Abstract: An improved system and method measuring a temperature in a power controller is provided. The system includes a circuit board, a solid state switching device, a heat sink, and a temperature sensor. The solid state switching device may be mounted on the circuit board and controls the switching of power to an industrial load. The heat sink is mounted on the solid state switching device such that a first portion of the heat sink is thermal communication with the solid state switching device and a second portion of the heat sink is in thermal communication with an exposed portion of a trace on the circuit board. The temperature sensor may be in thermal communication with the trace. As such, the temperature sensor may be in thermal communication with the solid state switching device through the trace of the circuit board.

Abstract: An improved system and method measuring a temperature in a power controller is provided. The system includes a circuit board, a solid state switching device, a heat sink, and a temperature sensor. The solid state switching device may be mounted on the circuit board and controls the switching of power to an industrial load. The heat sink is mounted on the solid state switching device such that a first portion of the heat sink is thermal communication with the solid state switching device and a second portion of the heat sink is in thermal communication with an exposed portion of a trace on the circuit board. The temperature sensor may be in thermal communication with the trace. As such, the temperature sensor may be in thermal communication with the solid state switching device through the trace of the circuit board.

Abstract: A power switching device is provided that includes a housing, a printed circuit board disposed within the housing, and a plurality of electrical components mounted to the printed circuit board, including at least one relay. At least one pair of load terminals is connected to the printed circuit board on opposite sides of the relay, and a plurality of heat transfer elements are formed through and in the printed circuit board and are dispersed proximate the relay, around the load terminals, and extending to the peripheral portion.

Abstract: A power switching device is provided that includes a housing, a printed circuit board disposed within the housing, and a plurality of electrical components mounted to the printed circuit board, including at least one relay. At least one pair of load terminals is connected to the printed circuit board on opposite sides of the relay, and a plurality of heat transfer elements are formed through and in the printed circuit board and are dispersed proximate the relay, around the load terminals, and extending to the peripheral portion.

Abstract: A circuit and related methods for use in a hybrid power switching device are provided that include at least one electromechanical relay having a coil and a contact, the electromechanical relay defining a release time and a sticking time during an on-to-off transition. At least one solid state switch is electrically connected to the contact, and a timing circuit is electrically connected to the electromechanical relay and the solid state switch. The timing circuit includes a capacitor electrically connected to a control signal input and at least one resistor electrically connected to the capacitor and to the solid state switch, wherein the capacitor and the resistor are sized such that the capacitor discharges through the resistor to activate the solid state switch for a period of time that is longer than the electromechanical relay release time and sticking time.

Abstract: An arc suppression circuit for a power switch or power supply with a relay having a coil and a set of contacts for providing a portion of an input power as load power to an output. The relay coil is configured for closing the relay contacts in response to receiving relay activating energy and for generating back EMF energy following termination of the receiving of the relay activating energy. A switch is connected in parallel to the relay contacts and is configured for providing a portion of the input power as supplemental load power to the output as a function of back EMF energy. Also, a method of suppressing damaging arcing across relay contacts in a power switch or power supply includes receiving back EMF energy generated by the relay coil following termination of the relay coil receiving activating energy and connecting supplemental load power to the output in parallel with the relay contacts in response to the receiving of the back EMF energy.

Abstract: A hybrid power switching device for eliminating mechanical relay arcing. The device reduces mechanical relay contact damage due to arcing and substantially reduces power dissipation by placing a solid state relay in parallel with a mechanical relay. The solid state relay is preferably a semiconductor triac optically coupled to a light emitting diode. The device takes advantage of the inherent lag time (operating time) when a mechanical relay contact switch closes. The device uses only analog components and controls the triac by means of a Schmitt trigger pulse stretcher. The advantages to the present Schmitt trigger include discrete turn off and a narrow hysteresis. A low level control voltage signal operates the mechanical relay and the Schmitt trigger, or optionally a high level control voltage signal in conjunction with a signal inverter.