Patents by Inventor Keith Edward Buchanan

Keith Edward Buchanan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Damascene structure with integral etch stop layer
    Patent number: 7199474
    Abstract: This invention relates to a semiconductor structure for dual damascene processing and includes upper and lower low k dielectric layers formed in a stack when the upper surface of the lower layer has an integral etch stop layer formed by exposing the upper surfaces of the layer H2 plasma without any prior anneal prior to the deposition of the upper layer.
    Type: Grant
    Filed: July 15, 2002
    Date of Patent: April 3, 2007
    Assignee: Aviza Europe Limited
    Inventors: Keith Edward Buchanan, Joon-Chai Yeoh
  • Dielectric film
    Patent number: 6933246
    Abstract: A low k porous dielectric film is described wherein the exposed surface or surfaces of the film are substantially non-porous. A densification method is described for treating such exposed surfaces to render porous surfaces non-porous.
    Type: Grant
    Filed: June 13, 2003
    Date of Patent: August 23, 2005
    Assignee: Trikon Technologies Limited
    Inventors: Keith Edward Buchanan, Joon-Chai Yeoh
  • Damascene structure with integral etch stop layer
    Publication number: 20040219794
    Abstract: This invention relates to a semiconductor structure for dual damascene processing and includes upper and lower low k dielectric layers formed in a stack when the upper surface of the lower layer has an integral etch stop layer formed by exposing the upper surfaces of the layer to H2 plasma without any prior anneal prior to the deposition of the upper layer.
    Type: Application
    Filed: June 18, 2004
    Publication date: November 4, 2004
    Inventors: Keith Edward Buchanan, Joo-Chai Yeoh
  • Dielectric film
    Publication number: 20030232510
    Abstract: A low k porous dielectric film is described wherein the exposed surface or surfaces of the film are substantially non-porous. A densification method is described for treating such exposed surfaces to render porous surfaces non-porous.
    Type: Application
    Filed: June 13, 2003
    Publication date: December 18, 2003
    Inventors: Keith Edward Buchanan, Joon-Chai Yeoh
  • Sputtering apparatus
    Patent number: 6660140
    Abstract: In a sputtering apparatus for depositing material onto a workpiece, an RF coil is disposed in a chamber between a first target and a workpiece support. The RF coil includes a re-sputtering surface of electrically conductive non-target material which faces towards the workpiece support and which receives a coating of target material for re-sputtering onto the workpiece. A second target, located between the RF coil and the workpiece support, includes a sputtering surface which faces towards the RF coil and which supplies at least a portion of thc coating of target material to the re-sputtering surface of the RF coil.
    Type: Grant
    Filed: January 5, 2000
    Date of Patent: December 9, 2003
    Assignee: Trikon Holdings Limited
    Inventors: Keith Edward Buchanan, Stephen Robert Burgess, Paul Rich
  • SPUTTERING APPARATUS
    Publication number: 20020000374
    Abstract: This invention relates to sputtering apparatus for depositing material onto a workpiece.
    Type: Application
    Filed: January 5, 2000
    Publication date: January 3, 2002
    Inventors: KEITH EDWARD BUCHANAN, STEPHEN ROBERT BURGESS, PAUL RICH
  • Apparatus and methods for sputtering
    Patent number: 6179974
    Abstract: This invention relates to sputtering materials onto workpieces. Sputter Apparatus which is generally indicated at 10, is provided with additional D.C. coils 23, 23, to increase uniformity of deposition.
    Type: Grant
    Filed: October 12, 1999
    Date of Patent: January 30, 2001
    Assignee: Trikon Holdings Ltd.
    Inventor: Keith Edward Buchanan
  • Methods of forming a barrier layer
    Patent number: 6174823
    Abstract: This invention relates to methods of forming a barrier layer including depositing a layer of Titanium Nitride and subsequently nitriding the surface of that layer. In some embodiments the Titanium Nitride layer is exposed to Oxygen prior to the nitroding step.
    Type: Grant
    Filed: November 21, 1997
    Date of Patent: January 16, 2001
    Assignee: Trikon Equipments Limited
    Inventors: Christopher David Dobson, Mark Graeme Martin Harris, Keith Edward Buchanan