Patents by Inventor Keith Edward Moore

Keith Edward Moore has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11845127
    Abstract: A system to apply uniform layers of metal powder, the system includes: a conductive roller with a dielectric coating, the conductive roller biased at a first voltage; a powder supply to contain a metal powder biased at a second voltage, the powder supply to provide the metal powder to the conductive roller to form a uniform layer of metal powder on the dielectric coating of the conductive roller; a deposition area to receive the uniform layer of metal powder from the conductive roller, the deposition area biased at a third voltage, wherein the metal powder is transferred across an air gap from the conductive roller to the deposition area by electrostatic attraction of the metal powder.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: December 19, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Thomas Anthony, Seongsik Chang, Keith Edward Moore
  • Publication number: 20210060650
    Abstract: A system to apply uniform layers of metal powder, the system includes: a conductive roller with a dielectric coating, the conductive roller biased at a first voltage; a powder supply to contain a metal powder biased at a second voltage, the powder supply to provide the metal powder to the conductive roller to form a uniform layer of metal powder on the dielectric coating of the conductive roller; a deposition area to receive the uniform layer of metal powder from the conductive roller, the deposition area biased at a third voltage, wherein the metal powder is transferred across an air gap from the conductive roller to the deposition area by electrostatic attraction of the metal powder.
    Type: Application
    Filed: June 8, 2018
    Publication date: March 4, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Thomas Anthony, Seongsik Chang, Keith Edward Moore
  • Patent number: 5774377
    Abstract: A method and apparatus for monitoring the behavior over time of a distributed system. Time-stamped data descriptive of events at one subsystem are placed into a local buffer. The subsystem is notified of the time when a trap condition occurs at another subsystem. Data having a time-stamp within a certain interval of the occurrence of the trap condition are archived to provide a history of the system for later analysis. Time is determined by a local clock in each subsystem. These clocks are synchronized to ensure accurate correlation between events at different subsystems. Trap conditions are categorized and data descriptive of subsystem states are classified to facilitate selective notification of one or more other subsystems, and selective retention of the data, depending on which category of trap condition has occurred and which class of data has been collected.
    Type: Grant
    Filed: July 30, 1991
    Date of Patent: June 30, 1998
    Assignee: Hewlett-Packard Company
    Inventors: John C. Eidson, Keith Edward Moore