Abstract: In one embodiment, a channel board-to-DIB junction multi-module is provided which includes performance critical channel electronics modules within an enclosure encasing the plurality of performance critical channel electronics modules. A coolant distribution apparatus is provided within the enclosure to provide cooling within the enclosure. A channel board connection apparatus is located at a channel board end of the channel board-to-DIB junction multi-module and a cable-less connection apparatus is located at a DIB end of the channel board-to-DIB junction multi-module.

Abstract: A probe card assembly can comprise a first source of compliance and a second source of compliance. The probe card assembly can further comprise a controller, which can be configured to apportion a total compliance demand placed on the probe card assembly between the first source of compliance and the second source of compliance.

Abstract: In one embodiment, a channel board-to-DIB junction multi-module is provided which includes performance critical channel electronics modules within an enclosure encasing the plurality of performance critical channel electronics modules. A coolant distribution apparatus is provided within the enclosure to provide cooling within the enclosure. A channel board connection apparatus is located at a channel board end of the channel board-to-DIB junction multi-module and a cable-less connection apparatus is located at a DIB end of the channel board-to-DIB junction multi-module.

Abstract: A probe card assembly can comprise a first source of compliance and a second source of compliance. The probe card assembly can further comprise a controller, which can be configured to apportion a total compliance demand placed on the probe card assembly between the first source of compliance and the second source of compliance.

Abstract: A probe card assembly can comprise a probe head assembly and a wiring substrate. The probe head assembly can comprise a plurality of probes disposed to contact an electronic device disposed on a holder in a test housing. The wiring substrate can include an electrical interface to a test controller and a plurality of electrical wiring composing electrical paths between the electrical interface and ones of the probes, and the wiring substrate can comprise a first portion on which the electrical interface is disposed and a second portion composing the probe head assembly. The second portion of the wiring substrate can be moveable with respect to the first portion of the wiring substrate.

Abstract: In one embodiment, a tester interface module for connecting a plurality of signal paths from at least one electronic assembly to at least one other electronic assembly is provided. The interface module includes a capture board having center conductor vias with center conductor holes extending through the capture board. Axial cables secured to the capture board have center conductors extending at least part way through a corresponding center conductor hole of the center conductor via. An interface component is adjacent to the capture board, the conductor paths being conductively bonded to the conductor vias of the capture board so as to electrically connect center conductors to corresponding conductor paths. The conductor paths of the interface component are arranged to allow connection with an electronic assembly.

Abstract: In one embodiment, a compliant contactor is provided which includes a center conductor and an outer conductor with a spacer therebetween. The outer conductor has a mating end adapted to be capable of flexibly contacting an outer conductor mating surface prior to the center conductor contacting a center conductor mating surface.

Abstract: In one embodiment, a tester interface module for connecting a plurality of signal paths from at least one electronic assembly to at least one other electronic assembly is provided. The interface module includes a capture board having center conductor vias with center conductor holes extending through the capture board. Axial cables secured to the capture board have center conductors extending at least part way through a corresponding center conductor hole of the center conductor via. An interface component is adjacent to the capture board, the conductor paths being conductively bonded to the conductor vias of the capture board so as to electrically connect center conductors to corresponding conductor paths. The conductor paths of the interface component are arranged to allow connection with an electronic assembly.

Abstract: In at least one embodiment, an interface assembly is provided which is capable of connecting with a receptor. The interface assembly includes a connector, a base, and a linkage set between the connector and base. The linkage can include a spring assembly and a cable assembly. The connector is capable of connecting with the receptor to form electrical connections, fluid connections or other such connections. The spring assembly is a deformable member that is attached to the base and to the connector, such that the connector is capable of moving in six degrees of freedom. The cable assembly is attached to the base and the connector. The cable assembly is capable of limiting motion and positioning of the connector in at least one degree of freedom. As such, the cable assembly can set the connector at an initial position or within an initial region.

Abstract: In one embodiment a high power interface apparatus is provided having a multilayer laminated cable including force conductor planes having flush and recessed portions and return conductor planes having flush and recessed portions. The flush portions of the conductor planes extend to a contact end of the laminated cable and the recessed portions are removed from the contact end. The flush portions are aligned along axes at the contact end. The flush portions of the return conductor planes are aligned at the contact end along axes aligned within recessed portions of the force conductor planes. A dielectric material separates the force and return conductor planes. Surface contact pads may be provided on the contact end including force contact pads, each contacting and extending along aligned flush portions of the force conductor planes, and including return conductor pads, each contacting and extending along aligned flush portions of the return conductor planes.

Abstract: A router for funneling a plurality of conductors is disclosed. The router includes a routing unit and a plurality of conductor paths. The conductor paths are directed through the routing unit and are adapted to receive the conductors. The routing unit and the plurality of conductor paths are formed by a three-dimensional fabrication process.

Abstract: Automatic test equipment adapted for testing a plurality of devices-under-test (DUTs) is disclosed. The automatic test equipment includes a mainframe computer and a test head coupled to the mainframe computer. The test head includes a low-profile tester interface having a first interface board and a device board. The device board engages contact points on the DUTs and includes a topside. A hard stop is mounted to the first interface board and defines a reference plane. The hard stop is adapted to engage the device board topside to vertically fix the device board, positionally with respect to the first interface board. The automatic test equipment further includes a compliant interconnect array adapted for compression between the first interface board and the device board.

Abstract: In one embodiment a high power interface apparatus is provided having a multilayer laminated cable including force conductor planes having flush and recessed portions and return conductor planes having flush and recessed portions. The flush portions of the conductor planes extend to a contact end of the laminated cable and the recessed portions are removed from the contact end. The flush portions are aligned along axes at the contact end. The flush portions of the return conductor planes are aligned at the contact end along axes aligned within recessed portions of the force conductor planes. A dielectric material separates the force and return conductor planes. Surface contact pads may be provided on the contact end including force contact pads, each contacting and extending along aligned flush portions of the force conductor planes, and including return conductor pads, each contacting and extending along aligned flush portions of the return conductor planes.

Abstract: A router for funneling a plurality of conductors is disclosed. The router includes a routing unit and a plurality of conductor paths. The conductor paths are directed through the routing unit and are adapted to receive the conductors. The routing unit and the plurality of conductor paths are formed by a three-dimensional fabrication process.