Patents by Inventor Keith P. Brodock

Keith P. Brodock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing Z-axis interconnection assembly of printed wiring board elements
    Patent number: 7303639
    Abstract: A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.
    Type: Grant
    Filed: August 22, 2005
    Date of Patent: December 4, 2007
    Assignee: International Business Machines Corporation
    Inventors: Brian E. Curcio, Donald S. Farquhar, Lisa J. Jimarez, Keith P. Brodock
  • Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
    Patent number: 6969436
    Abstract: A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.
    Type: Grant
    Filed: August 13, 2003
    Date of Patent: November 29, 2005
    Assignee: International Business Machines Corporation
    Inventors: Brian E. Curcio, Donald S. Farquhar, Lisa J. Jimarez, Keith P. Brodock
  • Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
    Publication number: 20040084137
    Abstract: A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.
    Type: Application
    Filed: August 13, 2003
    Publication date: May 6, 2004
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Brian E. Curcio, Donald S. Farquhar, Lisa J. Jimarez, Keith P. Brodock
  • Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
    Patent number: 6638607
    Abstract: A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.
    Type: Grant
    Filed: October 30, 2002
    Date of Patent: October 28, 2003
    Assignee: International Business Machines Corporation
    Inventors: Brian E. Curcio, Donald S. Farquhar, Lisa J. Jimarez, Keith P. Brodock