisuke YAMANISHI
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Publication number: 20190211204Abstract: A liquid-crystalline resin composition is provided, containing: a liquid-crystalline resin; and a fibrous filler formed of crystalline polysaccharides, in which a 5% weight loss temperature of the fibrous filler is 280° C. or higher.Type: ApplicationFiled: September 22, 2017Publication date: July 11, 2019Inventor: Keisuke YAMANISHI
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Patent number: 8668994Abstract: Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the copper foil comprises a nickel or nickel alloy layer with a lower etching rate than copper formed on an etching side of the rolled copper foil or electrolytic copper foil, and a heat resistance layer composed of zinc or zinc alloy or its oxide formed on the nickel or nickel alloy layer.Type: GrantFiled: December 22, 2009Date of Patent: March 11, 2014Assignee: JX Nippon Mining & Metals CorporationInventors: Keisuke Yamanishi, Kengo Kaminaga, Ryo Fukuchi
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Patent number: 8580390Abstract: Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the copper foil comprises a heat resistance layer composed of zinc or zinc alloy or its oxide formed on an etching side of the rolled copper foil or electrolytic copper foil, and a layer of nickel or nickel alloy, which is a metal or alloy with a lower etching rate than copper, formed on the heat resistance layer.Type: GrantFiled: December 22, 2009Date of Patent: November 12, 2013Assignee: JX Nippon Mining & Metals CorporationInventors: Keisuke Yamanishi, Kengo Kaminaga, Ryo Fukuchi
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Publication number: 20130270218Abstract: A rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, characterized in comprising a layer of metal of one or more types among a platinum group, gold and silver with an etching rate that is lower than the copper formed on an etching surface side of the rolled copper foil or the electrolytic copper foil, or alternatively comprising a layer of an alloy having the above-described metal as its main component. The following can be achieved upon forming a circuit by etching a copper foil of a copper clad laminate: sagging caused by the etching is prevented; a uniform circuit of the intended circuit width is formed; the time required to form a circuit by etching is reduced; etching properties in pattern etching are improved; and the occurrence of short circuits and defects in the circuit width are prevented.Type: ApplicationFiled: June 7, 2013Publication date: October 17, 2013Inventors: Keisuke Yamanishi, Kengo Kaminaga, Ryo Fukuchi
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Patent number: 8449987Abstract: Provided is a rolled copper or copper alloy foil having a roughened surface formed of fine copper particles, obtained by subjecting a rolled copper or copper alloy foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of a temperature of 20 to 50° C. and a current density of 10 to 100 A/dm2. The provided rolled copper or copper alloy foil subject to roughening is reduced in craters which are obvious defects unique to rolled copper or copper alloy foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and also suits for use in producing a flexible printed wiring board capable of bearing a fine wiring pattern.Type: GrantFiled: June 11, 2007Date of Patent: May 28, 2013Assignee: JX Nippon Mining & Metals CorporationInventors: Yousuke Kobayashi, Atsushi Miki, Keisuke Yamanishi
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Publication number: 20130071652Abstract: A laminate for flexible wiring in which copper plating is entirely or locally applied on a copper foil that is cladded on an insulating resin substrate, characterized in that a ratio A=[(200)/{(111)+(200)+(220)+(311)}]×100, i.e. a ratio of an area intensity of a peak in the X-ray diffraction of the copper plating surface is more than 90. The present invention can provide the laminate for flexible wiring in which copper plating is entirely or locally applied on a copper foil cladded on an insulating resin substrate, characterized in having particularly high bendability and enables the formation of fine patterns, namely, high dense patterns of wiring.Type: ApplicationFiled: April 18, 2011Publication date: March 21, 2013Applicant: JX NIPPON MINING & METALS CORPORATIONInventors: Keisuke Yamanishi, Hideta Arai, Atsushi Miki
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Patent number: 8357307Abstract: Provided is a method of forming an electronic circuit, wherein a nickel or nickel alloy layer is formed on an etching side of a rolled copper foil or an electrolytic copper foil, the rolled copper foil or the electrolytic copper foil is bonded to a resin substrate to obtain a copper-clad laminate, a resist pattern for forming a circuit is subsequently applied on the copper foil, any unwanted portion of the copper foil and the nickel or nickel alloy layer of the copper-clad laminate other than the portion to which the resist pattern was applied is removed using an etching solution of an aqueous ferric chloride, the resist is further removed, and soft etching is additionally performed in order to remove the remnant nickel or nickel alloy layer and thereby form a circuit in which the space between copper circuit lines is of a width that is double or more from the thickness of copper.Type: GrantFiled: December 22, 2009Date of Patent: January 22, 2013Assignee: JX Nippon Mining & Metals CorporationInventors: Keisuke Yamanishi, Kengo Kaminaga, Ryo Fukuchi
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ELECTRONIC CIRCUIT, METHOD FOR FORMING SAME, AND COPPER CLAD LAMINATE FOR FORMING ELECTRONIC CIRCUIT
Publication number: 20120318568Abstract: Provided is an electronic circuit as a laminated body configured from a layer (A) which is made of a copper or copper alloy foil formed on one surface or both surfaces of a resin substrate, a copper or copper alloy plated layer (B) formed on a part or whole surface of the (A) layer, a plated layer (C) formed on a part or whole surface of the (B) layer and having a slower etching rate than that of copper relative to a copper etching solution, and a copper or copper alloy plated layer (D) formed on the layer (C) and which has a thickness of 0.05 ?m or more and less than 1 ?m, and which is made of a copper circuit formed by etching and removing a part of the laminated portion of the (A) layer, the (B) layer, the (C) layer and the (D) layer up to the resin substrate surface. It is thereby possible to form a circuit having a uniform circuit width, improve the etching properties in pattern etching, and prevent the occurrence of short-circuits and defects in the circuit width.Type: ApplicationFiled: January 7, 2011Publication date: December 20, 2012Applicant: JX NIPPON MINING & METALS CORPORATIONInventors: Keisuke Yamanishi, Ryo Fukuchi, Kengo Kaminaga -
