Patents by Inventor Keith J. Whitlaw

Keith J. Whitlaw has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tin plating method
    Patent number: 7695605
    Abstract: A method for plating tin or a tin alloy on a substrate such that whiskers are prevented form forming or the number of whickers is reduced in number as well as size.
    Type: Grant
    Filed: May 12, 2004
    Date of Patent: April 13, 2010
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Keith J. Whitlaw, Michael P. Toben, André Egli, Jeffrey N. Crosby, Craig S. Robinson
  • Alloy composition and plating method
    Publication number: 20020166774
    Abstract: Disclosed are electrolyte compositions for depositing tin-copper alloys that are substantially free of lead. Also disclosed are methods of plating tin-copper alloys that are substantially free of lead on substrates and uses for such plated substrates.
    Type: Application
    Filed: September 20, 2001
    Publication date: November 14, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: Robert A. Schetty, Michael P. Toben, James L. Martin, Neil D. Brown, Jeffrey N. Crosby, Keith J. Whitlaw
  • Process for metallizing a through-hole board
    Patent number: 5106473
    Abstract: A process is provided for metallizing the hole-wall surface of a through-hole provided in a printed circuit board precursor. In an initial step, the hole-wall surface is pre-treated with an oxidizing agent which micro-roughens it. An electro-conductive polymer film is then formed on the micro-roughened surface by oxidatively polymerizing in situ an acidic solution of an organic monomer with an oxidizing agent previously adsorbed on the board. The polymer film includes dopant anions which are acquired from the monomer solution. Finally, a metal layer is electroplated on the electro-conductive polymer film.
    Type: Grant
    Filed: May 3, 1991
    Date of Patent: April 21, 1992
    Assignee: LeaRonal, Inc.
    Inventors: Keith J. Whitlaw, Mark Goodenough
  • Plating baths and methods for electro-deposition of gold or gold alloys
    Patent number: 4591415
    Abstract: Aqueous acid gold or gold alloy baths containing a substituted pyridine carboxylic acid, pyridine thiol, quinoline carboxylic acid, quinoline thiol, or a derivative or mixtures thereof, as an additive and methods of using such baths.
    Type: Grant
    Filed: June 11, 1985
    Date of Patent: May 27, 1986
    Assignee: LeaRonal, Inc.
    Inventor: Keith J. Whitlaw