Abstract: A display device capable of bearing the stress due to vacuum condition and capable of reducing both weight and depth simultaneously, by incorporating a vacuum envelope with glass screen having a front section made in a curved panel and a rear section being concave toward the inside of the vacuum envelope.

Abstract: There are provided a cathode-ray tube display unit which can be manufactured with reduced weight and cost and which can have a screen plane flattened without the use of any metal band, and a method of making the same. The screen panel is previously deformed by the use of a jig and then sealingly connected to a funnel. After the jig has been removed, the interior of the display tube body is extracted to form a vacuum. The display tube body is distorted by the extraction, but such a distortion can be corrected by deformations previously applied to the display tube body. Thus, the screen plane can be flattened without the use of any metal band.

Abstract: A cathode-ray tube includes a screen region, for displaying images, which consists of two glass layers. An exterior glass layer is formed of glass having a higher X-ray absorption coefficient. An interior glass layer is formed of glass which hardly causes browning. These exterior and interior glasses are connected together by the process of adhesion for example.

Abstract: A cathode ray tube has a metal funnel welded to a metal skirt. The skirt is reinforced to resist tensile stress. Reinforcement is accomplished by thickening the skirt, or corner portions thereof; by welding one or more reinforcing members to the inside or outside of the skirt; by bending the edges of the skirt and funnel and welding the bent parts together; by welding reinforcing plates to corners of the skirt and winding a tension band around the skirt; or by providing a rigid frame with compression members to press inward on the skirt.

Abstract: A semiconductor pressure sensor device that improve the measuring accuracy without providing a silicon base in attaching a semiconductor pressure sensor chip to a lead frame, and a method of manufacturing thereof is disclosed. The semiconductor pressure sensor device includes a die-bond adhesive 10 formed of a resilient material for fixing a semiconductor pressure sensor chip 50 to a lead frame 100, a wire bond receiving projection 4 provided in the diepad where the semiconductor pressure sensor chip 50 is attached for receiving pressure application force from the bottom of the semiconductor pressure sensor chip 50 at the time of wire bonding, and a supporting projection 11 for preventing distortion stress by the wire bond receiving projection 4 from being transmitted. Thermal distortion of the semiconductor pressure sensor chip 50 and the lead frame 100 is absorbed by die-bond adhesive 10.

Abstract: The applications of the CRT proposed by the present invention include televisions and computer terminals, and the object of the present invention is to increase electrical security of the CRT. The CRT has a metal part 8 forming a vacuum glass container in order to reduce the weight of the CRT. A stud pin 12 made of an insulating material is on the inner surface of the metal part and fixes the shadow mask. The metal part 8 is joined between an edge of the panel screen 2a and an edge of the funnel 4, and forms a part of the vacuum container where the highest stress is applied. The stud pin 12 is fixed to the inner surface of the metal part 8 and fixes the shadow mask 10 by sealing to a plate spring 13 welded to the edge of the shadow mask 10. Since the stud pin 12 is insulating, it electrically separates the metal part 8 from the high voltage shadow mask 10. The stud pin 12 has a constriction or a multistage fin, and around the stud pin shielding material 16 made of a metal mesh or a metal plate is placed.

Abstract: A semiconductor pressure sensor device that can improve the measuring accuracy without providing a silicon base in attaching a semiconductor pressure sensor chip to a lead frame, and a method of manufacturing thereof is disclosed. The semiconductor pressure sensor device includes a die-bond adhesive 10 formed of a resilient material for fixing a semiconductor pressure sensor chip 50 to a lead frame 100, a wire bond receiving projection 4 provided in the diepad where the semiconductor pressure sensor chip 50 is attached for receiving pressure application force from the bottom of the semiconductor pressure sensor chip 50 at the time of wire bonding, and a supporting projection 11 for preventing distortion stress by the wire bond receiving projection 4 from being transmitted. Thermal distortion of the semiconductor pressure sensor chip 50 and the lead frame 100 is absorbed by die-bond adhesive 10.

Abstract: A cathode ray tube for use as a video display or the like includes a panel, a funnel, and a stress resistant frame having an L-shaped bend and constituted by a metal frame joined to both the panel and the funnel. The stress resistant frame is adapted to reinforce the cathode ray tube against a tensile stress occurring due to a reduction in the internal pressure of the cathode ray tube.