Patents by Inventor Keita Akasaki

Keita Akasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Word line with multi-layer cap structure
    Patent number: 9401275
    Abstract: Word lines are formed from a stack of layers that includes a metal (e.g. tungsten) layer with an overlying multi-layer cap structure. The multi-layer cap structure includes a layer with a low etch rate to protect metal from damage during anisotropic etching. The multi-layer cap structure includes a layer with stress (e.g. tensile) that is opposite to the stress of the metal (e.g. compressive) to provide low combined stress.
    Type: Grant
    Filed: September 3, 2014
    Date of Patent: July 26, 2016
    Assignee: SanDisk Technologies LLC
    Inventors: Keita Akasaki, Hirotada Tobita
  • Word Line with Multi-Layer Cap Structure
    Publication number: 20160064276
    Abstract: Word lines are formed from a stack of layers that includes a metal (e.g. tungsten) layer with an overlying multi-layer cap structure. The multi-layer cap structure includes a layer with a low etch rate to protect metal from damage during anisotropic etching. The multi-layer cap structure includes a layer with stress (e.g. tensile) that is opposite to the stress of the metal (e.g. compressive) to provide low combined stress.
    Type: Application
    Filed: September 3, 2014
    Publication date: March 3, 2016
    Inventors: Keita Akasaki, Hirotada Tobita