Abstract: Electrophoretic display modules including various types of backplane and edge seals for protecting electro-optic displays against environmental contaminants are described. In particular, the disclosed module designs allow for very narrow edge seals, i.e., less than 1 mm in thickness. In one type of seal, the electro-optic layer is sandwiched between a backplane and a protective sheet and a sealing material extends between the backplane and the protective sheet. In some instances, the protective sheet includes several layers of transparent materials to provide physical protection and reduce the ingress of water.

Abstract: The subject matter presented herein relates to a method for producing a backplane for electro-optic displays. The method may include providing a substrate coated with a first conductive material on a first side and a second conductive material on a second side, the second side being positioned opposite from the first side, patterning the first conductive material by cutting through the first conductive material, wherein the patterning of the first conductive material creates electrical isolated conductive segments to be controlled by a driver circuit and creating a plurality of vias on the substrate, the plurality of vias extending through the substrate and providing electrical conductivity between the first and second sides. The method may further include creating a plurality of conductive traces on the second side of the substrate by patterning the second conductive material by locally align the vias to the driver circuit.

Abstract: The subject matter presented herein relates to a method for producing a backplane for electro-optic displays. The method may include providing a substrate coated with a first conductive material on a first side and a second conductive material on a second side, the second side being positioned opposite from the first side, patterning the first conductive material by cutting through the first conductive material, wherein the patterning of the first conductive material creates electrical isolated conductive segments to be controlled by a driver circuit and creating a plurality of vias on the substrate, the plurality of vias extending through the substrate and providing electrical conductivity between the first and second sides. The method may further include creating a plurality of conductive traces on the second side of the substrate by patterning the second conductive material by locally align the vias to the driver circuit.