Abstract: A printed circuit board test fixture includes a plurality of flexible printed circuits having circuit traces on one side for interconnecting the test probe pin assemblies of the fixture with the interface connector pins for the interface panel of the fixture. The flexible circuits are folded in the fixture housing to provide spaced apart non-contacting layers of first contact areas for connection to the test probe pin assemblies and spaced apart non-contacting layers of second contact areas for connection to the interface connector pins. The layers of flexible circuit of each contact area receive the test probe pin assemblies and interface connector pins which secure the layers of flexible circuit in the fixture. The test probe pin assemblies and the interface connector pins make electrical and mechanical engagement with terminal apertures in the layers of flexible circuit.

Abstract: A method of making a wiping connection between a male connector and a female connector in a single layer of a flexible polymeric dielectric film substrate having a thickness of less than 0.012 inches is disclosed. A laser directs a beam towards the substrate cutting a smooth pattern through the substrate to define a passage extending through the substrate and providing at least one resilient foldable flap normally closing the passage through the substrate. Next an electrically conductive material is coated on the flexible polymeric dielectric film substrate including a circuit trace providing an electrical contact land area surrounding the pattern extending over the foldable flap to form the female connector.

Abstract: A method of using a laser to cut a groove or pocket of predetermined depth of less than about 0.005 inches in a stencil comprising a polyimide sheet having a thickness in the range of 0.005 to 0.012 inches including the steps of mounting the stencil on a movable work table and positioning and maintaining a laser a predefined distance from the polyimide sheet above the work table. A laser beam is directed against the polyimide sheet to cut an indentation into said polyimide sheet. The laser beam has a pulse duration and a power level to make the cut into the polyimide sheet. The method further includes the step of directing a gas against the polymide sheet where the laser beam cuts into said polyimide sheet. The gas is pressurized. The depth of the indentation cut into the polyimide sheet by the laser is determined by choosing the pressure of the gas relative to choosing the pulse duration and the power level of the laser beam.