Abstract: An apparatus suitable for providing ventilation and electromagnetic interference (EMI) containment for a computing device includes a first strip and a second strip. The first strip is sized to span ventilation openings of a computing device covering. The second strip intersects the first strip while also spanning the ventilation openings. Thus, the first strip and the second strip cooperate to define airflow openings within the ventilation openings, the airflow openings being sized to inhibit EMI from exiting the computing device via the ventilation openings.

Abstract: An apparatus suitable for providing ventilation and electromagnetic interference (EMI) containment for a computing device includes a first strip and a second strip. The first strip is sized to span ventilation openings of a computing device covering. The second strip intersects the first strip while also spanning the ventilation openings. Thus, the first strip and the second strip cooperate to define airflow openings within the ventilation openings, the airflow openings being sized to inhibit EMI from exiting the computing device via the ventilation openings.

Abstract: The subject disclosure relates to improved integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved integrated connector module transformer (ICMt), including a wafer configured to hold a plurality of toroid elements, wherein the wafer is comprised of two or more mechanically coupled wafer portions. The ICMt can include one or more Electro Magnetic Interference (EMI) fingers that are configured to contact a ground pad of a printed circuit board (PCB) in order to provide a low-inductance connection between the ICMt and the ground pad of the PCB.

Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.

Abstract: In one embodiment, an apparatus includes a line card ejector configured to engage with a chassis to retain the line card within a slot in the chassis in a closed position, a locking member movable between a locked position in which the ejector is locked in its closed position and an unlocked position in which the ejector may be moved to an open position to remove the line card from the chassis, and an actuation device for moving the locking member from its locked position to its unlocked position. The locking member comprises an accessible release lever for moving the locking member from its locked position to its unlocked position without use of the actuation device for emergency release and removal of the line card. A method for emergency release of the line card is also disclosed herein.

Abstract: Adjustable data rate data communications may be provided. First, a plurality of remote data rates at which a remote device is configured to operate may be received. Then, a plurality of local data rates at which a local device is configured to operate may be received. A greatest one of the plurality of local data rates may comprise a cable data rate comprising a greatest rate supported by a length of cable connecting the local device and the remote device. Next, an operating data rate may be determined. The operating data rate may comprise a highest one of the plurality of local data rates that has a corresponding equivalent within the plurality of remote data rates. The local device may then be operated at the operating data rate.

Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.

Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.

Abstract: The subject disclosure relates to improved integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved integrated connector module transformer (ICMt), including a wafer configured to hold a plurality of toroid elements, wherein the wafer is comprised of two or more mechanically coupled wafer portions. The ICMt can include one or more Electro Magnetic Interference (EMI) fingers that are configured to contact a ground pad of a printed circuit board (PCB) in order to provide a low-inductance connection between the ICMt and the ground pad of the PCB.

Abstract: Method, apparatus, and electrical cable for high-speed connections. The apparatus can include an electrical cable, a wire sorter, an electrical mating paddle, and a cable assembly. The wire sorter can be coupled to an end of the electrical cable, and configured to receive wires extending from the end of the electrical cable and position the wires relative to one another in a predetermined arrangement to yield sorted wires. The electrical mating paddle card can then be coupled to the sorted wires according to the predetermined arrangement. The cable assembly can be configured to house the wire sorter and at least a portion of the wires. Moreover, the cable assembly can include a hot-melt injection chamber configured to at least partially immobilize the wires relative to the cable assembly when hot-melt is injected into the hot-melt injection chamber.

Abstract: The subject disclosure relates improved common mode choke (CMC) and integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved CMC component, including an upper chassis element having a first plurality of comb structures vertically protruding from an edge of the upper chassis element, and a lower chassis element comprising a second plurality of comb structures vertically protruding from an edge of the lower chassis element, the second plurality of comb structures configured to interlock with the first plurality of comb structures to form an enclosure when the upper chassis element is mechanically coupled with the lower chassis element.

