Abstract: A plated molding including a plating layer formed on a part or all of a surface of the molding molded with a polyphenylene sulfide resin composition comprising 30 to 200 parts by weight of a fibrous filler (B) based on 100 parts by weight of a polyphenylene sulfide resin (A), wherein an arithmetic mean roughness of the surface of the plating layer of the plated molding is 1.5 ?m or less.

Abstract: There is provided a technique capable of improving the throughput by suppressing stagnation of a substrate in a transfer chamber and by reducing unused time. According to one aspect thereof, a substrate processing apparatus includes: a plurality of process chambers in which a substrate among a plurality of substrates is capable of being processed; a transfer chamber provided with a transfer structure capable of transferring the substrate; and a controller configured to be capable of: (a) calculating a substrate transferable time during which the substrate is capable of being transferred to each of the plurality of process chambers; (b) selecting a substrate transfer path to a process chamber among the plurality of process chambers such that the substrate transferable time is the shortest among those calculated in (a); and (c) performing a control of the transfer structure based on the substrate transfer path selected in (b).