Patents by Inventor Keita HORIUCHI

Keita HORIUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate transfer apparatus and substrate transfer method
    Patent number: 11309199
    Abstract: A substrate transfer apparatus for transferring a substrate includes a plurality of vacuum transfer chambers, each having therein a substrate transfer mechanism for holding and transferring the substrate, and an intermediate chamber disposed between the vacuum transfer chambers adjacent to each other. When one of the vacuum transfer chambers adjacent to each other is set as a first vacuum transfer chamber and the other is set as a second vacuum transfer chamber, a first substrate loading/unloading port is disposed between the intermediate chamber and the first vacuum transfer chamber and a second substrate loading/unloading port is disposed between the intermediate chamber and the second vacuum transfer chamber. A gate valve is provided only for the second substrate loading/unloading port. Further, the first and the second substrate loading/unloading port have different height positions.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: April 19, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Keita Horiuchi, Koji Maeda, Morihiro Takanashi
  • SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE TRANSFER METHOD
    Publication number: 20210005486
    Abstract: A substrate transfer apparatus for transferring a substrate includes a plurality of vacuum transfer chambers, each having therein a substrate transfer mechanism for holding and transferring the substrate, and an intermediate chamber disposed between the vacuum transfer chambers adjacent to each other. When one of the vacuum transfer chambers adjacent to each other is set as a first vacuum transfer chamber and the other is set as a second vacuum transfer chamber, a first substrate loading/unloading port is disposed between the intermediate chamber and the first vacuum transfer chamber and a second substrate loading/unloading port is disposed between the intermediate chamber and the second vacuum transfer chamber. A gate valve is provided only for the second substrate loading/unloading port. Further, the first and the second substrate loading/unloading port have different height positions.
    Type: Application
    Filed: July 2, 2020
    Publication date: January 7, 2021
    Inventors: Keita HORIUCHI, Koji MAEDA, Morihiro TAKANASHI