Abstract: The disclosed apparatus may include (1) a split heatsink assembly that comprises (A) a first heatsink that includes a base for thermally coupling to a first heat-emitting component, wherein the base of the first heatsink forms an opening, and (B) a second heatsink that includes a pedestal for thermally coupling to a second heat-emitting component, wherein the pedestal of the second heatsink fits into the opening formed by the base of the first heatsink, and (2) an EMI absorber that at least partially encompasses the pedestal of the second heatsink and resides between the pedestal of the second heatsink and the base of the first heatsink in the opening. Various other apparatuses, systems, and methods are also disclosed.

Abstract: The disclosed apparatus may include (1) a cage designed to house an optical transceiver module, wherein the cage includes (A) an entry side that forms an opening for installation and removal of the optical transceiver module and (B) a back side opposite the entry side and (2) an EMI absorber coupled to the back side of the cage to limit an amount of radiated energy that escapes the cage during operation of the optical transceiver module. Various other apparatuses, systems, and methods are also disclosed.

Abstract: The disclosed apparatus may include (1) at least one receptacle that (A) is coupled to a line card that facilitates communication among computing devices and (B) mates with at least one member coupled to a backplane of a telecommunications system to physically support the line card upon installation in the telecommunications system and (2) at least one spring that (A) is coupled to the receptacle and (B) applies, when the member is inserted into the receptacle, a force on the member to lift the line card in an upward direction. Various other apparatuses, systems, and methods are also disclosed.