Abstract: A backlight unit includes LEDs, a light guide plate, a wavelength converter, and an LED controller. The LEDs include end-side LEDs arranged at ends in the direction of arrangement and a center LED arranged at the center in the direction of arrangement. The light guide plate includes a light entering end surface and a light exiting plate surface. The light entering end surface extends along the direction of arrangement. The wavelength converter extends along the direction of arrangement and is interposed among the LEDs and the light entering end surface. The wavelength converter includes a phosphor configured to wavelength-convert the light from the LEDs. The LED controller is configured to control the amount of light emitted by each LED per unit time such that the amount of light emitted by at least one of the end-side LEDs than the amount of light emitted by the center LED.

Abstract: An IC device 4 of the present invention includes a robot arm 6 for conveying IC devices D to a test head 2 for testing the IC devices. The test head 2 includes sockets 3 having placement surfaces 3a onto which the IC devices D are placed and for attaching the IC devices placed on the placement surfaces to the test head. The robot arm 6 includes a contact head 61 for holding the IC devices while the IC devices are conveyed and for pressing the IC devices onto the test head during testing, and a non-contact displacement meter 71 that moves in association with the movement of the contact head 61. The non-contact displacement meter 71 is mounted on the robot arm 6 so as to measure a distance by emitting a beam in a direction perpendicular to the placement surfaces 3a.

Abstract: An IC handler (4) of the present invention is provided with: a contact head (7), which holds a plurality of IC devices, and which presses the IC devices to a plurality of sockets (3); and a movable arm (6) that moves the contact head (7). The movable arm (6) has power supply ports (VO, HO) that are connected to supply sources (VS, HS) of power for generating operations of the contact head (7), and the contact head (7) has a plurality of operating sections (70) that operate with the power, and a supporting section (71), which supports the operating sections (70), and which is removably attached to the movable arm (6). The supporting section (71) of the contact head (7) has: connecting ports (VC, HC) that are removably connected to the supply ports (VO, HO); and supply paths (71a, 71d) for supplying the power to the operating sections (70) from the connecting ports (VC, HC) connected to the supply ports (VO, HO).

Abstract: A lighting device includes a light source array, a wavelength converting member, and a light guide plate. The light source array includes light sources configured to emit primary light rays. The wavelength converting member includes a wavelength converting portion, a holding portion, and non-wavelength converting portions. The wavelength converting portion contains phosphors configured to emit secondary light rays when excited by the primary light rays. The wavelength converting member is disposed between the light guide plate and the light source array. The light guide plate includes a light entering surface, a light exiting surface, an opposite surface that is on an opposite side from the light exiting surface, and a light reflecting and scattering pattern. The light reflecting and scattering pattern includes complementary color dots formed in sections of the opposite surface on non-wavelength converting portion sides. The complementary color dots absorb the primary light rays.

Abstract: An IC handler (4) of the present invention transfers an IC device (D) to a test head (2). The test head (2) is provided with a socket (3), which has a placing surface (3a) having the IC device (D) placed thereon, and which attaches the IC device (D) placed on the placing surface (3a) to the test head (2). The IC handler (4) is provided with a non-contact displacement meter (71) that is disposed by being spaced apart from the socket (3) in the direction perpendicular to the placing surface (3a). The non-contact displacement meter (71) measures a distance from the non-contact displacement meter (71) to the IC device (D) placed on the placing surface (3a) by emitting a laser beam toward the placing surface (3a) of the socket (3).

Abstract: An IC device 4 of the present invention includes a robot arm 6 for conveying IC devices D to a test head 2 for testing the IC devices. The test head 2 includes sockets 3 having placement surfaces 3a onto which the IC devices D are placed and for attaching the IC devices placed on the placement surfaces to the test head. The robot arm 6 includes a contact head 61 for holding the IC devices while the IC devices are conveyed and for pressing the IC devices onto the test head during testing, and a non-contact displacement meter 71 that moves in association with the movement of the contact head 61. The non-contact displacement meter 71 is mounted on the robot arm 6 so as to measure a distance by emitting a beam in a direction perpendicular to the placement surfaces 3a.

