Abstract: Techniques are presented for automatically generating Serial Presence Detect (SPD) contents. Standards for specific values associated with SPD contents are electronically represented with SPD tokens and rules. When a memory module is identified, a string of needed SPD tokens are acquired for that memory module. The SPD tokens are searched for in the standards and specific SPD values are assembled for the memory module based on the defined rules. The resulting SPD values which are associated with the rules form the needed SPD contents for the memory module. The SPD contents are used to configure an Electrically Erasable Programmable Read-Only Memory (EEPROM) on a memory module.

Abstract: Techniques are presented for automatically generating Serial Presence Detect (SPD) contents. Standards for specific values associated with SPD contents are electronically represented with SPD tokens and rules. When a memory module is identified, a string of needed SPD tokens are acquired for that memory module. The SPD tokens are searched for in the standards and specific SPD values are assembled for the memory module based on the defined rules. The resulting SPD values which are associated with the rules form the needed SPD contents for the memory module. The SPD contents are used to configure an Electrically Erasable Programmable Read-Only Memory (EEPROM) on a memory module.

Abstract: An interposer for evaluating an electrical characteristic of a ball grid array package or of a semiconductor die thereof. The interposer includes electrically conductive vias positioned correspondingly to bond pads of the semiconductor die and to the electrical contacts or terminals of a carrier substrate of the ball grid array package. Test pads, or contact pads, are disposed proximate an outer periphery of the interposer. Each of the test pads is in electrical communication, preferably by means of electrical traces, with a corresponding electrically conductive via of the interposer. In use, the interposer is aligned with and disposed between the semiconductor die and the carrier substrate such that the test pads of the interposer are at least partially located outside of a periphery of the semiconductor die. Thus, the test pads are exposed around the ball grid array semiconductor die and are, therefore, accessible to electrical testing equipment.

Abstract: An interposer for evaluating an electrical characteristic of a ball grid array package or of a semiconductor die thereof. The interposer includes electrically conductive vias positioned correspondingly to bond pads of the semiconductor die and to the electrical contacts or terminals of a carrier substrate of the ball grid array package. Test pads, or contact pads, are disposed proximate an outer periphery of the interposer. Each of the test pads is in electrical communication, preferably by means of electrical traces, with a corresponding electrically conductive via of the interposer. In use, the interposer is aligned with and disposed between the semiconductor die and the carrier substrate such that the test pads of the interposer are at least partially located outside of a periphery of the semiconductor die. Thus, the test pads are exposed around the ball grid array semiconductor die and are, therefore, accessible to electrical testing equipment.