Abstract: Semiconductor devices (140, 410, 610) are tested or burned-in while in a handling or shipping tray (100, 500, 700) using a test contactor (150, 450, 750, 850, 950) which engages either a cell (120, 520, 720) of the tray or the device itself during testing. A tray having a plurality of devices is moved by a handling system in an initial alignment operation where one or more devices is generally aligned beneath the test contactor. Then, the tray or the test contactor is moved in a vertical direction so that engagement features of the test contactor engage either the tray cell or the device to be tested to bring the device into final alignment for testing. Upon final alignment, contacts (152, 452, 752, 852, 952) of the test contactor physically and electrically contact leads (141, 414, 614) and in-tray testing of the devices is performed. In-tray testing reduces manufacturing cycle and minimizes device lead damage by eliminating pick and place handling of the devices at test.