Patents by Inventor Keitaro Koroishi

Keitaro Koroishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100122979
    Abstract: To improve heating efficiency and printing quality, a heating resistor element component (4) includes a plurality of heating resistors (14) arranged with intervals on a heat storage layer (13) laminated on a supporting substrate (11) through an intermediation of an adhesive layer (12), in which: the adhesive layer (12) includes an adhesive (12a) for bonding one surface of the supporting substrate (11) and another surface of the heat storage layer (13), and a plurality of gap members (12b) kneaded in the adhesive (12a), for keeping a distance between the one surface of the supporting substrate (11) and the another surface of the heat storage layer (13) constant; and a cavity portion (19) is formed in a region of the adhesive layer (12), the region being opposed to a heating portion of the heating resistor (14).
    Type: Application
    Filed: October 26, 2009
    Publication date: May 20, 2010
    Inventors: Norimitsu Sanbongi, Toshimitsu Morooka, Keitaro Koroishi, Noriyoshi Shoji, Yoshinori Sato
  • Publication number: 20100118105
    Abstract: To provide a thermal head and a printer which realize improved heating efficiency and improved strength, and to manufacture the thermal head stably, provided is a thermal head manufacturing method including: a concave portion forming step of forming a concave portion on one surface of a supporting substrate; a bonding step of bonding a thin plate glass shaped like a substantially flat board, to the one surface of the supporting substrate where the concave portion has been formed in the concave portion forming step, in a manner that hermetically seals the concave portion and forms a hollow portion; a heating step of heating the supporting substrate and the thin plate glass which have been bonded together in the bonding step, to thereby soften the thin plate glass and expand gas trapped inside the hollow portion; and a heating resistor forming step of forming a heating resistor on the thin plate glass so as to be opposed to the hollow portion, wherein the heating step concavely curves a surface of the thin plat
    Type: Application
    Filed: October 26, 2009
    Publication date: May 13, 2010
    Inventors: Toshimitsu Morooka, Keitaro Koroishi, Yoshinori Sato, Noriyoshi Shoji, Norimitsu Sanbongi
  • Publication number: 20100115760
    Abstract: Provided is a manufacturing method for a thermal head, which enables to manufacture a thermal head having high heating efficiency and stable quality.
    Type: Application
    Filed: October 19, 2009
    Publication date: May 13, 2010
    Inventors: Noriyoshi Shoji, Norimitsu Sanbongi, Yoshinori Sato, Toshimitsu Morooka, Keitaro Koroishi
  • Publication number: 20100071414
    Abstract: Provided is a manufacturing method for a thermal head, which includes: a concave portion forming step of forming a plurality of concave portions on a surface of a collective substrate; a bonding step of thermally fusion bonding an insulating film to the surface of the collective substrate including the plurality of concave portions formed thereon in the concave portion forming step; and a heating resistor forming step of forming a plurality of heating resistors on the insulating film so as to be opposed to the plurality of concave portions, in which the concave portion forming step includes setting any one of the plurality of concave portions as a reference, and setting sizes of the plurality of concave portions other than the any one of the plurality of concave portions so as to become larger as a distance from the any one thereof increases.
    Type: Application
    Filed: July 24, 2009
    Publication date: March 25, 2010
    Inventors: Toshimitsu Morooka, Keitaro Koroishi, Yoshinori Sato, Noriyoshi Shoji, Norimitsu Sanbongi
  • Publication number: 20090262176
    Abstract: Provided is a heating resistance element component, including: a supporting substrate; an insulating film laminated on the supporting substrate; a plurality of heating resistors formed on the insulating film, the plurality of heating resistors being arranged in a zigzag shape along a main scanning direction and having a substantially square shape; a common wire connected to one end of each of the plurality of heating resistors; individual wires each connected to another end of the each of the plurality of heating resistors; and concave portions formed in regions which are opposed to the plurality of heating resistors and are located on a surface of the supporting substrate, in which an arrangement pitch of the plurality of heating resistors in a sub-scanning direction is larger than an arrangement pitch of the plurality of heating resistors in a main scanning direction.
    Type: Application
    Filed: October 2, 2008
    Publication date: October 22, 2009
    Inventors: Noriyoshi Shoji, Toshimitsu Morooka, Norimitsu Sanbongi, Yoshinori Sato, Keitaro Koroishi
  • Publication number: 20090231408
    Abstract: To reduce a plate thickness of an insulating film, a heating resistor element component is provided, which includes: a supporting substrate; an insulating film disposed on a surface of the supporting substrate; a plurality of heating resistors arranged at intervals on the insulating film; a common wire connected to one end of each of the plurality of heating resistors; and individual wires each connected to another end of each of the plurality of heating resistors, in which: the surface of the supporting substrate is provided with a concave portion in a region thereof, the region being opposed to heating portions of the plurality of heating resistors; and when the insulating film is superimposed on the supporting substrate, the insulating film includes a heterogeneous phase formed through irradiation of a phemtosecond laser at least in a region thereof, the region being opposed to the concave portion.
    Type: Application
    Filed: March 16, 2009
    Publication date: September 17, 2009
    Inventors: Noriyoshi Shoji, Norimitsu Sanbongi, Yoshinori Sato, Toshimitsu Morooka, Keitaro Koroishi
  • Publication number: 20090102891
    Abstract: Provided is a heating resistor element (1), including: an insulating substrate (9); a heat accumulating layer (10) bonded to a surface of the insulating substrate (9); and a heating resistor (11) provided on the heat accumulating layer (10), in which: on at least one of bonded surfaces (9a) between the insulating substrate (9) and the heat accumulating layer (10), at least one of the insulating substrate (9) and the heat accumulating layer (10) is provided with a concave portion (16) in a region opposed to the heating resistor (11) to form a hollow portion (17); and the hollow portion (17) includes an inner surface on a side of the insulating substrate (9), the inner surface being processed to have surface roughness (Ra) of 0.2 ?m or more. Accordingly, heat accumulation in a gas of the hollow portion (17) can be suppressed to improve printing quality.
    Type: Application
    Filed: October 20, 2008
    Publication date: April 23, 2009
    Inventors: Keitaro KOROISHI, Toshimitsu MOROOKA, Noriyoshi SHOJI, Yoshinori SATO, Norimitsu SANBONGI
  • Publication number: 20090102912
    Abstract: Provided is a heating resistor element, including: an insulating substrate (9); a heat accumulating layer (10) bonded to a surface of the insulating substrate (9); and a heating resistor (11) provided on the heat accumulating layer (10), in which: on at least one of bonded surfaces between the heating substrate (9) and the heat accumulating layer (10), at least one of the insulating substrate (9) and the heat accumulating layer (10) is provided with a concave portion (16) in a region opposed to the heating resistor (11) to form a hollow portion (17); and the concave portion (16) has a curvature radius of 10 ?m or more at each corner thereof. Accordingly, occurrence of stress concentration caused by heat or a load can be suppressed to improve durability, and both a sufficient strength and heating efficiency are realized.
    Type: Application
    Filed: October 20, 2008
    Publication date: April 23, 2009
    Inventors: Keitaro KOROISHI, Toshimitsu Morooka, Noriyoshi Shoji, Yoshinori Sato, Norimitsu Sanbongi
  • Publication number: 20090102911
    Abstract: Provided is a heating resistor element including: an insulating substrate including a glass material; a heat accumulating layer bonded to the insulating substrate through heating to temperature ranging from an annealing point to a softening point in a state of being adhered to a surface of the insulating substrate, and including the same material as the glass material of the insulating substrate; and a heating resistor provided on the heat accumulating layer, in which, on at least one of bonded surfaces between the insulating substrate and the heat accumulating layer, at least one of the insulating substrate and the heat accumulating layer is provided with a concave portion in a region opposed to the heating resistor to form a hollow portion. Accordingly, deformation caused by a difference in coefficient of thermal expansion is suppressed to improve printing quality.
    Type: Application
    Filed: October 20, 2008
    Publication date: April 23, 2009
    Inventors: Keitaro Koroishi, Toshimitsu Morooka, Noriyoshi Shoji, Yoshinori Sato, Norimitsu Sanbongi
  • Publication number: 20090090703
    Abstract: Provided is a heating resistance element component, including: a supporting substrate; an insulating film laminated on the supporting substrate; a plurality of heating resistors arranged at intervals on the insulating film; a common wire connected to one end of each of the plurality of heating resistors; and individual wires each connected to another end of the each of the plurality of heating resistors, in which a surface of the supporting substrate is formed with a first concave portion and a second concave portion, the first concave portion being arranged in a region opposed to heating portions of the plurality of heating resistors, the second concave portion being arranged at an interval in a vicinity of the first concave portion. Accordingly, heating efficiency of the heating resistors can be increased to reduce power consumption, and a strength of the substrate under the heating resistors can be increased.
    Type: Application
    Filed: October 2, 2008
    Publication date: April 9, 2009
    Inventors: Toshimitsu Morooka, Norimitsu Sanbongi, Yoshinori Sato, Noriyoshi Shoji, Keitaro Koroishi
  • Patent number: 6690100
    Abstract: A piezoelectric actuator is formed in a manner which enhances the identifying function of markings provided thereon, and minimizes the influence on the markings when an electrode pattern on the piezoelectric actuator is shifted. The piezoelectric actuator has a piezoelectric element, an electrode pattern formed thereon, and at least one identifying marking formed on the electrode pattern, each identifying marking having a shape comprising multiple sides and being formed at a specific location of the electrode pattern for use in identifying a characteristic of the electrode pattern.
    Type: Grant
    Filed: April 26, 1999
    Date of Patent: February 10, 2004
    Assignee: Seiko Instruments Inc.
    Inventors: Keitaro Koroishi, Hironobu Itoh, Tomoyuki Yoshino
  • Patent number: 6464130
    Abstract: A method is provided for manufacturing a piezoelectric actuator having a piezoelectric element and a lead wire for supplying a drive signal to the piezoelectric element. A melt material is immersed into a fusing agent. A quantity of the material and the fusing agent is supplied to a transfer plate and then adjusted. A preselected quantity of the melt material and the fusing agent is then transferred preselected quantity of the melt material and the fusing agent is supplied from the transfer tool to the lead wire. The melt material is then welded on the lead wire and on the piezoelectric element to thereby connect the lead wire to the piezoelectric element.
    Type: Grant
    Filed: June 19, 2000
    Date of Patent: October 15, 2002
    Assignee: Seiko Instruments Inc.
    Inventors: Hironobu Itoh, Keitaro Koroishi, Tomoyuki Yoshida