Patents by Inventor Keith Hendren

Keith Hendren has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170080861
    Abstract: A vehicle retrofit system for a vehicle having a license plate, the vehicle retrofit system including a sensor module with: a casing, a set of sensors, a communication system, a power system, and a sensor module retention mechanism.
    Type: Application
    Filed: September 8, 2016
    Publication date: March 23, 2017
    Inventors: Saket Vora, Brian Sander, Joseph Fisher, Bryson Gardner, Tyler Mincey, John Brock, Keith Hendren, Waylon Chen, Rishabh Bhargava, Patrick Carroll
  • Patent number: 8587953
    Abstract: A multi-layered cable consisting of three or more conductive layers separated by layers of dielectric and/or adhesive material. The bottom layer and the top layer may act as return path for the transmitted signals and as a shield to prevent interference between these and external electrical signals. Located between the bottom layer and the top layer, the middle layer may transmit desired signals through the flexible cable. The material selection and specifics of each of the layers should be selected so as to achieve a balance in which the desired electrical impedance and mechanical flexibility requirements are met. The cable may also include one or more vias connecting the bottom layer to the top layer, providing shielding all the way around the flex cable. An additional conductive sock may be used to improve shielding effectiveness of the top and bottom layer and to connect to I/O connector shells and the system Faraday cage.
    Type: Grant
    Filed: August 29, 2008
    Date of Patent: November 19, 2013
    Assignee: Apple Inc.
    Inventors: John Brock, Brett William Degner, Dinesh Mathew, Thomas W. Wilson, Jr., Chris Ligtenberg, Keith Hendren, Steven Keiper, Eugene Kim
  • Patent number: 7764493
    Abstract: An electronic device can be provided with a heat-generating component and a cooling module for dissipating heat. In some embodiments, the cooling component may include a fan configured to produce an outflow of air, and a divider configured not only to direct a first portion of the outflow between a first surface of the divider and the heat-generating component, but also to direct a second portion of the outflow along a second surface of the divider. In other embodiments, the cooling component may include a divider and a pressure clip. A first portion of the pressure clip may be configured to exert a pressure on a first surface of the divider such that the pressure may hold a portion of a second surface of the divider in contact with the heat-generating component.
    Type: Grant
    Filed: September 25, 2008
    Date of Patent: July 27, 2010
    Assignee: Apple Inc.
    Inventors: Ihab A. Ali, Dinesh Mathew, Thomas W. Wilson, Jr., Keith Hendren
  • Publication number: 20090175003
    Abstract: An electronic device can be provided with a heat-generating component and a cooling module for dissipating heat. In some embodiments, the cooling component may include a fan configured to produce an outflow of air, and a divider configured not only to direct a first portion of the outflow between a first surface of the divider and the heat-generating component, but also to direct a second portion of the outflow along a second surface of the divider. In other embodiments, the cooling component may include a divider and a pressure clip. A first portion of the pressure clip may be configured to exert a pressure on a first surface of the divider such that the pressure may hold a portion of a second surface of the divider in contact with the heat-generating component.
    Type: Application
    Filed: September 25, 2008
    Publication date: July 9, 2009
    Applicant: Apple Inc.
    Inventors: Ihab A. Ali, Dinesh Mathew, Thomas W. Wilson, JR., Keith Hendren
  • Publication number: 20090173533
    Abstract: A multi-layered cable consisting of three or more conductive layers separated by layers of dielectric and/or adhesive material. The bottom layer and the top layer may act as return path for the transmitted signals and as a shield to prevent interference between these and external electrical signals. Located between the bottom layer and the top layer, the middle layer may transmit desired signals through the flexible cable. The material selection and specifics of each of the layers should be selected so as to achieve a balance in which the desired electrical impedance and mechanical flexibility requirements are met. The cable may also include one or more vias connecting the bottom layer to the top layer, providing shielding all the way around the flex cable. An additional conductive sock may be used to improve shielding effectiveness of the top and bottom layer and to connect to I/O connector shells and the system Faraday cage.
    Type: Application
    Filed: August 29, 2008
    Publication date: July 9, 2009
    Applicant: Apple Inc.
    Inventors: John Brock, Brett William Degner, Dinesh Mathew, Thomas W. Wilson, JR., Chris Ligtenberg, Keith Hendren, Steven Keiper, Eugene Kim
  • Patent number: D709878
    Type: Grant
    Filed: June 9, 2012
    Date of Patent: July 29, 2014
    Assignee: Apple Inc.
    Inventors: Jody Akana, Bartley K. Andre, Jeremy Bataillou, Daniel J. Coster, Laura Michelle Deforest, Daniele De Iuliis, Adam Terence Garelli, Joss Giddings, Bradley Joseph Hamel, M. Evans Hankey, Keith Hendren, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Duncan Robert Kerr, Dinesh Cherian Mathew, Bryan William Posner, Matthew Dean Rohrbach, Peter Russell-Clarke, Mikael Silvanto, Christopher J. Stringer, Eugene Antony Whang, Rico Zorkendorfer
  • Patent number: D805410
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: December 19, 2017
    Assignee: DSI Assignments, LLC
    Inventors: Keith Hendren, Waylon Chen, Nick Rundle, John Brock, Joseph Fisher, Tyler Mincey, Bryson Gardner, Scott Croyle, Bret Recor, Seth Murray, Merric French