Patents by Inventor Keith Lao

Keith Lao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-level stack having multi-level contact and method
    Patent number: 10566234
    Abstract: A method for forming a multi-level stack having a multi-level contact is provided. The method includes forming a multi-level stack comprising a specified number, n, of conductive layers and at least n?1 insulating layers. A via formation layer is formed over the stack. A first via is etched in the via formation layer at a first edge of the stack. A first multi-level contact is formed in the first via. For a particular embodiment, a second via may be etched in the via formation layer at a second edge of the stack and a second multi-level contact may be formed in the second via.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: February 18, 2020
    Assignees: Samsung Austin Semiconductor, LLC, Samsung Electronics Co., Ltd.
    Inventor: Keith Lao
  • MULTI-LEVEL STACK HAVING MULTI-LEVEL CONTACT AND METHOD
    Publication number: 20150357237
    Abstract: A method for forming a multi-level stack having a multi-level contact is provided. The method includes forming a multi-level stack comprising a specified number, n, of conductive layers and at least n-1 insulating layers. A via formation layer is formed over the stack. A first via is etched in the via formation layer at a first edge of the stack. A first multi-level contact is formed in the first via. For a particular embodiment, a second via may be etched in the via formation layer at a second edge of the stack and a second multi-level contact may be formed in the second via.
    Type: Application
    Filed: August 17, 2015
    Publication date: December 10, 2015
    Inventor: Keith Lao
  • Multi-level stack having multi-level contact and method
    Patent number: 9111998
    Abstract: A method for forming a multi-level stack having a multi-level contact is provided. The method includes forming a multi-level stack comprising a specified number, n, of conductive layers and at least n?1 insulating layers. A via formation layer is formed over the stack. A first via is etched in the via formation layer at a first edge of the stack. A first multi-level contact is formed in the first via. For a particular embodiment, a second via may be etched in the via formation layer at a second edge of the stack and a second multi-level contact may be formed in the second via.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: August 18, 2015
    Assignees: Samsung Electronics Co., Ltd, Samsung Austin Semiconductor L.P.
    Inventor: Keith Lao
  • Removable transparent membrane for a pellicle
    Patent number: 8586267
    Abstract: According to one embodiment, a pellicle includes first and second frame members that are selectively removable from one another. The second frame member has an annular shape similar to and is physically coupled to an outer periphery of a transparent membrane. The second frame member configured to be selectively coupled to the first frame member from a engaged position adjacent to the first frame member to a disengaged position in which the second frame member is separated from the first frame member.
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: November 19, 2013
    Assignees: Samsung Austin Semiconductor, L.P., Samsung Electronics Co., Ltd.
    Inventor: Keith Lao
  • MULTI-LEVEL STACK HAVING MULTI-LEVEL CONTACT AND METHOD
    Publication number: 20130264717
    Abstract: A method for forming a multi-level stack having a multi-level contact is provided. The method includes forming a multi-level stack comprising a specified number, n, of conductive layers and at least n?1 insulating layers. A via formation layer is formed over the stack. A first via is etched in the via formation layer at a first edge of the stack. A first multi-level contact is formed in the first via. For a particular embodiment, a second via may be etched in the via formation layer at a second edge of the stack and a second multi-level contact may be formed in the second via.
    Type: Application
    Filed: April 4, 2012
    Publication date: October 10, 2013
    Applicant: Samsung Austin Semiconductor
    Inventor: Keith Lao
  • REMOVABLE TRANSPARENT MEMBRANE FOR A PELLICLE
    Publication number: 20130065160
    Abstract: According to one embodiment, a pellicle includes first and second frame members that are selectively removable from one another. The second frame member has an annular shape similar to and is physically coupled to an outer periphery of a transparent membrane. The second frame member configured to be selectively coupled to the first frame member from a engaged position adjacent to the first frame member to a disengaged position in which the second frame member is separated from the first frame member.
    Type: Application
    Filed: September 12, 2011
    Publication date: March 14, 2013
    Applicants: Samsung Electronics Co., Ltd., Samsung Austin Semiconductor, L.P.
    Inventor: Keith Lao