Patents by Inventor Keitaroh NOZAWA

Keitaroh NOZAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11483924
    Abstract: A substrate support structure includes: a substrate support including: a support body; and a protrusion including a base portion and a leading-end portion, the protrusion protruding from the support body; and a substrate having: a substrate body; a through hole provided at the substrate body; and a protruded portion surrounding the through hole, the protruded portion protruding from a first face of the substrate body, in which the base portion of the protrusion passes through the through hole, and the leading-end portion protrudes from the first face of the substrate body inside the protruded portion and engages with the substrate body such that the through hole is covered.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: October 25, 2022
    Assignee: YAZAKI CORPORATION
    Inventors: Keitaroh Nozawa, Hidehiko Shimizu, Shinji Kawai
  • Publication number: 20220037735
    Abstract: A battery connection module includes a plurality of bus bars provided on a battery stack in which a plurality of battery packs are assembled, and attached to electrodes of the battery packs, a flexible printed wiring board provided on the battery stack, and a first electronic component electrically connected to the flexible printed wiring board. The flexible printed wiring board includes a side surface portion which extends outward from above the battery stack and is bent so as to be fixed to a side surface of the battery stack, and the first electronic component is provided on the side surface portion.
    Type: Application
    Filed: July 28, 2021
    Publication date: February 3, 2022
    Applicant: Yazaki Corporation
    Inventors: Hidehiko SHIMIZU, Keitaroh NOZAWA, Shuhei URAKAMI, Shinji KAWAI
  • Publication number: 20210360769
    Abstract: A substrate support structure includes: a substrate support including: a support body; and a protrusion including a base portion and a leading-end portion, the protrusion protruding from the support body; and a substrate having: a substrate body; a through hole provided at the substrate body; and a protruded portion surrounding the through hole, the protruded portion protruding from a first face of the substrate body, in which the base portion of the protrusion passes through the through hole, and the leading-end portion protrudes from the first face of the substrate body inside the protruded portion and engages with the substrate body such that the through hole is covered.
    Type: Application
    Filed: May 12, 2021
    Publication date: November 18, 2021
    Applicant: Yazaki Corporation
    Inventors: Keitaroh NOZAWA, Hidehiko Shimizu, Shinji Kawai