Abstract: A circuit assembly includes one or more electrical conductors. Each of the electrical conductors has a first axial end and a second axial end; the first axial end is disposed opposite the second axial end. The assembly further comprises a non-electrically conductive retainer component operable to: i) retain the electrical conductor and ii) contact a lateral side and/or tip of the electrical conductor onto a conductive pad of a circuit board. The retainer component exerts an appropriate force with respect to the one or more electrical conductors such that, a respective lateral side and/or tip of each of the electrical conductors contact a corresponding electrically conductive pad on the circuit board.

Abstract: A circuit assembly includes one or more electrical conductors. Each of the electrical conductors has a first axial end and a second axial end; the first axial end is disposed opposite the second axial end. The assembly further comprises a non-electrically conductive retainer component operable to: i) retain the electrical conductor and ii) contact a lateral side and/or tip of the electrical conductor onto a conductive pad of a circuit board. The retainer component exerts an appropriate force with respect to the one or more electrical conductors such that, a respective lateral side and/or tip of each of the electrical conductors contact a corresponding electrically conductive pad on the circuit board.

Abstract: A fabrication resource receives a base material such as metal or other suitable material. The fabrication resource applies optical energy to a surface of the base material. Application of the optical energy transforms a texture on the surface of the base material. Subsequent to transforming the texture on the surface of the base material, the fabrication resource then adheres a supplemental material such as paste including glass powder to the transformed texture on the surface. Application of heat to the paste fuses the glass powder of the applied paste into a glass layer that adheres to the transformed texture. The fabrication resource contacts an electronic circuit device onto an exposed facing of the glass layer and reheats the combination of the electronic circuit device, glass layer, and base material. The application of heat secures the electronic circuit device to the layer of glass and corresponding base material.

Abstract: A chassis system for housing a plurality of circuit boards, such as PCI standard bus boards, provides a rack-mountable chassis having an open front side and a motherboard with a plurality of board connectors arranged side-by-side with respect to the front end. The boards are mounted in individual frameworks that facilitate ready installation and removal from the chassis. In particular, the chassis includes a plurality of receiving blocks at the bottom rear of the chassis, aligned with each of the motherboard connectors. The receiving blocks receive pivots mounted on the back of each framework. The framework is inserted into, and removed from the front opening of the chassis in an upwardly pivoted position that clears the motherboard connectors and other obstructions in the chassis. The framework is pivoted into and out of engagement with the motherboard when the pivot is located in the receiving blocks. The chassis can include top-mounted tracks. The tracks receive rollers on the framework.

Abstract: A chassis system for housing a plurality of circuit boards, such as PCI standard bus boards, provides a rack-mountable chassis having an open front side and a motherboard with a plurality of board connectors arranged side-by-side with respect to the front end. The boards are mounted in individual frameworks that facilitate ready installation and removal from the chassis. In particular, the chassis includes a plurality of tracks on its top, aligned with each of the motherboard connectors. The tracks receive a track-engaging portion of each framework. A board-carrying portion of the framework is connected to the track-engaging portion by a lifter mechanism, such as a set of sloped slots and interengaging rollers. The framework can be inserted and removed from the chassis with the board connector raised above the motherboard connector.

Abstract: Fault-tolerant power distribution system for back-mounted hardware in which a backplane arrangement delivers alternative sources of system power in a prioritized pattern to each of a plurality of fault-tolerant electronic cards via a plurality of system slots, each slot including a power port having electrical contacts in a common system pinout, and the cooperating system cards have electrical contacts in the same common system pinout. Any of the system cards can be installed in any system slot and will receive the system power in one of a plurality of fault-tolerant prioritizations.