Abstract: A system for positioning a tool or a component on a workpiece may include a laser configured to project a laser point on the workpiece. The laser may include a field of view and the laser may project the laser point upon objects within the field of view of the laser. The system for positioning a tool on a workpiece may also include a fixture configured to position the tool on the workpiece. The fixture may include a laser indicator configured to be aligned with the laser point projected on the workpiece. The fixture may also include a first tool receptacle configure to receive the tool and locate the tool on a portion of the workpiece outside the field of view of the laser.

Abstract: A system for positioning a tool or a component on a workpiece may include a laser configured to project a laser point on the workpiece. The laser may include a field of view and the laser may project the laser point upon objects within the field of view of the laser. The system for positioning a tool on a workpiece may also include a fixture configured to position the tool on the workpiece. The fixture may include a laser indicator configured to be aligned with the laser point projected on the workpiece. The fixture may also include a first tool receptacle configure to receive the tool and locate the tool on a portion of the workpiece outside the field of view of the laser.

Abstract: A dual-weave welding system is disclosed. The system may have a first welding device configured to create a weld joint in a gap between two or more work pieces by moving a first welding component along a first weaving path. The system may also have a second welding device configured to create the weld joint in the gap by moving a second welding component along a second weaving path. The system may further have a controller that sends commands to control the movement of the first welding device and the second welding device.

Abstract: A dual-weave welding system is disclosed. The system may have a first welding device configured to create a weld joint in a gap between two or more work pieces by moving a first welding component along a first weaving path. The system may also have a second welding device configured to create the weld joint in the gap by moving a second welding component along a second weaving path. The system may further have a controller that sends commands to control the movement of the first welding device and the second welding device.

Abstract: An Apparatus for Percussive Harmonic Musical Synthesis (APHAMS) which facilitates state-of-the-art musical expression, through generation of melodic sound, bearing well defined tone and note pitch, by the striking of uniquely configured multiple note activitation trigger mechanism surfaces, termed muzi-pads, with an appropriately sized mallet, stick, or other such similar playing implement, for the generation of a desired note, by a given MIDI device and which provides an enhanced emulation of the traditional tenor steelpan, in its interface with the player.

Abstract: An Apparatus for Percussive Harmonic Musical Synthesis (APHAMS) which facilitates state-of-the-art musical expression, through generation of melodic sound, bearing well defined tone and note pitch, by the striking of uniquely configured multiple note activitation trigger mechanism surfaces, termed muzi-pads, with an appropriately sized mallet, stick, or other such similar playing implement, for the generation of a desired note, by a given MIDI device and which provides an enhanced emulation of the traditional tenor steelpan, in its interface with the player.

Abstract: A chemical mechanical polishing (CMP) process using a chemically active slurry having a polarity selected to affect the relative oxidation rates of respective crystalline planes of a polycrystalline surface being polished. The slurry polarity is controlled to equilibrate the material removal rates from the respective crystalline planes during the CMP process. A polar solute may be added to a base solvent to achieve the desired polarity. A CMP process for a tungsten film may utilize a water-based slurry containing an abrasive agent, an oxidizing agent, and a solute having a polarity less than that of water. The abrasive agent may be colloidal silica, the oxidizing agent may be hydrogen peroxide, and the solute may be benzene.

Abstract: A chemical mechanical polishing (CMP) process using a chemically active slurry having a polarity selected to affect the relative oxidation rates of respective crystalline planes of a polycrystalline surface being polished. The slurry polarity is controlled to equilibrate the material removal rates from the respective crystalline planes during the CMP process. A polar solute may be added to a base solvent to achieve the desired polarity. A CMP process for a tungsten film may utilize a water-based slurry containing an abrasive agent, an oxidizing agent, and a solute having a polarity less than that of water. The abrasive agent may be colloidal silica, the oxidizing agent may be hydrogen peroxide, and the solute may be benzene.