Abstract: Apparatus for automatically placing a lid on a component package and then securing the lid with a clip. The apparatus includes a programmable robot arm having a gripping assembly, an inspection station, a first conveyor for conveying a boat along a path between a first position and a second position, a pick arm for removing a first lid from a lid feeder station, a second conveyor for reciprocating the pick arm between first and second positions to thereby transfer the first lid from the lid feeder station to the inspection station, and a camera located at the inspection station for inspecting the first lid. The apparatus further includes a rotary actuator arm and a mechanism for reciprocating the rotary actuator arm into contact with a first lid bottom surface following inspection of the first lid and for releasing the pick arm.

Abstract: A system and method for polishing the edges of a plurality of semiconductor wafers rotates a stack of wafers against a polish one or more pads such that both the wafer edges and the sides of the edges are polished to a mirror finish. The polish pad has a series of grooves through which the wafer edges are passed to polish the sides of the wafer edges, or two pads are used, one with grooves and one without grooves.

Abstract: A method for polishing the edges of a plurality of semiconductor wafers rotates a stack of wafers against a polish one or more pads such that both the wafer edges and the sides of the edges are polished to a mirror finish. The polish pad has a series of grooves through which the wafer edges are passed to polish the sides of the wafer edges, or two pads are used, one with grooves and one without grooves.