Abstract: An IC handler (4) of the present invention is provided with: a contact head (7), which holds a plurality of IC devices, and which presses the IC devices to a plurality of sockets (3); and a movable arm (6) that moves the contact head (7). The movable arm (6) has power supply ports (VO, HO) that are connected to supply sources (VS, HS) of power for generating operations of the contact head (7), and the contact head (7) has a plurality of operating sections (70) that operate with the power, and a supporting section (71), which supports the operating sections (70), and which is removably attached to the movable arm (6). The supporting section (71) of the contact head (7) has: connecting ports (VC, HC) that are removably connected to the supply ports (VO, HO); and supply paths (71a, 71d) for supplying the power to the operating sections (70) from the connecting ports (VC, HC) connected to the supply ports (VO, HO).

Abstract: An IC handler (4) of the present invention transfers an IC device (D) to a test head (2). The test head (2) is provided with a socket (3), which has a placing surface (3a) having the IC device (D) placed thereon, and which attaches the IC device (D) placed on the placing surface (3a) to the test head (2). The IC handler (4) is provided with a non-contact displacement meter (71) that is disposed by being spaced apart from the socket (3) in the direction perpendicular to the placing surface (3a). The non-contact displacement meter (71) measures a distance from the non-contact displacement meter (71) to the IC device (D) placed on the placing surface (3a) by emitting a laser beam toward the placing surface (3a) of the socket (3).

Abstract: This is a thin film forming apparatus which is equipped with a target constructed of a thin film material, a cathode for generating a particulate thin film material from the target, a supporting member for supporting the substrate on which the particulate thin film material is to be deposited, a heater for heating the substrate, and a guide for introducing the particulate thin film material onto a surface of the substrate where the thin film material is deposited, wherein the supporting member supports the substrate so as to expose the first principal surface and its backside (second principal surface) of the substrate, the target is disposed in a position for producing the particulate thin film material in an extension of the first principal surface of the substrate, and the guide is disposed on the first principal surface and the second principal surface of the substrate.

Abstract: When current collecting wires are laid in parallel with each other on a solar cell on which a photosensitive film is formed, a wire tension adjusting mechanism is provided which includes a bobbin holder shaft pivotally held on the side of a frame in a bobbin cassette in a wiring apparatus and a wire bobbin is detachably fixed on the bobbin holder shaft. The wire tension adjusting mechanism further includes a pre-load means for adjusting the torque of the bobbin holder shaft and the tension of each current collecting wire to be drawn out from the wire bobbin held by the bobbin shaft is adjusted.

Abstract: A magnetron sputtering system generates a high density plasma on a target by applying magnetic fields intersecting an electric field by using a plurality of magnets that are rotatably supported. The respective magnets are revolved and rotated so that the time variation of regions where a magnetic field (line of magnetic force) generated by the each magnet is orthogonal to an electric field is prevented from becoming monotonous. Further, the respective magnets are arranged to make the distances between the center of rotation and the center of revolution of the respective magnets different from each other, so that the regions where the magnetic field (line of magnetic force) generated by the each magnet is orthogonal to the electric field are dispersed in the radial direction of a target.

Abstract: To obtain high-quality chalcopyrite particles having a small particle size using a relatively inexpensive raw material in a simple and easy process in which complicated equipment (such as vacuum equipment) is not necessary. Provided is a method for producing a compound having a chalcopyrite structure represented by a compositional formula: ABC2, the method including: a step of dissolving a Group 11 element A, a Group 13 element B, and a Group 16 element C of the periodic table in a solvent to prepare a solution; and a step of contacting the solution with a reducing agent.

Abstract: A device-positioning pedestal capable of positioning devices of different sizes. The device-positioning pedestal comprises a plurality of guide members corresponding to the sides of the device and coming in contact with the sides of the device to position the device, at least one guide member includes a slide mechanism that supports the guide member so as to slide relative to the device-positioning pedestal member and a fixing mechanism that fixes the guide members at desired positions. The guide members are set to be adapted to the size of the device by the guide member-adjusting means separate from the device-positioning pedestal. The guide member-adjusting means adjust the position of the guide members based on the size of the device measured by device size-measuring means separate from the guide member-adjusting means or based on the data of data-recording means attached to the device-positioning pedestal.

