Abstract: A shower system includes on one or more valves and a plurality of showerheads. The plurality of showerheads are electrically coupled to one another and configured to receive electrical signals from one another. The plurality of showerheads are fluidly coupled to the one or more valves and configured to receive water therefrom. The plurality of showerheads includes a sprayer, one or more sensors, and an integrated user interface. The sprayer is configured to dispense water provided by the one or more valves. The one or more sensors are configured to register motion gestures made by a user. The integrated user interface is configured to control operation of the sprayer. The one or more sensors generates an internal signal to the plurality of showerheads corresponding to the motion gesture. One of the plurality of showerheads is a master showerhead.

Abstract: A metal-to-metal seal for sealing an annular space between a well casing and a wellbore. The seal includes an inner portion and an outer portion, each portion including a central seal portion. The central seal portion has a concave shape in a de-energized state which curves towards the centerline of the seal and is capable of flexing radially outward towards surface of the annular space when energized. The central seal portion further includes at least one outer ridge extending outward away from the centerline of the seal and sealingly engages with the outer annular surface when energized.

Abstract: Disclosed is a method of reducing surface unevenness of a semiconductor wafer (100). In a preferred embodiment, the method comprises: removing a portion of a deposited layer and a protective layer thereon using a first slurry to provide an intermediate surface (1123). In the described embodiment, the deposited layer includes an epitaxial layer (112) and the protective layer includes a first dielectric layer (113). The first slurry includes particles with a hardness level the same as or exceeding that of the epitaxial layer (112). A slurry for use in wafer fabrication for reducing surface unevenness of a semiconductor wafer is also disclosed.

Abstract: Disclosed is a method of reducing surface unevenness of a semiconductor wafer (100). In a preferred embodiment, the method comprises: removing a portion of a deposited layer and a protective layer thereon using a first slurry to provide an intermediate surface (1123). In the described embodiment, the deposited layer includes an epitaxial layer (112) and the protective layer includes a first dielectric layer (113). The first slurry includes particles with a hardness level the same as or exceeding that of the epitaxial layer (112). A slurry for use in wafer fabrication for reducing surface unevenness of a semiconductor wafer is also disclosed.

Abstract: Systems comprising a combination of the handheld imaging system with a nanoparticle multimodal contrast agent are disclosed. The imaging system exploits the advantages of both near-infrared emission and the photoacoustic effect by employing calcium phosphosilicate nanocolloid that encapsulates NIR and CT/MRI contrast agents for enhanced deep tissue imaging as well as a portable NIR/PA system using a tunable pulsed laser, CCD imaging technology and acoustic transducer arrays. Methods for using the system, for example in rapid diagnosis of trauma such as that inflicted on a battlefield, are provided.

Abstract: Systems and methods are provided for staining tissue with multiple biologically specific heavy metal stains and then performing X-ray imaging, either in projection or tomography modes, using either a plurality of illumination energies or an energy sensitive detection scheme. The resulting energy-weighted measurements can then be used to decompose the resulting images into quantitative images of the distribution of stains. The decomposed images may be false-colored and recombined to make virtual X-ray histology images. The techniques thereby allow for effective differentiation between two or more X-ray dyes, which had previously been unattainable in 3D imaging, particularly 3D imaging of features at the micron resolution scale. While techniques are described in certain example implementations, such as with microtomography, the techniques are scalable to larger fields of view, allowing for use in 3D color, X-ray virtual histology of pathology specimens.