Patent number: 8252166Abstract: A rolled copper or copper alloy foil having a roughened surface formed of fine copper particles is obtained by subjecting a rolled foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of temperature of 20 to 50° C. and current density of 10 to 100 A/dm2. The foil has reduced craters, which are defects unique to rolled foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and is suitable for producing a flexible printed wiring board capable of bearing a fine wiring pattern. A method of roughening the rolled foil is also provided.Type: GrantFiled: September 23, 2011Date of Patent: August 28, 2012Assignee: JX Nippon Mining & Metals CorporationInventors: Yousuke Kobayashi, Atsushi Miki, Keisuke Yamanishi
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Publication number: 20120012463Abstract: A rolled copper or copper alloy foil having a roughened surface formed of fine copper particles is obtained by subjecting a rolled foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of temperature of 20 to 50° C. and current density of 10 to 100 A/dm2. The foil has reduced craters, which are defects unique to rolled foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and is suitable for producing a flexible printed wiring board capable of bearing a fine wiring pattern. A method of roughening the rolled foil is also provided.Type: ApplicationFiled: September 23, 2011Publication date: January 19, 2012Applicant: JX Nippon Mining & Metals CorporationInventors: Yousuke Kobayashi, Atsushi Miki, Keisuke Yamanishi
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Publication number: 20110300401Abstract: A rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, characterized in comprising a layer of metal of one or more types among a platinum group, gold and silver with an etching rate that is lower than the copper formed on an etching surface side of the rolled copper foil or the electrolytic copper foil, or alternatively comprising a layer of an alloy having the above-described metal as its main component. This invention aims to achieve the following upon forming a circuit by etching a copper foil of a copper clad laminate; specifically, to prevent sagging caused by the etching; to form a uniform circuit of the intended circuit width; to shorten the time of forming a circuit by etching as much as possible; to improve the etching properties in pattern etching; and to prevent the occurrence of short circuits and defects in the circuit width.Type: ApplicationFiled: January 21, 2010Publication date: December 8, 2011Applicant: JX NIPPON MINING & METALS CORPORATIONInventors: Keisuke Yamanishi, Kengo Kaminaga, Ryo Fukuchi
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Publication number: 20110297641Abstract: Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the copper foil comprises a nickel or nickel alloy layer with a lower etching rate than copper formed on an etching side of the rolled copper foil or electrolytic copper foil, and a heat resistance layer composed of zinc or zinc alloy or its oxide formed on the nickel or nickel alloy layer.Type: ApplicationFiled: December 22, 2009Publication date: December 8, 2011Applicant: JX NIPPON MINING & METALS CORPORATIONInventors: Keisuke Yamanishi, Kengo Kaminaga, Ryo Fukuchi
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Publication number: 20110293960Abstract: Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the copper foil comprises a heat resistance layer composed of zinc or zinc alloy or its oxide formed on an etching side of the rolled copper foil or electrolytic copper foil, and a layer of nickel or nickel alloy, which is a metal or alloy with a lower etching rate than copper, formed on the heat resistance layer.Type: ApplicationFiled: December 22, 2009Publication date: December 1, 2011Applicant: JX NIPPON MINING & METALS CORPORATIONInventors: Keisuke Yamanishi, Kengo Kaminaga, Ryo Fukuchi
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Publication number: 20110284496Abstract: Provided is a method of forming an electronic circuit, wherein a nickel or nickel alloy layer is formed on an etching side of a rolled copper foil or an electrolytic copper foil, the rolled copper foil or the electrolytic copper foil is bonded to a resin substrate to obtain a copper-clad laminate, a resist pattern for forming a circuit is subsequently applied on the copper foil, any unwanted portion of the copper foil and the nickel or nickel alloy layer of the copper-clad laminate other than the portion to which the resist pattern was applied is removed using an etching solution of an aqueous ferric chloride, the resist is further removed, and soft etching is additionally performed in order to remove the remnant nickel or nickel alloy layer and thereby form a circuit in which the space between copper circuit lines is of a width that is double or more from the thickness of copper.Type: ApplicationFiled: December 22, 2009Publication date: November 24, 2011Applicant: JX NIPPON MINING & METALS CORPORATIONInventors: Keisuke Yamanishi, Kengo Kaminaga, Ryo Fukuchi
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Publication number: 20110259848Abstract: Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the rolled copper foil or the electrolytic copper foil comprises a nickel alloy layer with lower etching rate than copper, which is formed on an etching side of the copper foil, and the nickel alloy layer contains zinc. This invention aims to prevent sagging caused by the etching, to form a uniform circuit having the intended circuit width, and to shorten the time of forming a circuit by etching as much as possible, when forming a circuit by etching a copper foil of the copper-clad laminate; and also aims to make the thickness of the nickel alloy layer as thin as possible, to inhibit oxidation when exposed to heat, to prevent tarnish (discoloration) known as “YAKE”, to improve the etching properties in pattern etching, and to prevent the occurrence of short circuits and defects in the circuit width.Type: ApplicationFiled: December 22, 2009Publication date: October 27, 2011Applicant: JX NIPPON MINING & METALS CORPORATIONInventors: Keisuke Yamanishi, Kengo Kaminaga, Ryo Fukuchi