Abstract: Low dielectric materials and films comprising same have been identified for improved performance when used as performance materials, for example, in interlevel dielectrics integrated circuits as well as methods for making same. In one aspect of the present invention, the performance of the dielectric material may be improved by controlling the weight percentage of ethylene oxide groups in the at least one porogen.

Abstract: A composition for use as a catalyst in, for example, a fuel cell, the composition comprising platinum, copper and titanium, or an oxide, carbide and/or salt of one or more of platinum, copper and titanium, wherein the sum of the concentrations of platinum, copper and titanium, including an oxide, carbide and/or salt thereof, is greater than about 90 atomic percent.

Abstract: Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. These materials are characterized as having a dielectric constant (?) a dielectric constant of about 3.7 or less; a normalized wall elastic modulus (E0?), derived in part from the dielectric constant of the material, of about 15 GPa or greater; and a metal impurity level of about 500 ppm or less. Low dielectric materials are also disclosed having a dielectric constant of less than about 1.95 and a normalized wall elastic modulus (E0?), derived in part from the dielectric constant of the material, of greater than about 26 GPa.

Abstract: Low dielectric materials and films comprising same have been identified for improved performance when used as performance materials, for example, in interlevel dielectrics integrated circuits as well as methods for making same. In one aspect of the present invention, the performance of the dielectric material may be improved by controlling the weight percentage of ethylene oxide groups in the at least one porogen.

Abstract: A fuel cell electrocatalyst that contains platinum, vanadium, and iron. In one embodiment, the fuel cell electrocatalyst has a concentration of platinum that is less than 50 atomic percent. In another embodiment, the fuel cell electrocatalyst has a concentration of vanadium that is greater than 25 atomic percent.

Abstract: Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. These materials are characterized as having a dielectric constant (?) a dielectric constant of about 3.7 or less; a normalized wall elastic modulus (E0?), derived in part from the dielectric constant of the material, of about 15 GPa or greater; and a metal impurity level of about 500 ppm or less. Low dielectric materials are also disclosed having a dielectric constant of less than about 1.95 and a normalized wall elastic modulus (E0?), derived in part from the dielectric constant of the material, of greater than about 26 GPa.

Abstract: A fuel cell catalyst comprising platinum, titanium and tungsten. In one or more embodiments, the concentration of platinum is less than 60 atomic percent, and/or the concentration of titanium is at least 20 atomic percent, and/or the concentration of tungsten is at least 25 atomic percent.

Abstract: A composition for use as a catalyst in, for example, a fuel cell, the composition comprising platinum, palladium and titanium, or an oxide, carbide and/or salt of one or more of platinum, palladium and titanium, wherein the sum of the concentrations of platinum, palladium and titanium, including an oxide, carbide and/or salt thereof, is greater than about 90 atomic percent.

Abstract: A composition for use as a catalyst in, for example, a fuel cell, the composition comprising platinum, copper and tungsten, or an oxide, carbide and/or salt of one or more of platinum, copper and tungsten, wherein the sum of the concentrations of platinum, copper and tungsten, or an oxide, carbide and/or salt thereof, is greater than 90 atomic percent.

Abstract: The present invention is directed to a composition for use as a catalyst in, for example, a fuel cell, the composition comprising platinum and copper, wherein the concentration of platinum is greater than 50 atomic percent and less than about 80 atomic percent, and further wherein the composition has a particle size which is less than 35 angstroms. The present invention is further directed to various methods for preparing such a composition.

Abstract: A fuel cell catalyst comprising platinum, chromium, and copper, nickel or a combination thereof. In one or more embodiments, the concentration of platinum is less than 50 atomic percent, and/or the concentration of chromium is less than 30 atomic percent, and/or the concentration of copper, nickel, or a combination thereof is at least 35 atomic percent.

Abstract: Low dielectric materials and films comprising same have been identified for improved performance when used as performance materials, for example, in interlevel dielectrics integrated circuits as well as methods for making same. In one aspect of the present invention, the performance of the dielectric material may be improved by controlling the weight percentage of ethylene oxide groups in the at least one porogen.

Abstract: Low dielectric materials and films comprising same have been identified for improved performance when used as performance materials, for example, in interlevel dielectrics integrated circuits as well as methods for making same. In one aspect of the present invention, the performance of the dielectric material may be improved by controlling the weight percentage of ethylene oxide groups in the at least one porogen.

Abstract: Low dielectric materials and films comprising same have been identified for improved performance when used as performance materials, for example, in interlevel dielectrics integrated circuits as well as methods for making same. In one aspect of the present invention, the performance of the dielectric material may be improved by controlling the weight percentage of ethylene oxide groups in the at least one porogen.

Abstract: A composition for use as a catalyst in, for example, a fuel cell, the composition comprising platinum, copper, and nickel, wherein the concentration of platinum therein is greater than 50 atomic percent and less than 80 atomic percent, and further wherein the sum of the concentrations of platinum, copper and nickel is greater than 95 atomic percent.

Abstract: Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. These materials are characterized as having a dielectric constant (?) a dielectric constant of about 3.7 or less; a normalized wall elastic modulus (E0?), derived in part from the dielectric constant of the material, of about 15 GPa or greater; and a metal impurity level of about 500 ppm or less. Low dielectric materials are also disclosed having a dielectric constant of less than about 1.95 and a normalized wall elastic modulus (E0?), derived in part from the dielectric constant of the material, of greater than about 26 GPa.

Abstract: The present invention is generally relates to the field of research for the discovery of films with desirable properties, and to a process for making such films. More particularly, the present invention is directed to a system or an apparatus and a method for the rapid formation of a library of liquid samples and a library of thin films therefrom, as well as to the rapid screening of these films to identify those having desirable properties, all of which may be achieved using combinatorial techniques.

Abstract: Low dielectric materials and films comprising same have been identified for improved performance when used as performance materials, for example, in interlevel dielectrics integrated circuits as well as methods for making same. In one aspect of the present invention, the performance of the dielectric material may be improved by controlling the weight percentage of ethylene oxide groups in the at least one porogen.

Abstract: Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. These materials are characterized as having a dielectric constant (&kgr;) a dielectric constant of about 3.7 or less; a normalized wall elastic modulus (E0′), derived in part from the dielectric constant of the material, of about 15 GPa or greater; and a metal impurity level of about 500 ppm or less. Low dielectric materials are also disclosed having a dielectric constant of less than about 1.95 and a normalized wall elastic modulus (E0′), derived in part from the dielectric constant of the material, of greater than about 26 GPa.

Abstract: In a method and apparatus for forming a plurality of films on the surface of a substrate, at least two liquid samples are deposited by a deposition device onto the substrate surface. The substrate is moved so that the liquid samples on the substrate are subjected to a non-contact spreading force sufficient to cause the samples to spread over the surface to form a respective film thereon. At least a portion of each film is discrete from one or more other films formed on each substrate surface. In another embodiment, liquid samples of different compositions are deposited on an array of substrates. The liquid samples on at least two of the substrates are subjected to non-contact spreading forces during overlapping durations of time whereby the spreading forces are sufficient to cause the samples to spread over respective surfaces of the substrates to form films thereon.