Patents by Inventor Keith G. Fife
Keith G. Fife has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11959853Abstract: System and methods for analyzing single molecules and performing nucleic acid sequencing. An integrated device includes multiple pixels with sample wells configured to receive a sample, which when excited, emits radiation. The integrated device includes at least one waveguide configured to propagate excitation energy to the sample wells from a region of the integrated device configured to couple with an excitation energy source. A pixel may also include at least one element for directing the emission energy towards a sensor within the pixel. The system also includes an instrument that interfaces with the integrated device. The instrument may include an excitation energy source for providing excitation energy to the integrated device by coupling to an excitation energy coupling region of the integrated device.Type: GrantFiled: October 8, 2021Date of Patent: April 16, 2024Assignee: Quantum-Si IncorporatedInventors: Jonathan M. Rothberg, Ali Kabiri, Jason W. Sickler, Brett J. Gyarfas, Jeremy Lackey, Gerard Schmid, Lawrence C. West, Keith G. Fife, Benjamin Cipriany, Farshid Ghasemi
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Publication number: 20240120891Abstract: A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.Type: ApplicationFiled: December 20, 2023Publication date: April 11, 2024Inventors: Kailiang Chen, Keith G. Fife, Nevada J. Sanchez, Andrew J. Casper, Tyler S. Ralston
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Publication number: 20240122073Abstract: An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards.Type: ApplicationFiled: June 6, 2023Publication date: April 11, 2024Applicant: BFLY Operations, IncInventors: Jonathan M. Rothberg, Susan A. Alie, Jaime Scott Zahorian, Paul Francis Cristman, Keith G. Fife
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Publication number: 20240100565Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.Type: ApplicationFiled: November 30, 2023Publication date: March 28, 2024Inventors: Jonathan M. Rothberg, Keith G. Fife, Tyler S. Ralston, Gregory L. Charvat, Nevada J. Sanchez
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Publication number: 20240100566Abstract: An ultrasound transducer device made by a process that includes the steps of forming depositing a first layer on a substrate, depositing a second layer on the first layer, patterning the second layer at a region corresponding to a location of a transducer cavity, depositing a third layer that refills regions created by patterning the second layer, planarizing the third layer to a top surface of the second layer, removing the second layer, conformally depositing a fourth layer over the first layer and the third layer, defining the transducer cavity in a support layer formed over the fourth layer; and bonding a membrane to the support layer.Type: ApplicationFiled: December 6, 2023Publication date: March 28, 2024Applicant: BFLY OPERATIONS, INC.Inventors: Lingyun Miao, Keith G. Fife, Jianwei Liu, Jonathan M. Rothberg
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Patent number: 11932906Abstract: Apparatus and techniques for electrokinetic loading of samples of interest into sub-micron-scale reaction chambers are described. Embodiments include an integrated device and related apparatus for analyzing samples in parallel. The integrated device may include at least one reaction chamber formed through a surface of the integrated device and configured to receive a sample of interest, such as a molecule of nucleic acid. The integrated device may further include electrodes patterned adjacent to the reaction chamber that produce one or more electric fields that assist loading the sample into the reaction chamber. The apparatus may further include a sample reservoir having a fluid seal with the surface of the integrated device and configured to hold a suspension containing the samples.Type: GrantFiled: June 17, 2021Date of Patent: March 19, 2024Assignee: Quantum-Si IncorporatedInventors: Guojun Chen, Jeremy Lackey, Alexander Goryaynov, Gerard Schmid, Ali Kabiri, Jonathan M. Rothberg, Todd Rearick, Jonathan C. Schultz, Farshid Ghasemi, Keith G. Fife
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Publication number: 20240079843Abstract: Apparatus and methods for producing ultrashort optical pulses are described. A high-power, solid-state, passively mode-locked laser can be manufactured in a compact module that can be incorporated into a portable instrument. The mode-locked laser can produce sub-50-ps optical pulses at a repetition rates between 200 MHz and 50 MHz, rates suitable for massively parallel data-acquisition. The optical pulses can be used to generate a reference clock signal for synchronizing data-acquisition and signal-processing electronics of the portable instrument.Type: ApplicationFiled: November 8, 2023Publication date: March 7, 2024Applicant: Quantum-Si IncorporatedInventors: Jonathan M. Rothberg, Jason W. Sickler, Lawrence C. West, Faisal R. Ahmad, Paul E. Glenn, Jack Jewell, John Glenn, Jose Camara, Jeremy Christopher Jordan, Todd Rearick, Farshid Ghasemi, Jonathan C. Schultz, Keith G. Fife, Benjamin Cipriany