Abstract: Power Over Ethernet (POE)/universal power over Ethernet (UPoE) may be enabled at multigigabit port-channel connections. This may allow for additional speed support in auto-negotiation messages while employing multigigabit speeds. An integrated connector module (referred to herein as a “ICM”) compatible with UPoE with a modified local physical layer (PHY) circuit may be capable of supporting multi-gigabit data rates (such as between 1 G to 10 G, e.g., 2.5 G and 5 G) as to not limit the data rates to 1 G. The ICM may provide multi-gig data transmission through a first plurality of pins comprising a multi-gig data pin area. Furthermore, the ICM may provide UPoE power to support the multi-gig transmission through a second plurality of pins comprising a UPoE power pin area.

Abstract: An apparatus may be provided. The apparatus may comprise a circuit board. In addition, the apparatus may comprise an integrated connector mounted to the circuit board. A choke, external to the integrated connector, may be included in the apparatus. The choke may be electrically connected to the integrated connector through the circuit board.

Abstract: Adjustable data rate data communications may be provided. First, a plurality of remote data rates at which a remote device is configured to operate may be received. Then, a plurality of local data rates at which a local device is configured to operate may be received. A greatest one of the plurality of local data rates may comprise a cable data rate comprising a greatest rate supported by a length of cable connecting the local device and the remote device. Next, an operating data rate may be determined. The operating data rate may comprise a highest one of the plurality of local data rates that has a corresponding equivalent within the plurality of remote data rates. The local device may then be operated at the operating data rate.

Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.

Abstract: A cage within a communication module may have a plurality of receptacles. A cover may cover at least a portion of the cage. A thermal conduction system may include a top wrap, a first side wrap, and a second side wrap. The top wrap may comprise a top wrap top portion covering at least a portion of the cover top side and a top wrap back portion covering at least a portion of the cover back side. The first side wrap may comprise a first side wrap back portion covering at least a portion of the top wrap back portion, a first side wrap side portion covering at least a portion of the cover first side, and first side fingers extending through a first slit in the cover into the cage. A heat sink may be attached to the first side wrap back portion.

Abstract: Adjustable data rate data communications may be provided. First, a plurality of remote data rates at which a remote device is configured to operate may be received. Then, a plurality of local data rates at which a local device is configured to operate may be received. A greatest one of the plurality of local data rates may comprise a cable data rate comprising a greatest rate supported by a length of cable connecting the local device and the remote device. Next, an operating data rate may be determined. The operating data rate may comprise a highest one of the plurality of local data rates that has a corresponding equivalent within the plurality of remote data rates. The local device may then be operated at the operating data rate.

Abstract: Method, apparatus, and electrical cable for high-speed connections. The apparatus can include an electrical cable, a wire sorter, an electrical mating paddle, and a cable assembly. The wire sorter can be coupled to an end of the electrical cable, and configured to receive wires extending from the end of the electrical cable and position the wires relative to one another in a predetermined arrangement to yield sorted wires. The electrical mating paddle card can then be coupled to the sorted wires according to the predetermined arrangement. The cable assembly can be configured to house the wire sorter and at least a portion of the wires. Moreover, the cable assembly can include a hot-melt injection chamber configured to at least partially immobilize the wires relative to the cable assembly when hot-melt is injected into the hot-melt injection chamber.

Abstract: Method, apparatus, and electrical cable for high-speed connections. The apparatus can include an electrical cable, a wire sorter, an electrical mating paddle, and a cable assembly. The wire sorter can be coupled to an end of the electrical cable, and configured to receive wires extending from the end of the electrical cable and position the wires relative to one another in a predetermined arrangement to yield sorted wires. The electrical mating paddle card can then be coupled to the sorted wires according to the predetermined arrangement. The cable assembly can be configured to house the wire sorter and at least a portion of the wires. Moreover, the cable assembly can include a hot-melt injection chamber configured to at least partially immobilize the wires relative to the cable assembly when hot-melt is injected into the hot-melt injection chamber.

Abstract: An integrated connector may be provided. The integrated connector may comprise a top portion, a front portion, and a side portion. The top portion may comprise a plurality of top fingers. The front portion may comprise a plurality of receptacles and a plurality of receptacle tabs respectively corresponding to the plurality of receptacles. The side portion may comprise at least one side finger comprising a main portion, a connector portion connected to the side portion, a tail portion, a top curved portion, and a bottom curved portion. The top fingers, the plurality of receptacle tabs, and the at least one side finger may be in electrical connection.