Patents by Inventor Keith J. Margolin
Keith J. Margolin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160079023Abstract: An electrically conductive element, including an insulator and a first conductor, is provided, which can be affixed to a second conductor consisting of conductive structural element, wherein the insulator is positioned between the first and second conductors to electrically isolate them. A power supply may be connected between the first and second conductors to provide power thereto, and an electrical device may be connected across the first and second conductors.Type: ApplicationFiled: November 20, 2015Publication date: March 17, 2016Inventors: Daniel Boss, Scott Qualls, David Mcdonald, Terrance Z. Kaiserman, Keith J. Margolin, Michael Wassief, Liang Chai
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Patent number: 9208924Abstract: An electrically conductive element, including an insulator and a first conductor, is provided, which can be affixed to a second conductor consisting of conductive structural element, wherein the insulator is positioned between the first and second conductors to electrically isolate them. A power supply may be connected between the first and second conductors to provide power thereto, and an electrical device may be connected across the first and second conductors.Type: GrantFiled: September 2, 2009Date of Patent: December 8, 2015Assignee: T+ink, Inc.Inventors: Daniel Boss, Scott Qualls, David McDonald, Terrance Z. Kaiserman, Keith J. Margolin, Michael Wassief, Liang Chai
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Patent number: 8441156Abstract: An electrically conductive module is provided. The module includes a panel configured to engage with one or more conductive structural elements. The module further includes conductive layers formed on or in the panel. Each conductive layer has a terminal configured to be in electrical communication with at least one of the conductive structural elements. In one embodiment of the present invention, a first terminal is configured to be in electrical communication with a first conductive structural element and a second terminal is configured to be in electrical communication with a second conductive structural element. In another embodiment of the present invention, both a first terminal and a second terminal are configured to be in electrical communication with a first conductive structural element. In this embodiment, the first and second terminals are respectively configured to be in electrical communication with first and second conductive portions of the first conductive structural element.Type: GrantFiled: September 2, 2009Date of Patent: May 14, 2013Assignee: T-Ink, Inc.Inventors: Daniel Boss, Scott Qualls, Terrance Z. Kaiserman, Keith J. Margolin, Michael Wassief, Liang Chai
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Publication number: 20100170702Abstract: An electrically conductive module is provided. The module includes a panel configured to engage with one or more conductive structural elements. The module further includes conductive layers formed on or in the panel. Each conductive layer has a terminal configured to be in electrical communication with at least one of the conductive structural elements. In one embodiment of the present invention, a first terminal is configured to be in electrical communication with a first conductive structural element and a second terminal is configured to be in electrical communication with a second conductive structural element. In another embodiment of the present invention, both a first terminal and a second terminal are configured to be in electrical communication with a first conductive structural element. In this embodiment, the first and second terminals are respectively configured to be in electrical communication with first and second conductive portions of the first conductive structural element.Type: ApplicationFiled: September 2, 2009Publication date: July 8, 2010Applicant: USG INTERIORS, INC.Inventors: Daniel Boss, Scott Qualls, Terrance Z. Kaiserman, Keith J. Margolin, Michael Wassief, Liang Chai
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Publication number: 20100170616Abstract: An electrically conductive tape for walls and ceilings is provided. The tape includes a substrate configured to be applied to at least one surface including at least one surface of a wall or ceiling and at least one conductive layer applied to the substrate. The conductive layer is penetrable by at least a conductor of an electrical device to provide an electrical connection thereto. In one embodiment the conductive layer is formed from a conductive composition including an electrically conductive material therein. The conductive composition can include a conductive ink. A method of manufacturing an electrically conductive tape or film for walls and ceilings is also provided. The method includes providing a conductive composition including an electrically conductive material therein, and providing a substrate configured to be applied to at least one surface including at least one surface of a wall or ceiling.Type: ApplicationFiled: September 2, 2009Publication date: July 8, 2010Applicant: USG INTERIORS, INC.Inventors: Daniel Boss, David McDonald, Terrance Z. Kaiserman, Keith J. Margolin, Michael Wassief, Liang Chai
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Publication number: 20100156196Abstract: An electrically conductive element, including an insulator and a first conductor, is provided, which can be affixed to a second conductor consisting of conductive structural element, wherein the insulator is positioned between the first and second conductors to electrically isolate them. A power supply may be connected between the first and second conductors to provide power thereto, and an electrical device may be connected across the first and second conductors.Type: ApplicationFiled: September 2, 2009Publication date: June 24, 2010Applicant: USG INTERIORS, INC.Inventors: Daniel Boss, Scott Qualls, David McDonald, Terrance Z. Kaiserman, Keith J. Margolin, Michael Wassief, Liang Chai
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Patent number: 6641860Abstract: Methods of manufacturing printed circuit boards are disclosed. The methods utilize various printing techniques to apply conductive compositions to substrates in the creation of printed circuit boards. The method of manufacturing printed circuit board comprises the step of applying conductive composition to a substrate through a cold welding process.Type: GrantFiled: January 3, 2001Date of Patent: November 4, 2003Assignee: T-Ink, L.L.C.Inventors: Terrance Z. Kaiserman, Keith J. Margolin
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Patent number: 6311350Abstract: A fabric article including a design arranged on the outer surface of such fabric article and having conductive composition arranged in registration with the design and with a printed circuit pattern is disclosed. The conductive composition effectively forms part of the electrical system of the interactive fabric article.Type: GrantFiled: August 12, 1999Date of Patent: November 6, 2001Assignee: Ferber Technologies, L.L.C.Inventors: Terrance Z. Kaiserman, Keith J. Margolin
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Patent number: 5411789Abstract: A composition is disclosed which forms a bend sensor when coated on a flexible substrate. A bend sensor prepared from the composition is also disclosed. The composition contains a brittle binder which cracks under a stress, electrically conductive elements and a graphite additive which stabilizes the degree of cracking. The composition forms a bend sensor which upon a change in degree of flexing produces an electrical signal in the form of a change in resistance in circuits which include the sensor.Type: GrantFiled: February 26, 1992Date of Patent: May 2, 1995Assignee: National Starch and Chemical Investment Holding CorporationInventor: Keith J. Margolin
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Patent number: 5250227Abstract: A composition is disclosed which forms a bend sensor when coated on a flexible substrate. A bend sensor prepared from the composition is also disclosed. The composition contains a brittle binder which cracks under a stress, electrically conductive elements and a graphite additive which stabilizes the degree of cracking. The composition forms a bend sensor which upon a change in degree of flexing produces an electrical signal in the form of a change in resistance in circuits which include the sensor.Type: GrantFiled: May 3, 1990Date of Patent: October 5, 1993Assignee: National Starch and Chemical Investment Holding CorporationInventor: Keith J. Margolin