Abstract: A pressurization device includes a body, a shaft, and a stopper. The body includes a setting section and an insertion section. The setting section is configured to accommodate an object to be pressurized. The insertion section includes a female thread part formed on a hole wall thereof. The shaft has a male thread part. The shaft is configured to advance and retreat with respect to the setting section by rotation. The stopper is configured on the shaft. The pressing part is configured on a first longitudinal end of the shaft to press the object in the setting section against a prescribed fixed part when the shaft advances. The handle is configured on a second longitudinal end of the shaft to rotate the shaft. The handle includes a torque limiter being configured to block transmission of power between the handle and the shaft when the power exceeds a prescribed amount.

Abstract: A method that can plate a predetermined position on various plating targets without implementing a pretreatment thereon is provided. A plating method is performed on a plating target using a plating solution, and the plating method includes at least a bubble ejection step of ejecting a bubble generated by a bubble ejection member to a plating solution. The bubble ejection member includes an electrode formed of a conductive material and an insulating material covering at least a part of the electrode, at least a part of the insulating material forms a bubble ejection port, and an air gap surrounded by the insulating material is formed between at least a part of the electrode and the bubble ejection port.

Abstract: The present invention addresses the problem of providing a bubble ejection method based on a new principle that is different from conventional bubble ejection methods and a bubble ejecting device. To solve the problem, provided is a bubble ejection method using a bubble ejecting device, wherein the bubble ejecting device comprises a substrate formed of a dielectric, at least one bubble ejection hole formed so as to penetrate through a first face and a second face, which is a face opposite to the first face, of the substrate, a first opening formed at a position of the first face at which the bubble ejection hole penetrates, and a second opening formed at a position of the second face at which the bubble ejection hole penetrates, the bubble ejection method comprising: a substrate-conductive liquid contact step; a conductive liquid-electrode contact step; a voltage application step; and a bubble ejection step.

Abstract: The action robot toy includes a robot main body, first and second shafts, first and second rotating members, first and second rotation devices, and a control device. The first rotating member includes a first tip end and a first base end being opposite to the first tip end. The second rotating member includes a second tip end and a second base end being opposite to the second tip end. The first and second base ends are rotatably linked to the robot main body via the first and second shafts respectively. The first and second rotation devices are configured to rotate the first and second rotating members. The first and second shafts extends in a direction, and the first and second rotating members are rotatable within a plane orthogonal to the direction. The robot main body is lifted by the first and second rotating members abutting a floor.

Abstract: A method that can plate a predetermined position on various plating targets without implementing a pretreatment thereon is provided. A plating method is performed on a plating target using a plating solution, and the plating method includes at least a bubble ejection step of ejecting a bubble generated by a bubble ejection member to a plating solution. The bubble ejection member includes an electrode formed of a conductive material and an insulating material covering at least a part of the electrode, at least a part of the insulating material forms a bubble ejection port, and an air gap surrounded by the insulating material is formed between at least a part of the electrode and the bubble ejection port.