Abstract: In a semiconductor device, a protective film is disposed above a first surface of a semiconductor substrate. A first main electrode is disposed on the first surface of the semiconductor substrate and has an exposed portion exposed from an opening of the protective film. A second main electrode is disposed on a second surface of the semiconductor substrate. The semiconductor substrate includes an active region formed with IGBTs and diodes connected in antiparallel, as vertical elements. The opening of the protective film corresponds to the active region in a thickness direction. The active region includes an overlapping region overlapping with the exposed portion of the first main electrode, and a non-overlapping region without overlapping with the exposed portion in the thickness direction. A proportion of a diode-formed region in the non-overlapping region is higher than a proportion of a diode-formed region in the overlapping region.

Abstract: A semiconductor device includes a first switching element; a second switching element; a first metal member; a second metal member; a first terminal that has a potential on a high potential side; a second terminal that has a potential on a low potential side; a third terminal that has a midpoint potential; and a resin part. A first potential part has potential equal to potential of the first terminal. A second potential part has potential equal to potential of the second terminal. A third potential part has potential equal to potential of the third terminal. A first creepage distance between the first potential part and the second potential part is longer than a minimum value of a second creepage distance between the first potential part and the third potential part and a third creepage distance between the second potential part and the third potential part.

Abstract: A semiconductor device includes a first switching element; a second switching element; a first metal member; a second metal member; a first terminal that has a potential on a high potential side; a second terminal that has a potential on a low potential side; a third terminal that has a midpoint potential; and a resin part. A first potential part has potential equal to potential of the first terminal. A second potential part has potential equal to potential of the second terminal. A third potential part has potential equal to potential of the third terminal. A first creepage distance between the first potential part and the second potential part is longer than a minimum value of a second creepage distance between the first potential part and the third potential part and a third creepage distance between the second potential part and the third potential part.

Abstract: The semiconductor device includes a semiconductor element, and an electro-conductive first plate-like part electrically connected to a top-face-side electrode of the semiconductor element and including a first joint part projecting from a side face, and an electro-conductive second plate-like part including a second joint part projecting from a side face. A bottom face of the first joint part and a top face of the second joint part face one another, and are electrically connected via an electro-conductive bonding material. A bonding-material-thickness ensuring means is provided in a zone where the bottom face of the first joint part and the top face of the second joint part face one another to ensure a thickness of the electro-conductive bonding material between an upper portion of a front end of the second joint part and the bottom face of the first joint part.

Abstract: The semiconductor device includes a semiconductor element, and an electro-conductive first plate-like part electrically connected to a top-face-side electrode of the semiconductor element and including a first joint part projecting from a side face, and an electro-conductive second plate-like part including a second joint part projecting from a side face. A bottom face of the first joint part and a top face of the second joint part face one another, and are electrically connected via an electro-conductive bonding material. A bonding-material-thickness ensuring means is provided in a zone where the bottom face of the first joint part and the top face of the second joint part face one another to ensure a thickness of the electro-conductive bonding material between an upper portion of a front end of the second joint part and the bottom face of the first joint part.

Abstract: A semiconductor device includes a metal member, a semiconductor element, a resin part, a primer layer, and a peel-off restraining part. The metal member has a surface that includes a semiconductor element mounting region and a resin close contact region that extends from the semiconductor element mounting region to an outer peripheral edge of the metal member. The semiconductor element is mounted on the semiconductor element mounting region. The resin part extends to a position outside a side surface of the metal member, and closely contacts with the resin close contact region, and collectively covers the semiconductor element and the metal member. The primer layer is disposed between the resin close contact region and the resin part. The peel-off restraining part is configured to restrain the metal member and the resin part from peeling from each other in the outer peripheral part of the resin close contact region.

Abstract: A terminal connecting structure includes: a male terminal; and a female terminal to which the male terminal is fitted. The male terminal includes a first metal material and a first metal film that is formed on an outermost surface of the male terminal to coat the first metal material directly or indirectly. The female terminal includes a second metal material and a second metal film that is formed on an outermost surface of the female terminal to coat the second metal material directly or indirectly. A hardness of the first metal material is different from a hardness of the second metal material.

