Patents by Inventor Keitarou NAKAMA

Keitarou NAKAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device and method for manufacturing same
    Patent number: 9941182
    Abstract: In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: April 10, 2018
    Assignee: DENSO CORPORATION
    Inventors: Norihisa Imaizumi, Yuuki Sanada, Masayuki Takenaka, Shinya Uchibori, Kengo Oka, Tasuke Fukuda, Keitarou Nakama
  • ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
    Publication number: 20160104653
    Abstract: In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.
    Type: Application
    Filed: June 3, 2014
    Publication date: April 14, 2016
    Inventors: Norihisa IMAIZUMI, Yuuki SANADA, Masayuki TAKENAKA, Shinya UCHIBORI, Kengo OKA, Tasuke FUKUDA, Keitarou NAKAMA