Patents by Inventor Keita Ohtsuka

Keita Ohtsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9481398
    Abstract: In a damper housing structure body, an upper edge of a damper housing and a damper base are bonded by spot welding. The damper housing has a U-shape with an opening on a vehicle outer side in plan view, and includes a planar part in a corner between a front wall and an inner wall. The planer part includes plural welding spots arranged in the front-rear direction of the vehicle. Adjacent weld spots have mutually overlapping welding margins or an interval between two adjoining welding points is shorter than an outer diameter of the welding margins. One of the welding spots is welded while a current is applied to another welding spot that has been already welded. A current value for welding the one of the welding spots is higher than another current value for another one of the welding spots that has been already welded.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: November 1, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Hisayasu Ohoka, Atsushi Suzuki, Mitsushige Goto, Keita Ohtsuka, Taichi Nezasa
  • Publication number: 20150166117
    Abstract: In a damper housing structure body, an upper edge of a damper housing and a damper base are bonded by spot welding. The damper housing has a U-shape with an opening on a vehicle outer side in plan view, and includes a planar part in a corner between a front wall and an inner wall. The planer part includes plural welding spots arranged in the front-rear direction of the vehicle. Adjacent weld spots have mutually overlapping welding margins or an interval between two adjoining welding points is shorter than an outer diameter of the welding margins. One of the welding spots is welded while a current is applied to another welding spot that has been already welded. A current value for welding the one of the welding spots is higher than another current value for another one of the welding spots that has been already welded.
    Type: Application
    Filed: May 24, 2013
    Publication date: June 18, 2015
    Inventors: Hisayasu Ohoka, Atsushi Suzuki, Mitsushige Goto, Keita Ohtsuka, Taichi Nezasa
  • Patent number: 6605414
    Abstract: A method for manufacturing a magnetoresistance head of the present invention comprises the steps of forming an organic film on a multilayered film constituting a magnetoresistance device, forming an upper film formed of resist or inorganic film on the organic film, patterning the organic film and the upper film, cutting into edges of the organic film patterns from edges of the upper film patterns inwardly to such an extent that particles of the thin film being formed on the upper film and the multilayered film do not contact to side portions of the organic film patterns.
    Type: Grant
    Filed: November 12, 1999
    Date of Patent: August 12, 2003
    Assignee: Fujitsu Limtied
    Inventors: Keiji Watanabe, Koji Nozaki, Miwa Igarashi, Yoko Kuramitsu, Ei Yano, Takahisa Namiki, Hiroshi Shirataki, Keita Ohtsuka, Michiaki Kanamine, Yuji Uehara
  • Publication number: 20020110756
    Abstract: A method for manufacturing a magnetoresistance head of the present invention comprises the steps of forming an organic film on a multilayered film constituting a magnetoresistance device, forming an upper film formed of resist or inorganic film on the organic film, patterning the organic film and the upper film, cutting into edges of the organic film patterns from edges of the upper film patterns inwardly to such an extent that particles of the thin film being formed on the upper film and the multilayered film do not contact to side portions of the organic film patterns.
    Type: Application
    Filed: November 12, 1999
    Publication date: August 15, 2002
    Inventors: KEIJI WATANABE, KOJI NOZAKI, MIWA IGARASHI, YOKO KURAMITSU, EI YANO, TAKAHISA NAMIKI, HIROSHI SHIRATAKI, KEITA OHTSUKA, MICHIAKI KANAMINE, YUJI UEHARA
  • Patent number: 6052261
    Abstract: A method for manufacturing a magnetoresistance head of the present invention comprises the steps of forming an organic film on a multilayered film constituting a magnetoresistance device, forming an upper film formed of resist or inorganic film on the organic film, patterning the organic film and the upper film, cutting into edges of the organic film patterns from edges of the upper film patterns inwardly to such an extent that particles of the thin film being formed on the upper film and the multilayered film do not contact to side portions of the organic film patterns.
    Type: Grant
    Filed: June 24, 1996
    Date of Patent: April 18, 2000
    Assignee: Fujitsu Limited
    Inventors: Keiji Watanabe, Koji Nozaki, Miwa Igarashi, Yoko Kuramitsu, Ei Yano, Takahisa Namiki, Hiroshi Shirataki, Keita Ohtsuka, Michiaki Kanamine, Yuji Uehara
  • Patent number: 5917681
    Abstract: According to a method of manufacturing a thin film magnetic head, a magnetoresistive device and an alumina layer are formed on a substrate, then the alumina layer is covered with a covering layer made of metal such as Ti having a thickness of more than 10 nm, then a photoresist film is formed on the covering layer, and then an opening is formed by exposing and developing the photoresist film. In turn, a magnetic metal film is formed on an allover surface, then the photoresist film and the magnetic metal film thereon are removed. The thin film magnetic head structured as above may provide a good magnetic characteristic since it has the covering layer on the alumina layer to prevent the alumina layer from being corroded by liquid developer. In addition, a magnetic recording unit employing the thin film magnetic head may reproduce data recorded with high density.
    Type: Grant
    Filed: July 19, 1996
    Date of Patent: June 29, 1999
    Assignee: Fujitsu Limited
    Inventors: Mithumasa Okada, Takamitsu Orimoto, Keita Ohtsuka
  • Patent number: 4935306
    Abstract: An ink sheet including an ink layer composed of 10 weight part of urethane wax, 1 weight part of ester wax, 5 weight part of paraffin wax, 5 weight part of dyestuff and 2 weight part of carbon black, on a polyester resin film substrate through an adhesive layer composed of 15 weight part of a (vinyl chloride)-(vinyl acetate) copolymerized resin, 15 weight part of carbon black and 48 weight part of polyester mixture composed of two kinds of polyester resin one of which has a glass transition temperature of 67.degree. C. and the other of which has a glass transition temperature of -20.degree. C., mixed in a weight ratio of 75/25.
    Type: Grant
    Filed: September 28, 1989
    Date of Patent: June 19, 1990
    Assignee: Fujitsu Limited
    Inventors: Keita Ohtsuka, Hiroshi Sasao, Hiroo Ueda