Patents by Inventor Keith GUETIG
Keith GUETIG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11735844Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.Type: GrantFiled: October 7, 2021Date of Patent: August 22, 2023Assignee: SAMTEC, INC.Inventors: Liam Parkes, Eric Zbinden, Keith Guetig, Jignesh H. Shah, Jean Karlo Williams Barnett, Chadrick Paul Faith, R. Brad Bettman
-
Patent number: 11476603Abstract: An electrical connector includes electrical contacts that are configured to be mounted to an electrical cable, and mating ends that are configured to be surface mounted to a contact pad of an underlying substrate, such that the mating ends flex and apply a pressure against the contact pad.Type: GrantFiled: December 18, 2020Date of Patent: October 18, 2022Assignee: SAMTEC, INC.Inventors: Jonathan Earl Buck, Keith Guetig
-
Publication number: 20220029323Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.Type: ApplicationFiled: October 7, 2021Publication date: January 27, 2022Inventors: Liam PARKES, Eric ZBINDEN, Keith Guetig, Jignesh H. Shah, Jean Karlo Williams Barnett, Chadrick Paul Faith, R. Brad Bettman
-
Patent number: 11196195Abstract: Interconnect systems having anti-backout latches and securement members are disclosed.Type: GrantFiled: April 10, 2018Date of Patent: December 7, 2021Assignee: SAMTEC, INC.Inventors: R. Brad Bettman, Liam Parkes, Eric Zbinden, Keith Guetig, Jignesh H. Shah, Jean Karlo Williams Barnett, Chadrick Paul Faith, Edwin Loy
-
Patent number: 11171432Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.Type: GrantFiled: August 15, 2017Date of Patent: November 9, 2021Assignee: SAMTEC, INC.Inventors: Liam Parkes, Eric Zbinden, Keith Guetig, Jignesh H. Shah, Jean Karlo Williams Barnett, Chadrick Paul Faith, R. Brad Bettman
-
Publication number: 20210151914Abstract: An electrical connector includes electrical contacts that are configured to be mounted to an electrical cable, and mating ends that are configured to be surface mounted to a contact pad of an underlying substrate, such that the mating ends flex and apply a pressure against the contact pad.Type: ApplicationFiled: December 18, 2020Publication date: May 20, 2021Inventors: Jonathan Earl Buck, Keith Guetig
-
Patent number: 10985479Abstract: An electrical connector includes electrical contacts that are configured to be mounted to an electrical cable, and mating ends that are configured to be surface mounted to a contact pad of an underlying substrate, such that the mating ends flex and apply a pressure against the contact pad.Type: GrantFiled: August 30, 2017Date of Patent: April 20, 2021Assignee: SAMTEC, INC.Inventors: Jonathan Earl Buck, Keith Guetig
-
Publication number: 20200403334Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.Type: ApplicationFiled: August 15, 2017Publication date: December 24, 2020Inventors: Liam PARKES, Eric ZBINDEN, Keith GUETIG, Jignesh H. SHAH, Jean Carlo WILLIAMS BARNETT, Chadrick Paul FAITH, R. Brad BETTMAN
-
Publication number: 20200220286Abstract: Interconnect systems having anti-backout latches and securement members are disclosed.Type: ApplicationFiled: April 10, 2018Publication date: July 9, 2020Inventors: R. Brad BETTMAN, Liam PARKES, Eric ZBINDEN, Keith GUETIG, Jignesh H. SHAH, Jean Karlo WILLIAMS BARNETT, Chadrick Paul FAITH, Edwin LOY
-
Publication number: 20190267732Abstract: An electrical connector includes electrical contacts that are configured to be mounted to an electrical cable, and mating ends that are configured to be surface mounted to a contact pad of an underlying substrate, such that the mating ends flex and apply a pressure against the contact pad.Type: ApplicationFiled: August 30, 2017Publication date: August 29, 2019Inventors: Jonathan Earl BUCK, Keith GUETIG
-
Patent number: 9841572Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.Type: GrantFiled: June 14, 2016Date of Patent: December 12, 2017Assignee: SAMTEC, INC.Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
-
Patent number: 9651752Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.Type: GrantFiled: May 18, 2016Date of Patent: May 16, 2017Assignee: Samtec, Inc.Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
-
Publication number: 20160291274Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.Type: ApplicationFiled: June 14, 2016Publication date: October 6, 2016Inventors: Eric ZBINDEN, Randall MUSSER, Jean-Marc André VERDIELL, John MONGOLD, Brian VICICH, Keith GUETIG
-
Publication number: 20160269118Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.Type: ApplicationFiled: May 18, 2016Publication date: September 15, 2016Inventors: Eric ZBINDEN, Randall MUSSER, Jean-Marc André VERDIELL, John MONGOLD, Brian VICICH, Keith GUETIG
-
Patent number: 9374165Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.Type: GrantFiled: June 4, 2014Date of Patent: June 21, 2016Assignee: Samtec, Inc.Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
-
Patent number: 9040824Abstract: A cable ribbon includes a first and second twinaxial cables and an outer layer surrounding the first and second twinaxial cables. The first twinaxial cable includes two first wires that are parallel or substantially parallel to each other along a longitudinal axis of the twinaxial cable ribbon, a first insulator surrounding each of the two first wires along the longitudinal axis, and a first conductive shield surrounding the first insulator along the longitudinal axis. The second twinaxial cable includes two second wires that are parallel or substantially parallel to each other along the longitudinal axis, a second insulator surrounding each of the two second wires along the longitudinal axis, and a second conductive shield surrounding the second insulator along the longitudinal axis. The first and second conductive shields are in direct contact with each other.Type: GrantFiled: May 24, 2012Date of Patent: May 26, 2015Assignee: Samtec, Inc.Inventors: Keith Guetig, Shashi Chuganey, Travis Ellis, Eric Korff
-
Publication number: 20140286646Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.Type: ApplicationFiled: June 4, 2014Publication date: September 25, 2014Applicant: Samtec, Inc.Inventors: Eric ZBINDEN, Randall MUSSER, Jean-Marc André VERDIELL, John MONGOLD, Brian VICICH, Keith GUETIG
-
Patent number: 8787711Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.Type: GrantFiled: May 16, 2013Date of Patent: July 22, 2014Assignee: Samtec, Inc.Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
-
Publication number: 20130312992Abstract: A cable ribbon includes a first and second twinaxial cables and an outer layer surrounding the first and second twinaxial cables. The first twinaxial cable includes two first wires that are parallel or substantially parallel to each other along a longitudinal axis of the twinaxial cable ribbon, a first insulator surrounding each of the two first wires along the longitudinal axis, and a first conductive shield surrounding the first insulator along the longitudinal axis. The second twinaxial cable includes two second wires that are parallel or substantially parallel to each other along the longitudinal axis, a second insulator surrounding each of the two second wires along the longitudinal axis, and a second conductive shield surrounding the second insulator along the longitudinal axis. The first and second conductive shields are in direct contact with each other.Type: ApplicationFiled: May 24, 2012Publication date: November 28, 2013Applicant: SAMTEC INC.Inventors: Keith GUETIG, Shashi CHUGANEY, Travis ELLIS, Eric KORFF
-
Patent number: 8588562Abstract: An interconnect system including a host circuit board; an IC package connected to the host circuit board and including a first connector, an IC circuit board, and an IC die; and a transceiver arranged to mate with the first connector so that at least some electrical signals transmitted to and from the IC die are transmitted only on or through the IC circuit board.Type: GrantFiled: February 4, 2013Date of Patent: November 19, 2013Assignee: Samtec, Inc.Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig