Patents by Inventor Keith GUETIG

Keith GUETIG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11735844
    Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: August 22, 2023
    Assignee: SAMTEC, INC.
    Inventors: Liam Parkes, Eric Zbinden, Keith Guetig, Jignesh H. Shah, Jean Karlo Williams Barnett, Chadrick Paul Faith, R. Brad Bettman
  • Patent number: 11476603
    Abstract: An electrical connector includes electrical contacts that are configured to be mounted to an electrical cable, and mating ends that are configured to be surface mounted to a contact pad of an underlying substrate, such that the mating ends flex and apply a pressure against the contact pad.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: October 18, 2022
    Assignee: SAMTEC, INC.
    Inventors: Jonathan Earl Buck, Keith Guetig
  • Publication number: 20220029323
    Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
    Type: Application
    Filed: October 7, 2021
    Publication date: January 27, 2022
    Inventors: Liam PARKES, Eric ZBINDEN, Keith Guetig, Jignesh H. Shah, Jean Karlo Williams Barnett, Chadrick Paul Faith, R. Brad Bettman
  • Patent number: 11196195
    Abstract: Interconnect systems having anti-backout latches and securement members are disclosed.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: December 7, 2021
    Assignee: SAMTEC, INC.
    Inventors: R. Brad Bettman, Liam Parkes, Eric Zbinden, Keith Guetig, Jignesh H. Shah, Jean Karlo Williams Barnett, Chadrick Paul Faith, Edwin Loy
  • Patent number: 11171432
    Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: November 9, 2021
    Assignee: SAMTEC, INC.
    Inventors: Liam Parkes, Eric Zbinden, Keith Guetig, Jignesh H. Shah, Jean Karlo Williams Barnett, Chadrick Paul Faith, R. Brad Bettman
  • Publication number: 20210151914
    Abstract: An electrical connector includes electrical contacts that are configured to be mounted to an electrical cable, and mating ends that are configured to be surface mounted to a contact pad of an underlying substrate, such that the mating ends flex and apply a pressure against the contact pad.
    Type: Application
    Filed: December 18, 2020
    Publication date: May 20, 2021
    Inventors: Jonathan Earl Buck, Keith Guetig
  • Patent number: 10985479
    Abstract: An electrical connector includes electrical contacts that are configured to be mounted to an electrical cable, and mating ends that are configured to be surface mounted to a contact pad of an underlying substrate, such that the mating ends flex and apply a pressure against the contact pad.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: April 20, 2021
    Assignee: SAMTEC, INC.
    Inventors: Jonathan Earl Buck, Keith Guetig
  • Publication number: 20200403334
    Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
    Type: Application
    Filed: August 15, 2017
    Publication date: December 24, 2020
    Inventors: Liam PARKES, Eric ZBINDEN, Keith GUETIG, Jignesh H. SHAH, Jean Carlo WILLIAMS BARNETT, Chadrick Paul FAITH, R. Brad BETTMAN
  • Publication number: 20200220286
    Abstract: Interconnect systems having anti-backout latches and securement members are disclosed.
    Type: Application
    Filed: April 10, 2018
    Publication date: July 9, 2020
    Inventors: R. Brad BETTMAN, Liam PARKES, Eric ZBINDEN, Keith GUETIG, Jignesh H. SHAH, Jean Karlo WILLIAMS BARNETT, Chadrick Paul FAITH, Edwin LOY
  • Publication number: 20190267732
    Abstract: An electrical connector includes electrical contacts that are configured to be mounted to an electrical cable, and mating ends that are configured to be surface mounted to a contact pad of an underlying substrate, such that the mating ends flex and apply a pressure against the contact pad.
    Type: Application
    Filed: August 30, 2017
    Publication date: August 29, 2019
    Inventors: Jonathan Earl BUCK, Keith GUETIG
  • Patent number: 9841572
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: December 12, 2017
    Assignee: SAMTEC, INC.
    Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
  • Patent number: 9651752
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: May 16, 2017
    Assignee: Samtec, Inc.
    Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
  • Publication number: 20160291274
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Application
    Filed: June 14, 2016
    Publication date: October 6, 2016
    Inventors: Eric ZBINDEN, Randall MUSSER, Jean-Marc André VERDIELL, John MONGOLD, Brian VICICH, Keith GUETIG
  • Publication number: 20160269118
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Application
    Filed: May 18, 2016
    Publication date: September 15, 2016
    Inventors: Eric ZBINDEN, Randall MUSSER, Jean-Marc André VERDIELL, John MONGOLD, Brian VICICH, Keith GUETIG
  • Patent number: 9374165
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: June 21, 2016
    Assignee: Samtec, Inc.
    Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
  • Patent number: 9040824
    Abstract: A cable ribbon includes a first and second twinaxial cables and an outer layer surrounding the first and second twinaxial cables. The first twinaxial cable includes two first wires that are parallel or substantially parallel to each other along a longitudinal axis of the twinaxial cable ribbon, a first insulator surrounding each of the two first wires along the longitudinal axis, and a first conductive shield surrounding the first insulator along the longitudinal axis. The second twinaxial cable includes two second wires that are parallel or substantially parallel to each other along the longitudinal axis, a second insulator surrounding each of the two second wires along the longitudinal axis, and a second conductive shield surrounding the second insulator along the longitudinal axis. The first and second conductive shields are in direct contact with each other.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: May 26, 2015
    Assignee: Samtec, Inc.
    Inventors: Keith Guetig, Shashi Chuganey, Travis Ellis, Eric Korff
  • Publication number: 20140286646
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Application
    Filed: June 4, 2014
    Publication date: September 25, 2014
    Applicant: Samtec, Inc.
    Inventors: Eric ZBINDEN, Randall MUSSER, Jean-Marc André VERDIELL, John MONGOLD, Brian VICICH, Keith GUETIG
  • Patent number: 8787711
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Grant
    Filed: May 16, 2013
    Date of Patent: July 22, 2014
    Assignee: Samtec, Inc.
    Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
  • Publication number: 20130312992
    Abstract: A cable ribbon includes a first and second twinaxial cables and an outer layer surrounding the first and second twinaxial cables. The first twinaxial cable includes two first wires that are parallel or substantially parallel to each other along a longitudinal axis of the twinaxial cable ribbon, a first insulator surrounding each of the two first wires along the longitudinal axis, and a first conductive shield surrounding the first insulator along the longitudinal axis. The second twinaxial cable includes two second wires that are parallel or substantially parallel to each other along the longitudinal axis, a second insulator surrounding each of the two second wires along the longitudinal axis, and a second conductive shield surrounding the second insulator along the longitudinal axis. The first and second conductive shields are in direct contact with each other.
    Type: Application
    Filed: May 24, 2012
    Publication date: November 28, 2013
    Applicant: SAMTEC INC.
    Inventors: Keith GUETIG, Shashi CHUGANEY, Travis ELLIS, Eric KORFF
  • Patent number: 8588562
    Abstract: An interconnect system including a host circuit board; an IC package connected to the host circuit board and including a first connector, an IC circuit board, and an IC die; and a transceiver arranged to mate with the first connector so that at least some electrical signals transmitted to and from the IC die are transmitted only on or through the IC circuit board.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: November 19, 2013
    Assignee: Samtec, Inc.
    Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig