Abstract: A stacked jack multi-port shielded and magnetically conditioned connector assembly is provided having a multi-port electrical connector housing having a plurality of housing ports adjacent a mating face thereof. A shield member comprises a base shield portion and sidewall portions extending from side edges of the base shield portion. The sidewall portions extend in opposite directions from the base shield portion. A plurality of modular connector subassemblies are adapted for stacking with the base shield portion positioned therebetween, and with one of the shield sidewall portions positioned against a side of one of the housings and the other shield sidewall portion is positioned against a side of the other housing.

Abstract: A stacked jack multi-port shielded and magnetically conditioned connector assembly is provided for assembly in three distinct configurations. One configuration is where power over ethernet is not required, but rather modular jack contacts are directly connected to a motherboard. A second configuration, the connector assembly can be configured to be enabled to receive conditioned and controlled electrical signals to the connector, whereby power over ethernet may be provided through designated ones of the modular jack contacts. Alternatively, the connector can be configured for an integrated power over ethernet card, where the device is provided as an integrated assembly.

Abstract: A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. The molded inserts are receivable in the apertures of the substrate and are later swaged to retain them and the contacts to the substrate.

Abstract: A contact is provided for use in a land grid array (LGA) socket. The contact includes a support body defining a support body plane. The support body is configured to be held in a hole in an LGA socket and has opposed side edges. The contact also includes a contact beam having a base portion projecting from one of the side edges. The base portion extends along a base axis and has an upper end joined at a deflectable bend with an outer portion of the contact beam. The outer portion is configured to have surface mounted thereon an adjoining contact, and the outer portion projects from the bend at a first angle with respect to the base axis and at a second angle with respect to the support body plane.

Abstract: A small form-factor (SFP) module for insertion into an SFP cage having a spring latch is provided. The SFP module has a housing with an open ended chamber configured to accept a plug. A latch tab is formed on and projects outward from a wall of the housing. The latch tab securely engages the spring latch when the SFP cage and module are engaged with one another. The SFP module also includes a pull release mounted to the housing which is slidable along a range of motion. The pull release has a release member extending outward from a body. The release member moves along a side of the latch tab to a fully released position to disengage the spring latch from the latch tab.

Abstract: A socket is shown for interconnecting a chip to a printed circuit board, where the socket is comprised of a housing and a substrate. The substrate is of the type comprising a plurality of wire leads extending upwardly from the substrate, and which are interconnected to solder balls on the opposite side of the substrate. The housing has a plurality of slots therethrough, such that the substrate can be positioned on the lower side of the housing with the resilient leads extending upwardly in the slots. A chip receiving face is positioned on the opposite side of the housing for contacting the resilient leads of the substrate. The housing includes resilient arms on opposite sides of the housing, which grip the substrate and which maintain the housing in a resiliently biased position above the substrate, such that the leads remain in their respective slots.

Abstract: A small form-factor (SFP) module for insertion into an SFP cage having a spring latch is provided. The SFP module has a housing with an open ended chamber configured to accept a plug. A latch tab is formed on and projects outward from a wall of the housing. The latch tab securely engages the spring latch when the SFP cage and module are engaged with one another. The SFP module also includes a pull release mounted to the housing which is slidable along a range of motion. The pull release has a release member extending outward from a body. The release member moves along a side of the latch tab to a fully released position to disengage the spring latch from the latch tab.

Abstract: A contact is provided for use in a land grid array (LGA) socket. The contact includes a support body defining a support body plane. The support body is configured to be held in a hole in an LGA socket and has opposed side edges. The contact also includes a contact beam having a base portion projecting from one of the side edges. The base portion extends along a base axis and has an upper end joined at a deflectable bend with an outer portion of the contact beam. The outer portion is configured to have surface mounted thereon an adjoining contact, and the outer portion projects from the bend at a first angle with respect to the base axis and at a second angle with respect to the support body plane.

Abstract: A socket is shown for interconnecting a chip to a printed circuit board, where the socket is comprised of a housing and a substrate. The substrate is of the type comprising a plurality of wire leads extending upwardly from the substrate, and which are interconnected to solder balls on the opposite side of the substrate. The housing has a plurality of slots therethrough, such that the substrate can be positioned on the lower side of the housing with the resilient leads extending upwardly in the slots. A chip receiving face is positioned on the opposite side of the housing for contacting the resilient leads of the substrate. The housing includes resilient arms on opposite sides of the housing, which grip the substrate and which maintain the housing in a resiliently biased position above the substrate, such that the leads remain in their respective slots.