Abstract: A semiconductor device includes a first switching element; a second switching element; a first metal member; a second metal member; a first terminal that has a potential on a high potential side; a second terminal that has a potential on a low potential side; a third terminal that has a midpoint potential; and a resin part. A first potential part has potential equal to potential of the first terminal. A second potential part has potential equal to potential of the second terminal. A third potential part has potential equal to potential of the third terminal. A first creepage distance between the first potential part and the second potential part is longer than a minimum value of a second creepage distance between the first potential part and the third potential part and a third creepage distance between the second potential part and the third potential part.

Abstract: A semiconductor apparatus is disclosed, which includes a semiconductor element provided on a plane; a sealing resin that seals the semiconductor element; a terminal that is electrically connected to the semiconductor element and includes a part that projects from a predetermined surface of the sealing resin; and a concave portion that is recessed toward a side of the semiconductor element from the predetermined surface, when viewed in a direction perpendicular to the plane. A side of the concave portion on the side of the semiconductor element includes a rounded shape, when viewed in the direction perpendicular to the plane.

Abstract: A semiconductor apparatus is disclosed, which includes a semiconductor element provided on a plane; a sealing resin that seals the semiconductor element; a terminal that is electrically connected to the semiconductor element and includes a part that projects from a predetermined surface of the sealing resin; and a concave portion that is recessed toward a side of the semiconductor element from the predetermined surface, when viewed in a direction perpendicular to the plane. A side of the concave portion on the side of the semiconductor element includes a rounded shape, when viewed in the direction perpendicular to the plane.

Abstract: In a fixing structure of a circuit board to a cooler, the circuit board includes a wiring part, electronic parts electrically connected to the wiring part and an insulating base material embedding the wiring part and the electronic parts therein. The insulating base material includes embedding portions in which the electronic parts are embedded and a bent portion having flexibility between the embedding portions. The cooler has fixing parts arranged in a first direction. The circuit board is fixed to the cooler while bending the bent portion. The bent portion is opposed to an end portion of one of the fixing parts, and each of the embedding portions is held between adjacent two fixing parts such that opposite surfaces of the embedding portion are closely in contact with surfaces of the adjacent two fixing parts.

Abstract: In a semiconductor module, a first heat sink is disposed on a rear surface of a first semiconductor chip constituting an upper arm, and a second heat sink is disposed on a front surface of the first semiconductor chip through a first terminal. A third heat sink is disposed on a rear surface of a second semiconductor chip constituting a lower arm, and a fourth heat sink is disposed on a front surface of the second semiconductor chip through a second terminal. A connecting part for connecting between the upper arm and the lower arm is integral with the first terminal, and is connected to the third heat sink while being inclined relative to the first terminal.

Abstract: In a semiconductor module, a first heat sink is disposed on a rear surface of a first semiconductor chip constituting an upper arm, and a second heat sink is disposed on a front surface of the first semiconductor chip through a first terminal. A third heat sink is disposed on a rear surface of a second semiconductor chip constituting a lower arm, and a fourth heat sink is disposed on a front surface of the second semiconductor chip through a second terminal. A connecting part for connecting between the upper arm and the lower arm is integral with the first terminal, and is connected to the third heat sink while being inclined relative to the first terminal.

Abstract: In a fixing structure of a circuit board to a cooler, the circuit board includes a wiring part, electronic parts electrically connected to the wiring part and an insulating base material embedding the wiring part and the electronic parts therein. The insulating base material includes embedding portions in which the electronic parts are embedded and a bent portion having flexibility between the embedding portions. The cooler has fixing parts arranged in a first direction. The circuit board is fixed to the cooler while bending the bent portion. The bent portion is opposed to an end portion of one of the fixing parts, and each of the embedding portions is held between adjacent two fixing parts such that opposite surfaces of the embedding portion are closely in contact with surfaces of the adjacent two fixing parts.