Abstract: A tactile wafer lifting apparatus includes a pedestal and a vertical drive connected to the pedestal. The vertical drive is defined to provide controlled upward and downward movement of the pedestal. The tactile wafer lifting apparatus also includes a wafer support member disposed over the pedestal. A tactile switch is disposed between the wafer support member and the pedestal such that sufficient downward force on the wafer support member causes activation of the tactile switch. The tactile switch is connected to the vertical drive so as to interrupt upward movement of the pedestal and wafer support member disposed thereover upon activation of the tactile switch.

Abstract: A tactile wafer lifting apparatus includes a pedestal and a vertical drive connected to the pedestal. The vertical drive is defined to provide controlled upward and downward movement of the pedestal. The tactile wafer lifting apparatus also includes a wafer support member disposed over the pedestal. A tactile switch is disposed between the wafer support member and the pedestal such that sufficient downward force on the wafer support member causes activation of the tactile switch. The tactile switch is connected to the vertical drive so as to interrupt upward movement of the pedestal and wafer support member disposed thereover upon activation of the tactile switch.

Abstract: A tactile wafer lifting apparatus includes a pedestal and a vertical drive connected to the pedestal. The vertical drive is defined to provide controlled upward and downward movement of the pedestal. The tactile wafer lifting apparatus also includes a wafer support member disposed over the pedestal. A tactile switch is disposed between the wafer support member and the pedestal such that sufficient downward force on the wafer support member causes activation of the tactile switch. The tactile switch is connected to the vertical drive so as to interrupt upward movement of the pedestal and wafer support member disposed thereover upon activation of the tactile switch.

Abstract: A tactile wafer lifting apparatus includes a pedestal and a vertical drive connected to the pedestal. The vertical drive is defined to provide controlled upward and downward movement of the pedestal. The tactile wafer lifting apparatus also includes a wafer support member disposed over the pedestal. A tactile switch is disposed between the wafer support member and the pedestal such that sufficient downward force on the wafer support member causes activation of the tactile switch. The tactile switch is connected to the vertical drive so as to interrupt upward movement of the pedestal and wafer support member disposed thereover upon activation of the tactile switch.

Abstract: A substrate support having a temperature controlled substrate support surface includes a liquid supply system having at least one liquid source and a plurality of liquid flow passages. The liquid supply system can include valves to control the distribution of liquid to the liquid flow passages. The liquid supply system also can include a controller to control its operation. Liquid can be distributed through the liquid flow passages in various patterns. The substrate support can also include a heat transfer gas supply system, which supplies a heat transfer gas between the substrate support surface and a substrate supported on the substrate support surface.

Abstract: The invention relates to a fluid connector for sealing an interface between first and second fluid passages in a plasma processing apparatus. The fluid connector includes a first end member having a first geometry. The first geometry is arranged to substantially seal a first mating region of the first fluid passage. The fluid connector further includes a second end member having a second geometry. The second geometry is arranged to substantially seal a second mating region of the second fluid passage and the second geometry is configured differently than the first geometry. The fluid connector additionally includes an opening that extends through the first end member and the second end member through which a fluid may pass for use by the, semiconductor processing apparatus so as to fluidly couple the first fluid passage to the second fluid passage.

Abstract: The invention relates to a fluid connector for sealing an interface between first and second fluid passages in a plasma processing apparatus. The fluid connector includes a first end member having a first geometry. The first geometry is arranged to substantially seal a first mating region of the first fluid passage. The fluid connector further includes a second end member having a second geometry. The second geometry is arranged to substantially seal a second mating region of the second fluid passage and the second geometry is configured differently than the first geometry. The fluid connector additionally includes an opening that extends through the first end member and the second end member through which a fluid may pass for use by the semiconductor processing apparatus so as to fluidly couple the first fluid passage to the second fluid passage.

Abstract: Apparatus and method for obtaining improved control of the temperature of a semiconductor wafer over its area during plasma processing including reactive ion etching (RIE) and similar processing. RIE reactor apparatus is provided with a novel chuck arrangement both for holding and for controlling the temperature of a wafer during processing. A top face of a chuck (either mechanical or electrostatic), against which the wafer is held, is configured into a plurality of zones into which zone coolant gas, such as helium, is admitted. The zone coolant gas passes through narrow channels between the top face of the chuck and the Underside of the wafer. Heat transfer from the wafer through the zone coolant gas and to the body of the chuck is controlled zone by zone by separately setting the pressure of zone coolant gas in each of the zones. By properly choosing pressures of zone coolant gas in the respective zones the temperature across the area from the center to the rim of both small and large diameter wafers (e.g.