Patents by Inventor Keisuke Yoshimura
Keisuke Yoshimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240141521Abstract: A water electrolysis cell includes an anode-side porous channel, a membrane electrode assembly, a cathode-side porous channel, and a separator disposed on at least any one of a side of the anode-side porous channel opposite to the membrane electrode assembly side and a side of the cathode-side porous channel opposite to the membrane electrode assembly side. The anode-side porous channel, the membrane electrode assembly, and the cathode-side porous channel are provided in this order. The membrane electrode assembly includes an anode catalyst layer, an electrolyte membrane, and a cathode catalyst layer in order from the anode-side porous channel side. An area in a plane direction of the anode-side porous channel is greater than an area in the plane direction of the cathode-side porous channel in a plan view.Type: ApplicationFiled: August 22, 2023Publication date: May 2, 2024Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Kazunori SHIBATA, Keisuke FUJITA, Joji YOSHIMURA
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Publication number: 20230326724Abstract: A plasma processing apparatus is for performing plasma processing in a depressurizable inner space. The apparatus includes a chamber having therein an inner space, a supporting table provided in the inner space and configured to support a substrate to be mounted thereon, one or more first members included in the chamber or separate from the chamber and partially exposed to a depressurized environment including the inner space, and one or more second members included in the chamber or separate from the chamber, each being in contact with a corresponding one of said one or more first members, and partially disposed in an atmospheric pressure environment. The apparatus further includes one or more feeders each of which is configured to supply a coolant to a cavity formed in a corresponding one of said one or more second members.Type: ApplicationFiled: June 13, 2023Publication date: October 12, 2023Applicant: Tokyo Electron LimitedInventors: Yusuke HAYASAKA, Shuhei YAMABE, Naoki TAMARU, Keisuke YOSHIMURA, Kyo TSUBOI
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Patent number: 11715630Abstract: A plasma processing apparatus is for performing plasma processing in a depressurizable inner space. The apparatus includes a chamber having therein an inner space, a supporting table provided in the inner space and configured to support a substrate to be mounted thereon, one or more first members included in the chamber or separate from the chamber and partially exposed to a depressurized environment including the inner space, and one or more second members included in the chamber or separate from the chamber, each being in contact with a corresponding one of said one or more first members, and partially disposed in an atmospheric pressure environment. The apparatus further includes one or more feeders each of which is configured to supply a coolant to a cavity formed in a corresponding one of said one or more second members.Type: GrantFiled: May 10, 2019Date of Patent: August 1, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Yusuke Hayasaka, Shuhei Yamabe, Naoki Tamaru, Keisuke Yoshimura, Kyo Tsuboi
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Publication number: 20230015560Abstract: A substrate processing system installed on a floor face is provided. The substrate processing system includes a substrate transfer module, a supporting table including a top plate disposed separately from the floor face, a plurality of substrate processing modules disposed on the top plate and coupled to the substrate transfer module along a lateral side of the substrate transfer module, and a plurality of power units disposed below the top plate. Further, the plurality of power units correspond to the plurality of substrate processing modules, respectively, and each of the power units is configured to supply electric power to the corresponding processing module.Type: ApplicationFiled: September 29, 2022Publication date: January 19, 2023Applicant: TOKYO ELECTRON LIMITEDInventors: Suguru MOTEGI, Takashi KUMAGAI, Akira KODASHIMA, Keisuke YOSHIMURA
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Patent number: 11495480Abstract: A substrate processing system installed on a floor face is provided. The substrate processing system includes a substrate transfer module, a supporting table including a top plate disposed separately from the floor face, a plurality of substrate processing modules disposed on the top plate and coupled to the substrate transfer module along a lateral side of the substrate transfer module, and a plurality of power units disposed below the top plate. Further, the plurality of power units correspond to the plurality of substrate processing modules, respectively, and each of the power units is configured to supply electric power to the corresponding processing module.Type: GrantFiled: August 20, 2020Date of Patent: November 8, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Suguru Motegi, Takashi Kumagai, Akira Kodashima, Keisuke Yoshimura
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Publication number: 20210057243Abstract: A substrate processing system installed on a floor face is provided. The substrate processing system includes a substrate transfer module, a supporting table including a top plate disposed separately from the floor face, a plurality of substrate processing modules disposed on the top plate and coupled to the substrate transfer module along a lateral side of the substrate transfer module, and a plurality of power units disposed below the top plate. Further, the plurality of power units correspond to the plurality of substrate processing modules, respectively, and each of the power units is configured to supply electric power to the corresponding processing module.Type: ApplicationFiled: August 20, 2020Publication date: February 25, 2021Applicant: TOKYO ELECTRON LIMITEDInventors: Suguru MOTEGI, Takashi KUMAGAI, Akira KODASHIMA, Keisuke YOSHIMURA
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Publication number: 20190348262Abstract: A plasma processing apparatus is for performing plasma processing in a depressurizable inner space. The apparatus includes a chamber having therein an inner space, a supporting table provided in the inner space and configured to support a substrate to be mounted thereon, one or more first members included in the chamber or separate from the chamber and partially exposed to a depressurized environment including the inner space, and one or more second members included in the chamber or separate from the chamber, each being in contact with a corresponding one of said one or more first members, and partially disposed in an atmospheric pressure environment. The apparatus further includes one or more feeders each of which is configured to supply a coolant to a cavity formed in a corresponding one of said one or more second members.Type: ApplicationFiled: May 10, 2019Publication date: November 14, 2019Applicant: TOKYO ELECTRON LIMITEDInventors: Yusuke HAYASAKA, Shuhei YAMABE, Naoki TAMARU, Keisuke YOSHIMURA, Kyo TSUBOI
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Patent number: 4971755Abstract: It is disclosed a method for preparing a large-sized powder metallurgical sintered product having a superior characteristic by charging mixtures of three types of metallic powder composed of coarse particles, middle particles and fine particles into the molding die while vibrating it, heating the charged material together with the molding die, sintering them, and infiltrating metal of low melting point into the sintered body. According to this method, it is possible to get a large-sized sintered body having a superior strength and surface smoothness or a sintered body prohibiting any cracks or slits by arranging the proper particle size.Type: GrantFiled: June 20, 1989Date of Patent: November 20, 1990Assignee: Kawasaki Steel CorporationInventors: Masaki Kawano, Kuniaki Ogura, Shigeaki Takajo, Hiroshi Ohtsubo, Keisuke Yoshimura, Yoshiaki Maeda