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Patent number: 11921240Abstract: Circuitry for an ultrasound device is described. The ultrasound device may include a symmetric switch positioned between a pulser and an ultrasound transducer. The pulser may produce bipolar pulses. The symmetric switch may selectively isolate a receiver from the pulser and the ultrasound transducer during a transmit mode of the device, when the bipolar pulses are provided by the pulser to the ultrasound transducer for transmission, and may selectively permit the receiver to receive signals from the ultrasound transducer during a receive mode. The symmetric switch may be provided with a well switch to remove well capacitances in a signal path of the device.Type: GrantFiled: September 18, 2020Date of Patent: March 5, 2024Assignee: BFLY OPERATIONS, INC.Inventors: Kailiang Chen, Daniel Rea McMahill, Joseph Lutsky, Keith G. Fife, Nevada J. Sanchez
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Publication number: 20240044846Abstract: An ultrasound device includes: ultrasonic transducer cavities; a membrane comprising a silicon layer that seals the ultrasonic transducer cavities; electrode regions configured to control vibration of the membrane; and a complementary metal-oxide-semiconductor (CMOS) substrate including integrated circuitry that is electrically coupled to the electrode regions. The ultrasonic transducer cavities are disposed between the membrane and the integrated circuitry along a vertical direction of the ultrasound device.Type: ApplicationFiled: October 20, 2023Publication date: February 8, 2024Applicant: BFLY OPERATIONS, INC.Inventors: Jonathan M. Rothberg, Susan A. Alie, Keith G. Fife, Nevada J. Sanchez, Tyler S. Ralston
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Patent number: 11883845Abstract: A method of forming an ultrasonic transducer device involves depositing a first layer on a substrate, depositing a second layer on the first layer, patterning the second layer at a region corresponding to a location of a transducer cavity, depositing a third layer that refills regions created by patterning the second layer, planarizing the third layer to a top surface of the second layer, removing the second layer, conformally depositing a fourth layer over the first layer and the third layer, defining the transducer cavity in a support layer formed over the fourth layer; and bonding a membrane to the support layer.Type: GrantFiled: January 5, 2023Date of Patent: January 30, 2024Assignee: BFLY OPERATIONS, INC.Inventors: Lingyun Miao, Keith G. Fife, Jianwei Liu, Jonathan M. Rothberg
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Patent number: 11879841Abstract: Apparatus and methods for analyzing single molecule and performing nucleic acid sequencing. An apparatus can include an assay chip that includes multiple pixels with sample wells configured to receive a sample, which, when excited, emits emission energy; at least one element for directing the emission energy in a particular direction; and a light path along which the emission energy travels from the sample well toward a sensor. The apparatus also includes an instrument that interfaces with the assay chip. The instrument includes an excitation light source for exciting the sample in each sample well; a plurality of sensors corresponding the sample wells. Each sensor may detect emission energy from a sample in a respective sample well. The instrument includes at least one optical element that directs the emission energy from each sample well towards a respective sensor of the plurality of sensors.Type: GrantFiled: October 8, 2021Date of Patent: January 23, 2024Assignee: Quantum-Si IncorporatedInventors: Jonathan M. Rothberg, Ali Kabiri, Jason W. Sickler, Brett J. Gyarfas, Jeremy Lackey, Gerard Schmid, Paul E. Glenn, Lawrence C. West, Benjamin Cipriany, Keith G. Fife
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Publication number: 20240019370Abstract: An integrated circuit includes a photodetection region configured to receive incident photons. The photodetection region is configured to produce a plurality of charge carriers in response to the incident photons. The integrated circuit includes at least one charge carrier storage region. The integrated circuit also includes a charge carrier segregation structure configured to selectively direct charge carriers of the plurality of charge carriers directly into the at least one charge carrier storage region based upon times at which the charge carriers are produced.Type: ApplicationFiled: June 6, 2023Publication date: January 18, 2024Applicant: Quantum-Si IncorporatedInventors: Jonathan M. Rothberg, Keith G. Fife, David M. Boisvert
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Patent number: 11863133Abstract: A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.Type: GrantFiled: May 26, 2021Date of Patent: January 2, 2024Assignee: BFLY OPERATIONS, INC.Inventors: Kailiang Chen, Keith G. Fife, Nevada J. Sanchez, Andrew J. Casper, Tyler S. Ralston