Abstract: When current collecting wires are laid in parallel with each other on a solar cell on which a photosensitive film is formed, a wire tension adjusting mechanism is provided which includes a bobbin holder shaft pivotally held on the side of a frame in a bobbin cassette in a wiring apparatus and a wire bobbin is detachably fixed on the bobbin holder shaft. The wire tension adjusting mechanism further includes a pre-load means for adjusting the torque of the bobbin holder shaft and the tension of each current collecting wire to be drawn out from the wire bobbin held by the bobbin shaft is adjusted.

Abstract: A device-positioning pedestal capable of positioning devices of different sizes. The device-positioning pedestal comprises a plurality of guide members corresponding to the sides of the device and coming in contact with the sides of the device to position the device, at least one guide member includes a slide mechanism that supports the guide member so as to slide relative to the device-positioning pedestal member and a fixing mechanism that fixes the guide members at desired positions. The guide members are set to be adapted to the size of the device by the guide member-adjusting means separate from the device-positioning pedestal. The guide member-adjusting means adjust the position of the guide members based on the size of the device measured by device size-measuring means separate from the guide member-adjusting means or based on the data of data-recording means attached to the device-positioning pedestal.

Abstract: A plurality of magnets are rotatably supported and when a ratio between revolution angle and rotation angle per unit time is set to 1:R, R is set to a value which is not less than 1 and not more than 5, and is not a common divisor of 360, so that the time variation of regions where a magnetic field (line of magnetic force) generated by the each magnet is orthogonal to an electric field is prevented from becoming monotonous. Further, the respective magnets are arranged to make the distances between the center of rotation and the center of revolution of the respective magnets different from each other, so that the regions where the magnetic field (line of magnetic force) generated by the each magnet is orthogonal to the electric field are dispersed in the radial direction of a target.

Abstract: This is a thin film forming apparatus which is equipped with a target constructed of a thin film material, a cathode for generating a particulate thin film material from the target, a supporting member for supporting the substrate on which the particulate thin film material is to be deposited, a heater for heating the substrate, and a guide for introducing the particulate thin film material onto a surface of the substrate where the thin film material is deposited, wherein the supporting member supports the substrate so as to expose the first principal surface and its backside (second principal surface) of the substrate, the target is disposed in a position for producing the particulate thin film material in an extension of the first principal surface of the substrate, and the guide is disposed on the first principal surface and the second principal surface of the substrate.

Abstract: A sewing machine includes a vertical portion and a horizontal portion of an arm having at least one sewing needle mounted thereon, a bed extending in parallel to and under the horizontal portion of the arm, two first rails extending parallel to the bed in the neighborhood of the side portion of the vertical portion, first carriages adapted to slide on the first rails, and a second rail connected to the first carriages and perpendicular to the first rails, wherein the distance between the two first rails is shorter or equal to the length of the second rail. The sewing machine includes a second carriage adapted to slide on the second rail, and an embroidery frame unit mounted on the second carriage, wherein the sewing machine is capable of embroidery without being limited by the distance between the rails.

Abstract: A sewing machine comprises an arm including a vertical portion and a horizontal portion having at least one sewing needle mounted thereon, a bed extending in parallel to the horizontal portion under the horizontal portion of the arm, two first rails extending in parallel to the bed in the neighborhood of the side portion of the vertical portion of the arm, first carriages adapted to slide on the first rails, respectively, and a second rail connected to the first carriages and perpendicular to the first rails, wherein the distance between the two first rails is shorter than or equal to the length of the second rail, the sewing machine further comprising a second carriage adapted to slide on the second rail, and an embroidery frame unit mounted on the second carriage on the side portion of the second rail located far from the vertical portion of the arm, wherein the first carriages are located on one side of the second rail, and the embroidery frame unit is located on the other side of the second rail.