Patents by Inventor Keith Becken

Keith Becken has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070128966
    Abstract: A method of encapsulating a display device between substrates with a glass frit. The method includes depositing a frit having an optical absorption ? which is a function of wavelength onto a first substrate wherein the deposited frit has a height h, placing a second substrate in contact with the frit, sealing together the substrates by traversing a laser light having a wavelength ? over the frit at a speed greater than about 5 mm/s, and wherein ?·h at ? is between 0.4 and about 1.
    Type: Application
    Filed: November 7, 2006
    Publication date: June 7, 2007
    Inventors: Keith Becken, Stephan Logunov
  • Publication number: 20070128967
    Abstract: A method of minimizing stress in an OLED device laser sealing process using an elongated laser beam. A laser beam having an intensity distribution which decreases as a function of distance from the longitudinal axis of the beam is passed through a mask to create an elongated beam having a length-wise intensity distribution which decreases as a function of distance from the axis of the beam and a substantially constant width-wise intensity distribution. The elongated beam is traversed over a line of frit disposed between two substrates. The tails of the length-wise intensity distribution provide for a slow cool down of the frit as the beam traverses the line of frit.
    Type: Application
    Filed: November 15, 2006
    Publication date: June 7, 2007
    Inventors: Keith Becken, Stephan Logunov
  • Publication number: 20060082298
    Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment. Some examples of such glass packages are organic emitting light diode (OLED) displays, sensors, and other optical devices. The present invention is demonstrated using an OLED display as an example.
    Type: Application
    Filed: October 20, 2004
    Publication date: April 20, 2006
    Inventors: Keith Becken, Stephan Logunov, Kamjula Reddy, Joseph Schroeder, Holly Strzepek
  • Publication number: 20060084348
    Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment. Some examples of such glass packages are organic emitting light diode (OLED) displays, sensors, and other optical devices. The present invention is demonstrated using an OLED display as an example.
    Type: Application
    Filed: March 30, 2005
    Publication date: April 20, 2006
    Inventors: Keith Becken, Stephan Logunov, Kamjula Reddy, Joseph Schroeder, Holly Strzepek