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Patent number: 11857368Abstract: A processing device is coupled to a single ultrasound device having a single array of capacitive micromachined ultrasound transducers (CMUTs). The processing device generates a graphical user interface (GUI) having user selectable GUI menu options corresponding to respective ultrasound operating modes for the single ultrasound device having the single ultrasound transducer array. The user-selectable GUI menu options include GUI menu options labeled as representing an ultrasound operating mode for musculoskeletal imaging, breast imaging, carotid imaging, vascular imaging, and abdominal imaging, respectively. The processing device further receives, via the GUI, user input indicating selection of one of the ultrasound operating modes, and in response to receiving the user input, provides an indication to the single ultrasound device having the single array of CMUTs to operate in the selected ultrasound operating mode.Type: GrantFiled: January 31, 2023Date of Patent: January 2, 2024Assignee: BFLY OPERATIONS, INC.Inventors: Jonathan M. Rothberg, Susan A. Alie, Nevada J. Sanchez, Tyler S. Ralston, Christopher Thomas McNulty, Jaime Scott Zahorian, Paul Francis Cristman, Matthew de Jonge, Keith G. Fife
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Publication number: 20230408411Abstract: An integrated circuit includes a photodetection region configured to receive incident photons. The photodetection region is configured to produce a plurality of charge carriers in response to the incident photons. The integrated circuit also includes at least one charge carrier storage region. The integrated circuit also includes a charge carrier segregation structure configured to selectively direct charge carriers of the plurality of charge carriers into the at least one charge carrier storage region based upon times at which the charge carriers are produced.Type: ApplicationFiled: June 13, 2023Publication date: December 21, 2023Applicant: Quantum-Si IncorporatedInventors: Jonathan M. Rothberg, Keith G. Fife, David M. Boisvert
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Patent number: 11848531Abstract: Apparatus and methods for producing ultrashort optical pulses are described. A high-power, solid-state, passively mode-locked laser can be manufactured in a compact module that can be incorporated into a portable instrument. The mode-locked laser can produce sub-50-ps optical pulses at a repetition rates between 200 MHz and 50 MHz, rates suitable for massively parallel data-acquisition. The optical pulses can be used to generate a reference clock signal for synchronizing data-acquisition and signal-processing electronics of the portable instrument.Type: GrantFiled: March 16, 2022Date of Patent: December 19, 2023Assignee: Quantum-Si IncorporatedInventors: Jonathan M. Rothberg, Jason W. Sickler, Lawrence C. West, Faisal R. Ahmad, Paul E. Glenn, Jack Jewell, John Glenn, Jose Camara, Jeremy Christopher Jordan, Todd Rearick, Farshid Ghasemi, Jonathan C. Schultz, Keith G. Fife, Benjamin Cipriany
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Patent number: 11833542Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.Type: GrantFiled: September 6, 2019Date of Patent: December 5, 2023Assignee: BFLY Operations, Inc.Inventors: Jonathan M. Rothberg, Keith G. Fife, Tyler S. Ralston, Gregory L. Charvat, Nevada J. Sanchez
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Patent number: 11828729Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.Type: GrantFiled: August 5, 2020Date of Patent: November 28, 2023Assignee: BFLY OPERATIONS, INC.Inventors: Jonathan M. Rothberg, Susan A. Alie, Keith G. Fife, Nevada J. Sanchez, Tyler S. Ralston
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Publication number: 20230375475Abstract: System and methods for analyzing single molecules and performing nucleic acid sequencing. An integrated device may include multiple pixels with sample wells configured to receive a sample, which when excited, emits radiation. The integrated device includes a surface having a trench region recessed from a portion of the surface and an array of sample wells, disposed in the trench region. The integrated device also includes a waveguide configured to couple excitation energy to at least one sample well in the array and positioned at a first distance from a surface of the trench region and at a second distance from the surface in a region separate from the trench region. The first distance is smaller than the second distance. The system also includes an instrument that interfaces with the integrated device. The instrument may include an excitation energy source for providing excitation energy to the integrated device by coupling to an excitation energy coupling region of the integrated device.Type: ApplicationFiled: July 20, 2023Publication date: November 23, 2023Applicant: Quantum-Si IncorporatedInventors: Jonathan M. Rothberg, Ali Kabiri, Gerard Schmid, Keith G. Fife, James Beach, Jason W. Sickler, Lawrence C. West, Paul E. Glenn, Kyle Preston, Farshid Ghasemi, Benjamin Cipriany, Jeremy Lackey
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Patent number: 11808899Abstract: Methods and apparatus are described for implementing a coding scheme on ultrasound signals received by a plurality of ultrasonic transducers. The coding, and subsequent decoding, may allow for multiple ultrasonic transducers to be operated in a receive mode simultaneously while still differentiating the contribution of the individual ultrasonic transducers. Improved signal characteristics may result, including improved signal-to-noise ratio (SNR).Type: GrantFiled: December 10, 2021Date of Patent: November 7, 2023Assignee: BFLY OPERATIONS, INCInventors: Kailiang Chen, Keith G. Fife, Tyler S. Ralston, Nevada J. Sanchez, Andrew J. Casper