Patents by Inventor Keith C. Knutson

Keith C. Knutson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9469791
    Abstract: A hot melt adhesive composition includes at least a semi-crystalline copolymer of propylene and a polyethylene wax having a Brookfield viscosity of about 20 cP to 500 cP at 140° C., a density of about 0.95 g/cm3 to 0.99 g/cm3 between 23° C. and 25° C., and a Mettler drop point of about 110° C. to 135° C., wherein the composition is characterized by a effective set time of about 0.1 second to 5 seconds. Articles including the composition and methods of making articles including the composition are described.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: October 18, 2016
    Assignee: ADHERENT LABORATORIES, INC.
    Inventors: Keith C. Knutson, Thomas H. Quinn
  • Patent number: 9200185
    Abstract: A hot melt adhesive composition includes at least a semi-crystalline copolymer of propylene and a polyethylene wax having a Brookfield viscosity of about 20 cP to 500 cP at 140° C., a density of about 0.95 g/cm3 to 0.99 g/cm3 between 23° C. and 25° C., and a Mettler drop point of about 110° C. to 135° C., wherein the composition is characterized by a effective set time of about 0.1 second to 5 seconds. Articles including the composition and methods of making articles including the composition are described.
    Type: Grant
    Filed: August 20, 2014
    Date of Patent: December 1, 2015
    Assignee: ADHERENT LABORATORIES, INC.
    Inventors: Keith C. Knutson, Thomas H. Quinn, William L. Bunnelle
  • Publication number: 20150080511
    Abstract: A hot melt adhesive composition includes at least a semi-crystalline copolymer of propylene and a polyethylene wax having a Brookfield viscosity of about 20 cP to 500 cP at 140° C., a density of about 0.95 g/cm3 to 0.99 g/cm3 between 23° C. and 25° C., and a Mettler drop point of about 110° C. to 135° C., wherein the composition is characterized by a effective set time of about 0.1 second to 5 seconds. Articles including the composition and methods of making articles including the composition are described.
    Type: Application
    Filed: August 20, 2014
    Publication date: March 19, 2015
    Inventors: Keith C. Knutson, Thomas H. Quinn, William L. Bunnelle
  • Publication number: 20130060215
    Abstract: A hot melt adhesive composition includes at least a semi-crystalline copolymer of propylene and a polyethylene wax having a Brookfield viscosity of about 20 cP to 500 cP at 140° C., a density of about 0.95 g/cm3 to 0.99 g/cm3 between 23° C. and 25° C., and a Mettler drop point of about 110° C. to 135° C., wherein the composition is characterized by a effective set time of about 0.1 second to 5 seconds. Articles including the composition and methods of making articles including the composition are described.
    Type: Application
    Filed: April 27, 2012
    Publication date: March 7, 2013
    Applicant: ADHERENT LABORATORIES, INC.
    Inventors: Keith C. Knutson, Thomas H. Quinn, William L. Bunnelle
  • Patent number: 7199180
    Abstract: Disclosed are adhesives and processes for preparing the same, comprising at least one first homogeneous ethylene/?-olefin interpolymer, and optionally at least one tackifier, and optionally at least one plasticizer. The claimed adhesives are useful as adhesives such as are employed in various applications, such as in masking tape, clear office tape, labels, decals, bandages, decorative and protective sheets (such as shelf and drawer liners), floor tiles, sanitary napkin/incontinence device placement strips, sun control films, the joining of gaskets to automobile windows, packaging, bookbinding, construction of nonwoven articles, and insulation bonding.
    Type: Grant
    Filed: March 14, 1997
    Date of Patent: April 3, 2007
    Assignees: The Dow Chemical Company, H.B. Fuller Licensing & Financing Inc.
    Inventors: Eugene R. Simmons, William L. Bunnelle, David B. Malcolm, Keith C. Knutson, Thomas F. Kauffman, Mark S. Kroll, Michael S. Keehr, Deepak R. Parikh, Jimmy D. Allen, David R. Speth, Selim Yalvac, Malcolm F. Finlayson, Cynthia L. Rickey
  • Patent number: 5916959
    Abstract: A hot melt adhesive composition comprising from about 5% to about 15% by weight of at least one radial styrene-isoprene-styrene block copolymer having the general configuration (pS--pI--pB).sub.n X wherein n is a number greater than 2, said block copolymer having a molecular weight from about 90,000 to about 380,000, and preferably from about 100,000 to about 250,000, and a styrene content from about 15% to about 35% by weight, and preferably from about 20% to about 30% by weight; up to about 10% of a compatible polymer, wherein the total polymer content does not exceed 15%; from about 30% to about 60% by weight of at least one compatible tackifying resin; from about 20% to about 40% by weight of at least one compatible plasticizer; and from about 0.1% to about 2% by weight stabilizer.
    Type: Grant
    Filed: March 29, 1996
    Date of Patent: June 29, 1999
    Assignee: H.B. Fuller Licensing & Financing, Inc.
    Inventors: Jeffrey S. Lindquist, Keith C. Knutson
  • Patent number: 5459184
    Abstract: Hot melt adhesives of this invention can comprise a water-soluble polyalkylenimine, an hydroxy substituted organic compound, and optimally a plasticizer, a tackifier, and other ingredients. The adhesives are water actuated, and can be water activated, cleaned by aqueous systems, or recycled in aqueous systems.
    Type: Grant
    Filed: April 2, 1985
    Date of Patent: October 17, 1995
    Assignee: H. B. Fuller Company
    Inventors: William L. Bunnelle, Keith C. Knutson, Robert Hume, III
  • Patent number: 5143961
    Abstract: Normally water insoluble hot melt adhesive compositions containing structural polymers such as A-B-A block copolymers, butyl rubbers, polyesters, ethylene vinyl acetates, ethylene acrylic acid polymers can be made sensitive to the action of water using an effective water sensitizing amount of a polyalkyloxazoline polymer in the hot melt adhesive. The polyalkyloxazoline polymer can be incorporated into a single phase adhesive composition with the structural polymer using an effective amount of a hydroxyl or carboxylic acid compound.
    Type: Grant
    Filed: December 21, 1989
    Date of Patent: September 1, 1992
    Assignee: H. B. Fuller Licensing & Financing Inc.
    Inventors: Steven L. Scholl, Eugene R. Simmons, Keith C. Knutson, William L. Bunnelle
  • Patent number: 5071914
    Abstract: The adhesive properties of a hot melt adhesive, comprising a base polymer and a tackifying resin, can be improved by introducing into the hot melt adhesive an epoxy adduct comprising the reaction product between a compound such as a polymer having at least one active hydrogen and an epoxy compound.
    Type: Grant
    Filed: August 17, 1989
    Date of Patent: December 10, 1991
    Assignee: H. B. Fuller Company
    Inventors: John M. Zimmel, Pamela M. Klinkenberg, William L. Bunnelle, Keith C. Knutson
  • Patent number: 4871803
    Abstract: The adhesive properties of a hot melt adhesive, comprising a base polymer and a tackifying resin, can be improved by introducing into the hot melt adhesive an epoxy adduct comprising the reaction product between a compound such as a polymer having at least one active hydrogen and an epoxy compound.
    Type: Grant
    Filed: February 3, 1988
    Date of Patent: October 3, 1989
    Assignee: H. B. Fuller
    Inventors: John M. Zimmel, Pamela M. Klinkenberg, William L. Bunnelle, Keith C. Knutson