Abstract: Various techniques to quickly image one or more edge regions of a substrate panel without imaging other regions of the substrate panel, such as areas of the substrate panel that have already been exposed to ultraviolet (UV) light. In some examples, an illumination mask assembly can be coupled to a clamp assembly and used to image at least one edge region of the substrate panel, such as an edge region including one or more dummy patterns. For example, the substrate panel can be clamped using the clamp assembly in order to immerse the substrate panel into a plating bath. Before immersion, the illumination mask assembly can image one or more edge regions of the substrate panel, such as to image the various dummy patterns in a layer of the substrate panel.

Abstract: Various examples described herein include a correction for a layer-to-layer or substrate-to-substrate overlay alignment based upon feedback from critical-dimension (CD) measurements of locations of various features that are to be formed on subsequently formed layers of a substrate with regard to locations of similar features on previously formed layers. The layer-to-layer or substrate-to-substrate overlay-alignment feedback can be enhanced by determining positions of multiple ones of the features on each of the formed layers with respect to the first layer in the stack. Further, the layer-to-layer or substrate-to-substrate overlay-alignment feedback can be enhanced by determining positions of multiple ones of the features on each of the formed layers with respect to the previously formed layer. Overlay-alignment errors may be sent back to a photolithographic exposure tool. An accumulated overlay error can be flagged. Other techniques and methods are also disclosed.

Abstract: A method for correcting misalignments is provided. An alignment for each device of a group of devices mounted on a substrate is determined. An alignment error for the group of devices mounted on the substrate is determined based on the respective alignment for each device. One or more correction factors are calculated based on the alignment error. The alignment error is corrected based on the one or more correction factors.

Abstract: A method for correcting misalignments is provided. An alignment for each device of a group of devices mounted on a substrate is determined. An alignment error for the group of devices mounted on the substrate is determined based on the respective alignment for each device. One or more correction factors are calculated based on the alignment error. The alignment error is corrected based on the one or more correction factors.